Abstract: An optical element material which is obtained by curing a resin composition for photoimprinting containing a photocurable monomer (A) of the formula (1) and a photocurable monomer (B) of the formula (2) in a weight ratio of from 30/70 to 87/13, and containing a photopolymerization initiator (C) in a content of from 0.01 to 30 parts by weight per 100 parts by weight of the total weight of the monomer (A) and the monomer (B), and which has a shrinkage on curing of at most 4.5%, and a method for producing it: wherein R1 is —CH?CH2, —CH2CH2—O—CH?CH2, —CH2—C(CH3) ?CH2 or a glycidyl group; R2 and R3 are each independently hydrogen or a C1-4 alkyl group; R4 and R5 are each independently —O—CH?CH2, —O—CH2CH2—O—CH?CH2, —O—CO—CH?CH2, —O—CO—C(CH3)?CH2, —O—CH2CH2—O—CO—CH?CH2, —O—CH2CH2—O—CO—C(CH3)?CH2 or a glycidyl ether group; and R6 and R7 are each independently hydrogen or a C1-4 alkyl group.

Abstract: A resin composition for photoimprinting, a cured product of the resin composition which is excellent in etching and heat resistance, and a pattern forming process using the resin composition are provided. The resin composition contains photocurable monomer (A) containing at least one carbazole compound of formula (I): a photocurable monomer (B) containing at least one compound of the following formulae (II), (III), and (IV): and a photopolymerization initiator (C). The weight ratio of the photocurable monomer (A) to the photocurable monomer (B) is from 30/70 to 87/13.

Abstract: An optical element material which is obtained by curing a resin composition for photoimprinting containing a photocurable monomer (A) of the formula (1) and a photocurable monomer (B) of the formula (2) in a weight ratio of from 30/70 to 87/13, and containing a photopolymerization initiator (C) in a content of from 0.01 to 30 parts by weight per 100 parts by weight of the total weight of the monomer (A) and the monomer (B), and which has a shrinkage on curing of at most 4.5%, and a method for producing it: wherein R1 is —CH?CH2, —CH2CH2—O—CH?CH2, —CH2—C(CH3)?CH2 or a glycidyl group; R2 and R3 are each independently hydrogen or a C1-4 alkyl group; R4 and R5 are each independently —O—CH?CH2, —O—CH2CH2—O—CH?CH2, —O—CO—CH?CH2, —O—CO—C(CH3)?CH2, —O—CH2CH2—O—CO—CH?CH2, —O—CH2CH2—O—CO—C(CH3)?CH2 or a glycidyl ether group; and R6 and R7 are each independently hydrogen or a C1-4 alkyl group.

Abstract: A mold for imprinting has a mold pattern for transferring a pattern to a processing object. A base layer having a predetermined base pattern is formed by imprinting on a thermoplastic resin, a thermosetting resin, a photo-curable resin, or the like, and a mold layer is formed in such a way that the mode pattern is shapened along a surface of the base pattern by a surface preparation technique, such as CVD, PVD, or plating.

Abstract: There are provided an etching mask which has a superior thermal imprinting characteristic and also a good anti-etching characteristic, a base material with the etching mask, a microfabricated product to which those etching mask and base material are applied, and a production method of the microfabricated product. The etching mask formed of a thermoplastic resin containing at least one kind of skeleton expressed by a chemical formula (1) or a chemical formula (2) in a main chain wherein R1, R2, R3, R4, R5, R6, R7, R8 in the formulae (1), (2) can be different or same one another, each of which is a hydrogen atom, a deuterium atom, a hydrocarbon group having a carbon number of 1 to 15, a halogen atom, or a substituent group containing a hetero atom like oxygen or sulfur, and may form a ring structure one another and wherein m and n are integers equal to or greater than 0.

Abstract: A resin composition for photoimprinting, a cured product of the resin composition which is excellent in etching and heat resistance, and a pattern forming process using the resin composition are provided. The resin composition contains photocurable monomer (A) containing at least one carbazole compound of formula (I): a photocurable monomer (B) containing at least one compound of the following formulae (II), (III), and (IV): and a photopolymerization initiator (C). The weight ratio of the photocurable monomer (A) to the photocurable monomer (B) is from 30/70 to 87/13.

Abstract: There are provided an etching mask which has a superior thermal imprinting characteristic and also a good anti-etching characteristic, a base material with the etching mask, a microfabricated product to which those etching mask and base material are applied, and a production method of the microfabricated product. The etching mask formed of a thermoplastic resin containing at least one kind of skeleton expressed by a chemical formula (1) or a chemical formula (2) in a main chain wherein R1, R2, R3, R4, R5, R6, R7, R8 in the formulae (1), (2) can be different or same one another, each of which is a hydrogen atom, a deuterium atom, a hydrocarbon group having a carbon number of 1 to 15, a halogen atom, or a substituent group containing a hetero atom like oxygen or sulfur, and may form a ring structure one another and wherein m and n are integers equal to or greater than 0.

Abstract: A mold 100 for imprinting has a mold pattern 2A for transferring a pattern to a processing object. A base layer 1 having a predetermined base pattern 1A is formed by imprinting on a thermoplastic resin, a thermosetting resin, a photo-curable resin, or the like, and a mold layer 2 is formed in such a way that the mode pattern 2A is shapened along a surface of the base pattern 1A by a surface preparation technique, such as CVD, PVD, or plating. Accordingly, there is provided a mold which has the same functions as those of conventionally-used silicon mold and metal mold and which facilitates manufacturing thereof.

Abstract: There are provided a thermal-imprinting resin which has a good heat-deterioration tolerability and a low resin elastic modulus at the time of fluidization in order to suppress any production of particle-like materials in microfabrication by thermal imprinting, and has a good fine-pattern transfer characteristic, a thermal-imprinting-resin solution using the same, a thermal-imprinting injection-molded body using the same, a thermal-imprinting thin film using the same and a production method thereof. The thermal-imprinting resin has an exothermic onset temperature (oxidation onset temperature) of an exothermic peak due to oxidation greater than or equal to +35° C. to the glass transition temperature of the resin in differential scanning calorimetric measurement at a temperature rise rate of 5° C./min in air, and has a complex modulus less than 0.24 MPa at the glass transition temperature of the resin +35° C. in a dynamic viscoelastic modulus measurement at a frequency of 1 rad/sec in nitrogen stream.

Abstract: There are provided a resin solution substantially applicable to thermal imprinting, a thin film thereof, and manufacturing methods of those. A thermal imprinting resin solution for forming a thin film used for thermal imprinting applications comprises a thermoplastic resin and greater than or equal to at least one kind of solvent which can dissolve the resin, and an containing amount of foreign particles having a grain diameter larger than or equal to 0.2 ?m is controlled to be less than 3000 particles/cm3. Moreover, remaining volatile compositions in a thin film are set to be less than or equal to 0.25% when the thin film is formed from the thermal imprinting resin solution.