Patents by Inventor Takuo ABE

Takuo ABE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11894195
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: February 6, 2024
    Assignee: TDK CORPORATION
    Inventors: Yoji Tozawa, Masashi Shimoyasu, Makoto Yoshino, Takuo Abe, Akihiko Oide, Tsutomu Ono, Shinichi Sato, Makoto Morita, Shinichi Sato, Hidekazu Sato
  • Patent number: 11631521
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: April 18, 2023
    Assignee: TDK CORPORATION
    Inventors: Yoji Tozawa, Takuo Abe, Yuma Ishikawa, Hidekazu Sato, Takashi Endo, Masashi Shimoyasu, Kazuma Takahashi
  • Publication number: 20220068565
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Application
    Filed: November 8, 2021
    Publication date: March 3, 2022
    Applicant: TDK CORPORATION
    Inventors: Yoji TOZAWA, Masashi SHIMOYASU, Makoto YOSHINO, Takuo ABE, Akihiko OIDE, Tsutomu ONO, Shinichi SATO, Makoto MORITA, Shinichi SATO, Hidekazu SATO
  • Patent number: 11227721
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: January 18, 2022
    Assignee: TDK CORPORATION
    Inventors: Yoji Tozawa, Masashi Shimoyasu, Makoto Yoshino, Takuo Abe, Akihiko Oide, Tsutomu Ono, Shinichi Sato, Makoto Morita, Shinichi Sato, Hidekazu Sato, Masashi Kitazaki, Naoki Uchida, Masahiro Kato
  • Publication number: 20190348212
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.
    Type: Application
    Filed: April 29, 2019
    Publication date: November 14, 2019
    Applicant: TDK CORPORATION
    Inventors: Yoji TOZAWA, Takuo ABE, Yuma ISHIKAWA, Hidekazu SATO, Takashi ENDO, Masashi SHIMOYASU, Kazuma TAKAHASHI
  • Patent number: 10340070
    Abstract: A multilayer common mode filter includes a first coil, a second coil and a third coil. The first coil includes a first coil conductor and a second coil conductor having spiral shapes and is configured by electrically connecting the first coil conductor and the second coil conductor. The second coil includes a third coil conductor and a fourth coil conductor having spiral shapes and is configured by electrically connecting the third coil conductor and the fourth coil conductor. The third coil includes a fifth coil conductor and a sixth coil conductor having spiral shapes and is configured by electrically connecting the fifth coil conductor and the sixth coil conductor. The first to sixth coil conductors are disposed in order of the first coil conductor, the third coil conductor, the fifth coil conductor, the second coil conductor, the fourth coil conductor, and the sixth coil conductor in a first direction.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: July 2, 2019
    Assignee: TDK CORPORATION
    Inventors: Takuo Abe, Makoto Yoshino
  • Publication number: 20180337001
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Application
    Filed: November 24, 2017
    Publication date: November 22, 2018
    Applicant: TDK CORPORATION
    Inventors: Yoji TOZAWA, Masashi SHIMOYASU, Makoto YOSHINO, Takuo ABE, Akihiko OIDE, Tsutomu ONO, Shinichi SATO, Makoto MORITA, Shinichi SATO, Hidekazu SATO, Masashi KITAZAKI, Naoki UCHIDA, Masahiro KATO
  • Publication number: 20180114624
    Abstract: A multilayer common mode filter includes a first coil, a second coil and a third coil. The first coil includes a first coil conductor and a second coil conductor having spiral shapes and is configured by electrically connecting the first coil conductor and the second coil conductor. The second coil includes a third coil conductor and a fourth coil conductor having spiral shapes and is configured by electrically connecting the third coil conductor and the fourth coil conductor. The third coil includes a fifth coil conductor and a sixth coil conductor having spiral shapes and is configured by electrically connecting the fifth coil conductor and the sixth coil conductor. The first to sixth coil conductors are disposed in order of the first coil conductor, the third coil conductor, the fifth coil conductor, the second coil conductor, the fourth coil conductor, and the sixth coil conductor in a first direction.
    Type: Application
    Filed: October 18, 2017
    Publication date: April 26, 2018
    Applicant: TDK CORPORATION
    Inventors: Takuo ABE, Makoto YOSHINO