Patents by Inventor Takuo KISAKI
Takuo KISAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145318Abstract: A package for accommodating an electronic component includes an insulating substrate, an external-connection conductor, and a corner conductor. The insulating substrate includes a first surface including a mount portion to receive an electronic component, a second surface opposite to the first surface, a first side surface connecting the first surface and the second surface, a second side surface connecting the first surface and the second surface and continuous with the first side surface, and a corner at which the first side surface and the second side surface intersect. The external-connection conductor is located on the second surface. The corner conductor extends from the external-connection conductor toward the corner at a gradually greater distance to the external-connection conductor and includes exposed portions exposed on the first side surface excluding the corner and on the second side surface excluding the corner.Type: ApplicationFiled: January 20, 2022Publication date: May 2, 2024Applicant: KYOCERA CorporationInventor: Takuo KISAKI
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Patent number: 11923288Abstract: To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.Type: GrantFiled: October 31, 2022Date of Patent: March 5, 2024Assignee: KYOCERA CorporationInventors: Takuo Kisaki, Takahiro Sasaki
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Publication number: 20230048595Abstract: To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.Type: ApplicationFiled: October 31, 2022Publication date: February 16, 2023Applicant: KYOCERA CorporationInventors: Takuo KISAKI, Takahiro SASAKI
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Patent number: 11515242Abstract: To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.Type: GrantFiled: December 27, 2018Date of Patent: November 29, 2022Assignee: KYOCERA CORPORATIONInventors: Takuo Kisaki, Takahiro Sasaki
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Patent number: 11394362Abstract: An electronic component housing package includes a base having a first principal face provided with a mounting section for mounting an electronic component; a frame having a second principal face, the frame being disposed on the base so as to surround the mounting section; a frame-shaped metallized layer disposed on the second principal face of the frame; and a side-surface conductor disposed on an inner side surface of the frame, the side-surface conductor connecting the frame-shaped metallized layer and a relay conductor formed on the first principal face, the side-surface conductor being covered with an insulating film from one end to the other end in a width direction of the side-surface conductor.Type: GrantFiled: June 29, 2019Date of Patent: July 19, 2022Assignee: KYOCERA CORPORATIONInventors: Takuo Kisaki, Masaki Suzuki
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Patent number: 11388819Abstract: A wiring board includes an insulating substrate, at least one external electrode disposed on a first surface of the insulating substrate, and wiring that is disposed in the insulating substrate and that is electrically connected to the at least one external electrode. The wiring includes a portion where an extension direction of the wiring is inclined relative to the first surface of the insulating substrate.Type: GrantFiled: January 24, 2019Date of Patent: July 12, 2022Assignee: KYOCERA CORPORATIONInventors: Takuo Kisaki, Keisuke Sawada
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Patent number: 11116077Abstract: A wiring board comprising an insulation substrate comprising a main surface and a penetrating portion that has an insulation property; and an external connection conductor, a portion of which is positioned in the insulation substrate and a different portion of which is exposed at the main surface, wherein the penetrating portion penetrates into the external connection conductor.Type: GrantFiled: January 23, 2019Date of Patent: September 7, 2021Assignee: KYOCERA CORPORATIONInventors: Takuo Kisaki, Keisuke Sawada
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Publication number: 20210045237Abstract: A wiring board comprising an insulation substrate comprising a main surface and a penetrating portion that has an insulation property; and an external connection conductor, a portion of which is positioned in the insulation substrate and a different portion of which is exposed at the main surface, wherein the penetrating portion penetrates into the external connection conductor.Type: ApplicationFiled: January 23, 2019Publication date: February 11, 2021Applicant: KYOCERA CorporationInventors: Takuo KISAKI, Keisuke SAWADA
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Patent number: 10832980Abstract: An electronic component housing package includes an insulating substrate having a first principal face and a second principal face opposing the first principal face; external connection conductors provided on the second principal face; and connection conductors provided so as to extend from outer peripheral ends of the external connection conductors to outer peripheral ends of the insulating substrate, respectively. The connection conductors are provided so as to be curved convexly toward a first principal face side over a range from the outer peripheral ends of the external connection conductors to the outer peripheral ends of the insulating substrate in a vertical cross-sectional view of the electronic component housing package and so that a distance from each of the connection conductors to the second principal face is gradually increased in a thickness direction of the insulating substrate. Insulating bodies are provided so as to cover the connection conductors, respectively.Type: GrantFiled: July 11, 2019Date of Patent: November 10, 2020Assignee: KYOCERA CORPORATIONInventors: Takuo Kisaki, Masaki Suzuki
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Publication number: 20200352029Abstract: A wiring board includes an insulating substrate, at least one external electrode disposed on a first surface of the insulating substrate, and wiring that is disposed in the insulating substrate and that is electrically connected to the at least one external electrode. The wiring includes a portion where an extension direction of the wiring is inclined relative to the first surface of the insulating substrate.Type: ApplicationFiled: January 24, 2019Publication date: November 5, 2020Applicant: KYOCERA CorporationInventors: Takuo KISAKI, Keisuke SAWADA
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Publication number: 20200335433Abstract: To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.Type: ApplicationFiled: December 27, 2018Publication date: October 22, 2020Applicant: KYOCERA CorporationInventors: Takuo KISAKI, Takahiro SASAKI
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Publication number: 20190333831Abstract: An electronic component housing package includes an insulating substrate having a first principal face and a second principal face opposing the first principal face; external connection conductors provided on the second principal face; and connection conductors provided so as to extend from outer peripheral ends of the external connection conductors to outer peripheral ends of the insulating substrate, respectively. The connection conductors are provided so as to be curved convexly toward a first principal face side over a range from the outer peripheral ends of the external connection conductors to the outer peripheral ends of the insulating substrate in a vertical cross-sectional view of the electronic component housing package and so that a distance from each of the connection conductors to the second principal face is gradually increased in a thickness direction of the insulating substrate. Insulating bodies are provided so as to cover the connection conductors, respectively.Type: ApplicationFiled: July 11, 2019Publication date: October 31, 2019Applicant: KYOCERA CorporationInventors: Takuo KISAKI, Masaki SUZUKI
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Publication number: 20190326877Abstract: An electronic component housing package includes a base having a first principal face provided with a mounting section for mounting an electronic component; a frame having a second principal face, the frame being disposed on the base so as to surround the mounting section; a frame-shaped metallized layer disposed on the second principal face of the frame; and a side-surface conductor disposed on an inner side surface of the frame, the side-surface conductor connecting the frame-shaped metallized layer and a relay conductor formed on the first principal face, the side-surface conductor being covered with an insulating film from one end to the other end in a width direction of the side-surface conductor.Type: ApplicationFiled: June 29, 2019Publication date: October 24, 2019Applicant: KYOCERA CorporationInventors: Takuo KISAKI, Masaki SUZUKI
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Patent number: 10381281Abstract: An electronic component housing package includes an insulating substrate having a first principal face and a second principal face opposing the first principal face; external connection conductors provided on the second principal face; and connection conductors provided so as to extend from outer peripheral ends of the external connection conductors to outer peripheral ends of the insulating substrate, respectively. The connection conductors are provided so as to be curved convexly toward a first principal face side over a range from the outer peripheral ends of the external connection conductors to the outer peripheral ends of the insulating substrate in a vertical cross-sectional view of the electronic component housing package and so that a distance from each of the connection conductors to the second principal face is gradually increased in a thickness direction of the insulating substrate. Insulating bodies are provided so as to cover the connection conductors, respectively.Type: GrantFiled: January 19, 2017Date of Patent: August 13, 2019Assignee: KYOCERA CORPORATIONInventors: Takuo Kisaki, Masaki Suzuki
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Patent number: 10355665Abstract: An electronic component housing package includes a base having a first principal face provided with a mounting section for mounting an electronic component; a frame having a second principal face, the frame being disposed on the base so as to surround the mounting section; a frame-shaped metallized layer disposed on the second principal face of the frame; and a side-surface conductor disposed on an inner side surface of the frame, the side-surface conductor connecting the frame-shaped metallized layer and a relay conductor formed on the first principal face, the side-surface conductor being covered with an insulating film from one end to the other end in a width direction of the side-surface conductor.Type: GrantFiled: November 17, 2016Date of Patent: July 16, 2019Assignee: Kyocera CorporationInventors: Takuo Kisaki, Masaki Suzuki
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Publication number: 20190043770Abstract: An electronic component housing package includes an insulating substrate having a first principal face and a second principal face opposing the first principal face; external connection conductors provided on the second principal face; and connection conductors provided so as to extend from outer peripheral ends of the external connection conductors to outer peripheral ends of the insulating substrate, respectively. The connection conductors are provided so as to be curved convexly toward a first principal face side over a range from the outer peripheral ends of the external connection conductors to the outer peripheral ends of the insulating substrate in a vertical cross-sectional view of the electronic component housing package and so that a distance from each of the connection conductors to the second principal face is gradually increased in a thickness direction of the insulating substrate. Insulating bodies are provided so as to cover the connection conductors, respectively.Type: ApplicationFiled: January 19, 2017Publication date: February 7, 2019Applicant: KYOCERA CorporationInventors: Takuo KISAKI, Masaki SUZUKI
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Publication number: 20180358949Abstract: An electronic component housing package includes a base having a first principal face provided with a mounting section for mounting an electronic component; a frame having a second principal face, the frame being disposed on the base so as to surround the mounting section; a frame-shaped metallized layer disposed on the second principal face of the frame; and a side-surface conductor disposed on an inner side surface of the frame, the side-surface conductor connecting the frame-shaped metallized layer and a relay conductor formed on the first principal face, the side-surface conductor being covered with an insulating film from one end to the other end in a width direction of the side-surface conductor.Type: ApplicationFiled: November 17, 2016Publication date: December 13, 2018Applicant: KYOCERA CorporationInventors: Takuo KISAKI, Masaki SUZUKI