Patents by Inventor Takuo Nakatsuka

Takuo Nakatsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin adduct combined with a borate ester and phenolic compound
    Patent number: 5464910
    Abstract: An epoxy resin composition having high epoxy curing property and sufficient storage stability, and an epoxy curing agent therefor. The curing agent or the cure accelerating agent obtained by treating the surfaces of (1) an epoxy adduct obtained by adding a nitrogen-containing heterocyclic compound, an aliphatic amine or an aromatic amine to an epoxy compound having one, two or more epoxy groups in one molecule, with (2) a boric acid compound or (3) a boric acid compound and a phenolic compound, exhibits high curing property and storage stability, and can be favorably used as a curing agent for the epoxy resin composition. The epoxy resin composition prepared by mixing the epoxy resin with (1) and (2) or (1) and (3), exhibits excellent curing property and storage stability.
    Type: Grant
    Filed: December 22, 1993
    Date of Patent: November 7, 1995
    Assignee: Shikoku Chemicals Corporation
    Inventors: Takuo Nakatsuka, Tsuyoshi Toyota, Mie Tanimoto, Akiko Matsumoto