Patents by Inventor Takuo Yoshida

Takuo Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11060577
    Abstract: A friction material containing a fiber base material, a binder, an organic filler, and an inorganic filler, wherein the copper content in the friction material in terms of elemental copper is 0.5% by weight or less relative to the whole friction material, and a particulate or fibrous aluminum alloy and zinc oxide are contained as the inorganic filler.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: July 13, 2021
    Assignee: ADVICS CO., LTD
    Inventors: Yuta Koike, Takuo Yoshida
  • Publication number: 20190376573
    Abstract: A friction material containing a fiber base material, a binder, an organic filler, and an inorganic filler, wherein the copper content in the friction material in terms of elemental copper is 0.5% by weight or less relative to the whole friction material, and a particulate or fibrous aluminum alloy and zinc oxide are contained as the inorganic filler.
    Type: Application
    Filed: March 15, 2018
    Publication date: December 12, 2019
    Applicant: ADVICS CO., LTD.
    Inventors: Yuta KOIKE, Takuo YOSHIDA
  • Publication number: 20090309918
    Abstract: A fluid ejecting apparatus includes: a plurality of ejection heads having ejection nozzles through which fluid is ejected; cap members that are provided so as to correspond to the ejection heads and form sealed spaces around the ejection nozzles in the ejection heads when brought into contact with the ejection heads; cap-member moving mechanisms that press the cap members against the corresponding ejection heads; a fluid suction unit that, while the cap members are pressed against the corresponding ejection heads, produces negative pressure in the sealed space of a selected ejection head to suck the fluid in the ejection head; cap-member selective-separation mechanisms that selectively separate the cap member from the corresponding ejection head having undergone suction; and a selective wiping mechanism that selectively wipes off the fluid deposited around the ejection nozzles in the ejection head separated from the corresponding cap member.
    Type: Application
    Filed: June 15, 2009
    Publication date: December 17, 2009
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Takuo Yoshida, Nobuhito Takahashi
  • Patent number: 6153301
    Abstract: A mica tape formed by a paper-making process from a mixture of the mica particles and at least one selected from the group consisting of a short fiber made of a nitrogen-free organic material and a short fiber made of an inorganic material, and an insulated coil by winding the mica tape around a conductive coil and impregnating the mica tape with a solventless thermo-setting resin. The short fiber has an average diameter of 0.1 to 20 .mu.m and an average length of 0.5 to 10 mm.
    Type: Grant
    Filed: October 21, 1997
    Date of Patent: November 28, 2000
    Assignees: Kabushiki Kaisha Toshiba, Nippon Rika Kogyosho Co., Ltd.
    Inventors: Noriyuki Iwata, Hisayasu Mitsui, Hiroshi Hatano, Hideaki Nakatsu, Takuo Yoshida