Abstract: According to one embodiment, a ceramic package of which inner space is sealed by a ceramic base plate and a cover portion mounted on the ceramic base plate. The ceramic package has an image sensor, an element unit and a lead electrode. The image sensor and the element unit are mounted on the ceramic base plate. The lead electrode is formed on the ceramic base plate and electrically connected to the image sensor by a bonding wire. A surface on which the lead electrode is formed is the same as a surface on which the cover portion is mounted.

Abstract: There is disclosed a method for fabricating a camera module includes the steps of: disposing a camera module body inside of a die; filling the die with a resin blocking a light; curing the resin; and removing the camera module body and the resin from the die. Here, disposing the camera module body inside of the die is disposing the camera module body having a lens holder secured on a sensor board inside of the die in such a manner that the side surface of the camera module body is not brought into contact with the side surface of the die. Filling the die with the resin is covering the upper end of the die with a lid so as to closely enclose the inside of the die, followed by filling the die with the resin. Taking the camera module body and the resin from the die is taking, from the die, the camera module body and the resin formed around the camera module body in close contact.