Patents by Inventor Takuro Kamakura

Takuro Kamakura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming functional coating film between fine electric conductive circuits
    Patent number: 4873175
    Abstract: The present invention is for a method of forming a coating film used for filling the space between the color stripes for a color filter which is used for colorization of a liquid crystal display. In particular, the light-shielding electrodeposition coating is first formed in a transparent electric conductive circuit pattern so as to suppress the reaction of a photo-setting material against light which is to be applied to the electrodeposition coating.
    Type: Grant
    Filed: December 29, 1986
    Date of Patent: October 10, 1989
    Assignee: Shinto Paint Co., Ltd.
    Inventors: Tameyuki Suzuki, Takuro Kamakura
  • Flexible cicuit substrate with electroconductive adhesive layer and its production
    Patent number: 4844784
    Abstract: An electroconductive adhesive layer of high molecular weight resin having electroconductive particles disposed therein is electrodeposited selectively on only the electroconductive circuit povided on a flexible circuit substrate. The adhesive layer permits precise bonding of the coated circuit with an identical circuit provided on a second flexible circuit substrate.
    Type: Grant
    Filed: December 12, 1985
    Date of Patent: July 4, 1989
    Assignee: Shinto Paint Co., Ltd.
    Inventors: Tameyuki Suzuki, Takuro Kamakura
  • Method of forming functional films on fine transparent electric conductive circuit pattern and spaces thereof
    Patent number: 4812387
    Abstract: The present invention is for a method of forming a coating film used for filling the space between the color stripes for a color filter which is used for colorization of a liquid crystal display. In particular, the light-shielding electrodeposition coating is first formed in a transparent electric conductive circuit pattern so as to suppress the reaction of a photo-setting material against light which is to be applied to the electrodeposition coating.
    Type: Grant
    Filed: April 14, 1987
    Date of Patent: March 14, 1989
    Assignee: Shinto Paint Co., Ltd.
    Inventors: Tameyuki Suzuki, Junichi Yasukawa, Toyokazu Nomura, Kazuo Toda, Takuro Kamakura, Toshiaki Ota
  • Method for selectively bonding substrate having fine electroconductive pattern
    Patent number: 4676854
    Abstract: A method for selectively bonding a substrate having an electroconductive pattern to another substrate at selected portions of the pattern. An adhesive layer is formed on the selected portion of the pattern by the electrodeposition of a high molecular resin and the substrate is then bonded to the other substrate by means of the adhesive layer.
    Type: Grant
    Filed: December 12, 1985
    Date of Patent: June 30, 1987
    Assignee: Shinto Paint Co., Ltd.
    Inventors: Tameyuki Suzuki, Takuro Kamakura