Abstract: The present invention provides a laminate film for temporary bonding which is excellent in heat resistance, capable of providing a flat film even at the periphery of a substrate, and capable of making a semiconductor circuit formation substrate and a support substrate or a support film layer adhere to each other with one type of adhesive, and which can be peeled off at room temperature under mild conditions. The present invention provides a laminate film for temporary bonding, including at least three layers of (A) a protective film layer, (B) an adhesive layer, and (C) a support film layer, wherein the adhesive layer (B) contains at least a siloxane polymer represented by a specific general formula or a compound represented by a specific general formula.

Abstract: The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt % inclusive.

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

Abstract: The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt % inclusive.

Abstract: A resin with a favorable index of refraction and transparency even without using heavy atoms or inorganic oxide fine particles by means of a polymerizable monomer having a 1,3,5-triazine ring represented by formula 1. (In formula 1: A is a group represented by formula 2, (in formula 2: R1 represents a hydrogen atom or a methyl group, T represents an alkylene having 1-10 carbon atoms, and R2 represents O or NH), and B1 and B2 are each independently groups represented by formula 3, formula 4, or formula 5 (in formulas 3-5: R3, R4, and R5 represent an alkyl group having 1-10 carbon atoms, an aryl group, or an aryloxy group, n1 and n3 are integers from 0-5, and n2 is an integer from 0-7, however when there are at least two of each of R3, R4, and R5, these may be the same or different from each other).

Abstract: It is an object to provide a film having both high transparency and high heat resistance, and particularly a coating solution for forming a coating film from which an optical film can be produced. A triaroylbenzene-skeleton polymer in which a terminal of a polymer produced by polymerizing a compound of Formula [1] below is modified by a compound of Formula [2] below. A coating solution for forming a coating film, comprising the polymer. A film obtained from the coating solution for forming a coating film. In the formulae below, X1 is a divalent group of Formula [1a], Formula [1b], or Formula [1c] below (where Y1 and Y2 are independently a C1-2 alkylene group; n is an integer of 1 to 6; and m is an integer of 1 to 6), X2 is divalent benzene, thiophene, furan, or fluorine, and X3 is a hydrogen atom, a halogen atom, CF3, a C1-6 alkoxy group, or a C1-6 alkyl group.

Abstract: A resin with a favorable index of refraction and transparency even without using heavy atoms or inorganic oxide fine particles by means of a polymerizable monomer having a 1,3,5-triazine ring represented by formula 1. (In formula 1: A is a group represented by formula 2, (in formula 2: R1 represents a hydrogen atom or a methyl group, T represents an alkylene having 1-10 carbon atoms, and R2 represents O or NH), and B1 and B2 are each independently groups represented by formula 3, formula 4, or formula 5 (in formulas 3-5: R3, R4, and R5 represent an alkyl group having 1-10 carbon atoms, an aryl group, or an aryloxy group, n1 and n3 are integers from 0-5, and n2 is an integer from 0-7, however when there are at least two of each of R3, R4, and R5, these may be the same or different from each other).

Abstract: It is an object to provide a film having both high transparency and high heat resistance, and particularly a coating solution for forming a coating film from which an optical film can be produced. A triaroylbenzene-skeleton polymer in which a terminal of a polymer produced by polymerizing a compound of Formula [1] below is modified by a compound of Formula [2] below. A coating solution for forming a coating film, comprising the polymer. A film obtained from the coating solution for forming a coating film. In the formulae below, X1 is a divalent group of Formula [1a], Formula [1b], or Formula [1c] below (where Y1 and Y2 are independently a C1-2 alkylene group; n is an integer of 1 to 6; and m is an integer of 1 to 6), X2 is divalent benzene, thiophene, furan, or fluorine, and X3 is a hydrogen atom, a halogen atom, CF3, a C1-6 alkoxy group, or a C1-6 alkyl group.

Abstract: This invention provides a polymerizable liquid crystal compound having an ?-methylene-?-butyrolactone site (for example, a polymerizable liquid crystal compound represented by formula (Z2)) useful as a material for optically anisotropic films such as optical compensation films and multidomain films, for example, in polarizing plates and phase difference plates for use in display devices such as liquid crystal display devices, and a polymerizable liquid crystal composition using the same, and their polymer and film.