Abstract: A surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas. The surface modifying apparatus includes a processing vessel; a measuring unit; and a controller. The processing vessel is configured to accommodate the substrate therein. The measuring unit is configured to measure a value indicating an amount of moisture in the processing vessel. The controller is configured to determine whether or not bonding strength between the substrate and the another substrate, when it is assumed that the substrate modified in the processing vessel is bonded to the another substrate, is good based on the value indicating the amount of moisture in the processing vessel measured by the measuring unit.

Abstract: A surface modifying method of modifying a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas includes an adjusting process and a modifying process. In the adjusting process, an amount of moisture in a processing vessel is adjusted by supplying a humidified gas into the processing vessel allowed to accommodate the substrate therein. In the modifying process, the bonding surface of the substrate is modified by forming the plasma of the processing gas in the processing vessel in a state that the amount of moisture in the processing vessel is adjusted.

Abstract: A one-can heat-curable resin composition which comprises: (1) a polyester polyol having at least three functional groups; (2) an adduct of an epoxy resin with at least one member selected from the group consisting of an alkanol amine and a monovalent phenol; and (3) a blocked organic polyisocyanate or a blocked prepolymer having terminal NCO groups obtained by reaction of an organic polyisocyanate with an active hydrogen-containing compound, when used in the production of precoated metal, gives good coated plates, which can be advantageously used in manufacturing household electric appliances and so on.