Abstract: To enhance the degree of design freedom of an outermost conductor layer in an electronic component embedded substrate. An electronic component embedded substrate includes conductor layers, insulating layers each of which is positioned between adjacent two of the conductor layers, and an electronic component embedded in the insulating layer. The conductor layer is positioned in the uppermost layer and includes a plurality of terminal electrodes exposed to one surface side. The insulating layers are each made of a core material obtained by impregnating a core with a resin material, while the insulating layers are made of a resin material not containing a core. Since the insulating layer is made of a resin material not containing a core, the diameter of a via conductor formed in the insulating layer can be reduced. Thus, even when the plurality of terminal electrodes are formed in the conductor layer with a small pitch, the routing distance of wires can be reduced.

Abstract: A time-of-flight mass spectrometry device includes an electrode to which a DC high voltage is applied in order to form an ion flight space and a high voltage power supply device that applies the high voltage to the electrode. The high voltage power supply device includes a high voltage generating circuit that generates the high voltage, and a voltage control circuit that is selectively set to a convergence responsiveness priority mode in which the high voltage generating circuit is controlled such that the high voltage has first convergence responsiveness and first stability or a stability priority mode in which the high voltage generating circuit is controlled such that the high voltage has second convergence responsiveness that is lower than the first convergence responsiveness and second stability that is higher than the first stability.

Abstract: A resistance spot welded joint of an aluminum material is obtained by joining a stack of a plurality of aluminum materials by spot welding. A nugget formed by the spot welding includes a solidified part of the aluminum materials and a shell having a different solidification structure from the solidified part. The shell is formed annularly in a cross-section of the nugget in a stacking direction of the aluminum materials. The solidified part and the shell are alternately arranged from an outer edge of the nugget toward a nugget central part.

Abstract: A method for producing an aluminum joined body includes a step of forming a flare joint by using a first aluminum member and a second aluminum member; and a step of performing laser welding by irradiating a groove of the flare joint with a laser beam having a beam diameter of 0.8 to 3.5 mm while feeding a filler material to the groove, the filler material being made of an aluminum alloy containing, in percent by mass, 1.0% to 3.0% of Mg, 0.50% to 1.0% of Mn, 0.05% to 0.20% of Cr, and 0.05% to 0.20% of Ti, with the balance being aluminum and incidental impurities.

Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.

Abstract: A method for producing an aluminum joined body includes a step of forming a flare joint by using a first aluminum member and a second aluminum member; and a step of performing laser welding by irradiating a groove of the flare joint with a laser beam having a beam diameter of 0.8 to 3.5 mm while feeding a filler material to the groove, the filler material being made of an aluminum alloy containing, in percent by mass, 1.0% to 3.0% of Mg, 0.50% to 1.0% of Mn, 0.05% to 0.20% of Cr, and 0.05% to 0.20% of Ti, with the balance being aluminum and incidental impurities.

Abstract: A method for producing an aluminum joined body includes a step in which a second aluminum member is superimposed on a first aluminum member to form a lap joint, the second aluminum member having a higher electrical conductivity than the first aluminum member; and a beam welding step in which a high-energy beam is impinged on a side of the lap joint on which the second aluminum member is located in order to form a fusion-solidification zone that penetrates the lap joint.

Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.