Patents by Inventor Takuro Shinada
Takuro Shinada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240121891Abstract: A flexible printed board according to the present disclosure includes a first pattern layer including, at an end part thereof, a wiring end part to be connected to a substrate and a resist and a coverlay overlaid on the first pattern layer, wherein the coverlay covers an inside of the wiring end part of the first pattern layer in a planar view, and the resist is provided from a portion of the first pattern layer covered with the coverlay to a portion of the first pattern layer exposed from the coverlay, in a planar view.Type: ApplicationFiled: June 9, 2021Publication date: April 11, 2024Applicant: Mitsubishi Electric CorporationInventor: Takuro SHINADA
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Publication number: 20220352690Abstract: A first conductive pattern (13) is provided on an upper surface of the submount (7). A GND pattern (9) is provided on a lower surface of the submount (7). A lower surface electrode (21) of a capacitor (3) is bonded to the first conductive pattern (13) with solder (22). An upper surface electrode (23) of the capacitor (3) is connected to a light emitting device (2). A terminating resistor (4) is connected to the first conductive pattern (13). The first conductive pattern (13) has a protruding portion (25) which protrudes outside from the capacitor (3) in planar view. A width of the protruding portion (25) is narrower than a width of the capacitor (3).Type: ApplicationFiled: October 25, 2019Publication date: November 3, 2022Applicant: Mitsubishi Electric CorporationInventors: Hiromitsu ITAMOTO, Akihiro MATSUSUE, Takuro SHINADA
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Patent number: 11291120Abstract: A optical module according to the present invention includes an optical semiconductor device, a package housing the optical semiconductor device, a first pattern provided on an upper surface of the package, a second pattern provided on a side surface continuous with the upper surface of the package, a flexible substrate provided on the first pattern and extending from the upper surface to a side surface side of the package and solder joining the first pattern and the flexible substrate together, wherein the solder is spread between a portion of the flexible substrate, the portion extending from the upper surface to the side surface side of the package, and the second pattern.Type: GrantFiled: September 7, 2018Date of Patent: March 29, 2022Assignee: Mitsubishi Electric CorporationInventors: Yutaka Yoneda, Takuro Shinada
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Publication number: 20210059054Abstract: A optical module according to the present invention includes an optical semiconductor device, a package housing the optical semiconductor device, a first pattern provided on an upper surface of the package, a second pattern provided on a side surface continuous with the upper surface of the package, a flexible substrate provided on the first pattern and extending from the upper surface to a side surface side of the package and solder joining the first pattern and the flexible substrate together, wherein the solder is spread between a portion of the flexible substrate, the portion extending from the upper surface to the side surface side of the package, and the second pattern.Type: ApplicationFiled: September 7, 2018Publication date: February 25, 2021Applicant: Mitsubishi Electric CorporationInventors: Yutaka YONEDA, Takuro SHINADA
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Patent number: 10916914Abstract: Included are a metal block, a first sub-mount fixed to the metal block, and a second sub-mount having an upper surface and a lower surface which is fixed to the first sub-mount via a metal layer. Also included are an optical element mounted on the upper surface of the second sub-mount and a high frequency line path which is formed on the upper surface of the second sub-mount and electrically connected to the optical element so as to cause a signal such as a high-frequency signal to be input to or output from the optical element. In addition, the metal layer is electrically connected to the metal block.Type: GrantFiled: May 17, 2017Date of Patent: February 9, 2021Assignee: Mitsubishi Electric CorporationInventor: Takuro Shinada
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Publication number: 20200136345Abstract: Included are a metal block, a first sub-mount fixed to the metal block, and a second sub-mount having an upper surface and a lower surface which is fixed to the first sub-mount via a metal layer. Also included are an optical element mounted on the upper surface of the second sub-mount and a high frequency line path which is formed on the upper surface of the second sub-mount and electrically connected to the optical element so as to cause a signal such as a high-frequency signal to be input to or output from the optical element. In addition, the metal layer is electrically connected to the metal block.Type: ApplicationFiled: May 17, 2017Publication date: April 30, 2020Applicant: Mitsubishi Electric CorporationInventor: Takuro SHINADA
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Patent number: 9118434Abstract: An optical transmitting apparatus includes semiconductor laser elements. Upon receiving laser beams, a multiplexed beam is emitted from a wavelength multiplexing filter. The wavelength multiplexing filter includes a triangular prism and a wavelength multiplexing filter film. A front end face and a rear end face of the prism are not parallel to each other so that a prism angle at which a surface parallel to the front end face intersects a surface parallel to the rear end face, is an acute angle. The prism angle is the angle at which the laser beam impinging from the front end face into the triangular prism is reflected by the wavelength multiplexing filter film toward the front end face and the multiplexed beam is directed to the optical axis side of the optical fiber.Type: GrantFiled: November 6, 2013Date of Patent: August 25, 2015Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Takuro Shinada, Haruki Koyanagi
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Publication number: 20140294386Abstract: An optical transmitting apparatus includes semiconductor laser elements. Upon receiving laser beams, a multiplexed beam is emitted from a wavelength multiplexing filter. The wavelength multiplexing filter includes a triangular prism and a wavelength multiplexing filter film. A front end face and a rear end face of the prism are not parallel to each other so that a prism angle at which a surface parallel to the front end face intersects a surface parallel to the rear end face, is an acute angle. The prism angle is the angle at which the laser beam impinging from the front end face into the triangular prism is reflected by the wavelength multiplexing filter film toward the front end face and the multiplexed beam is directed to the optical axis side of the optical fiber.Type: ApplicationFiled: November 6, 2013Publication date: October 2, 2014Applicant: Mitsubishi Electric CorporationInventors: Takuro Shinada, Haruki Koyanagi
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Publication number: 20120012738Abstract: A multiple wavelength light detector module includes an optical fiber emitting an optical signal including light of multiple wavelengths, a prism on which the optical signal is incident, a total reflection mirror bonded to a first surface of the prism, a bandpass filter bonded to a second surface of the prism, opposite the first surface, and a photodetector for detecting optical beams exiting the bandpass filter. The first surface extends at an angle with respect to the second surface. When light is incident on the bandpass filter, the bandpass filter transmits only light of a particular wavelength determined by the angle of incidence of the light, and reflects light of remaining wavelengths in the light.Type: ApplicationFiled: April 21, 2011Publication date: January 19, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Takuro Shinada, Tatsuo Hatta, Keita Mochizuki