Patents by Inventor Takuro Suyama

Takuro Suyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210141210
    Abstract: An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.
    Type: Application
    Filed: October 18, 2019
    Publication date: May 13, 2021
    Applicant: OLYMPUS CORPORATION
    Inventors: Takatoshi IGARASHI, Takahiro SHIMOHATA, Takuro SUYAMA
  • Patent number: 11000184
    Abstract: An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: May 11, 2021
    Assignee: OLYMPUS CORPORATION
    Inventors: Takatoshi Igarashi, Takahiro Shimohata, Takuro Suyama
  • Publication number: 20210109337
    Abstract: An image pickup apparatus includes an image pickup member and a laminated optical member that is fixed in frame-shaped fixed areas around respective optical path areas. The fixed areas include a first area and a second area. A width of the first area is greater than a width of the second area. In the laminated optical member, an optical surface central axis deviates from an optical axis toward the first area. In the image pickup member, an image pickup surface central axis that is a central axis of a first main surface deviates from the optical axis.
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Applicant: OLYMPUS CORPORATION
    Inventor: Takuro SUYAMA
  • Publication number: 20200344386
    Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.
    Type: Application
    Filed: July 9, 2020
    Publication date: October 29, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Ken YAMAMOTO, Takatoshi IGARASHI, Takuro SUYAMA, Kazuhiro YOSHIDA, Kensuke SUGA
  • Patent number: 10757301
    Abstract: An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: August 25, 2020
    Assignee: OLYMPUS CORPORATION
    Inventors: Ken Yamamoto, Takuro Suyama, Takahiro Shimohata, Takatoshi Igarashi, Hiroshi Kobayashi
  • Patent number: 10734355
    Abstract: An electronic circuit board includes: electronic components; a silicon board that is plate shaped, includes a wiring pattern provided on at least one of a surface and a reverse surface thereof, and includes recessed portions where the electronic components are individually mounted; and a supporting board that is layered over the reverse surface of the silicon board, and includes a wiring pattern provided on at least one of a surface and a reverse surface thereof. Side faces of the recessed portions are perpendicular to the surface of the silicon board, the wiring pattern is connected to at least one of the electronic components mounted in the recessed portions, via at least one of a via and a bottom surface electrode provided in of the at least one of the recessed portions, and the recessed portions penetrate through the silicon board.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: August 4, 2020
    Assignee: OLYMPUS CORPORATION
    Inventor: Takuro Suyama
  • Patent number: 10660511
    Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: May 26, 2020
    Assignee: OLYMPUS CORPORATION
    Inventors: Takuro Suyama, Takatoshi Igarashi, Kensuke Suga, Yoshiro Nishimura
  • Patent number: 10665538
    Abstract: A semiconductor apparatus includes a semiconductor device having a semiconductor circuit formed on a first main surface, and including a via having an opening at a second main surface, a first wiring disposed on the first main surface of the semiconductor device, partially exposed at a bottom surface of the via, and connected to the semiconductor circuit, a first insulating layer covering the first wiring, and a redistribution wiring extending from a contact portion in contact with the first wiring at the bottom surface of the via, through an inside of the via and onto the second main surface, where a first through hole is formed in the first wiring, and the contact portion is in contact with a plurality of surfaces of the first wiring.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: May 26, 2020
    Assignee: OLYMPUS CORPORATION
    Inventor: Takuro Suyama
  • Publication number: 20200058693
    Abstract: An endoscope includes an image pickup module, and the image pickup module includes: an image pickup device an external electrode being disposed on a back surface of the image pickup device; a wiring element provided with a through-hole passing through a first main surface and a second main surface, a first electrode on the first main surface being bonded with the external electrode; a signal cable bonded with a second electrode on the second main surface of the wiring element; and a first resin that seals a first bump bonding the first electrode and the external electrode and a second bump bonding the second electrode and the signal cable, and fills the through-hole.
    Type: Application
    Filed: October 24, 2019
    Publication date: February 20, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Takuro SUYAMA, Takatoshi IGARASHI
  • Publication number: 20200054202
    Abstract: An endoscope system includes an endoscope having an insertion portion. The endoscope is attached to the proximal end of the insertion portion. An image capturing module is attached to the distal-end portion of an insertion portion. The image capturing module includes a wiring board having a principal surface including first electrodes and second electrodes disposed thereon. An image capturing element includes respective photodetection and reverse surfaces. The reverse surface includes external electrodes and is connected to the first electrodes on the wiring board. A prism having an entrance surface to which light is applied, a reflection surface, and an exit surface in which the exit surface being bonded to the photodetection surface of the image capturing element. A support member is used to support the prism. A layered element including a plurality of elements is layered together and having an upper surface, a lower surface with element electrodes disposed thereon.
    Type: Application
    Filed: October 24, 2019
    Publication date: February 20, 2020
    Applicant: Olympus Corporation
    Inventors: Ken Yamamoto, Takuro Suyama
  • Publication number: 20200046210
    Abstract: An image pickup module includes a stacked device in which a plurality of elements are stacked, adjacent elements are electrically connected together by element joints and a rear surface electrode is arranged on a rear surface, a wiring board in which a first electrode electrically connected to the rear surface electrode by a relay joint and a second electrode electrically connected to the first electrode via a relay wiring pattern are arranged, and a signal cable electrically connected to the second electrode via a cable joint, and in the stacked device, of a first region and a second region obtained by dividing the rear surface into two portions, the element joints are arranged only in a first space in which the first region is extended in an optical axis direction and the rear surface electrode is arranged only in the second region.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 13, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Takatoshi IGARASHI, Takahiro SHIMOHATA, Takuro SUYAMA
  • Publication number: 20200049972
    Abstract: An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 13, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Takatoshi IGARASHI, Takahiro SHIMOHATA, Takuro SUYAMA
  • Patent number: 10514535
    Abstract: An image pickup unit of an embodiment includes: a first substrate on which an image pickup device is mounted; a first intermediate wiring board including a first wire, one end of the first wire electrically connected to the first substrate, the other end of the first wire including a first electrode pad; a second substrate on which an electronic component is mounted; and a second intermediate wiring board including a second wire, one end of the second wire electrically connected to the second substrate, and the other end of the second wire including a second electrode pad, wherein the first electrode pad and the second electrode pad coming into close contact and fixed in an electrically connected state are bent and deformed.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: December 24, 2019
    Assignee: OLYMPUS CORPORATION
    Inventor: Takuro Suyama
  • Publication number: 20190274529
    Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.
    Type: Application
    Filed: May 20, 2019
    Publication date: September 12, 2019
    Applicant: OLYMPUS CORPORATION
    Inventors: Takuro SUYAMA, Takatoshi IGARASHI, Kensuke SUGA, Yoshiro NISHIMURA
  • Publication number: 20190260917
    Abstract: An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 22, 2019
    Applicant: OLYMPUS CORPORATION
    Inventors: Ken YAMAMOTO, Takuro SUYAMA, Takahiro SHIMOHATA, Takatoshi IGARASHI, Hiroshi KOBAYASHI
  • Patent number: 10381393
    Abstract: An image pickup apparatus is an image pickup apparatus including: an image pickup device including a plurality of electrode pads provided in a row on an outer peripheral portion of a light-receiving surface on which a light-receiving section is formed, the plurality of electrode pads being connected to the light-receiving section; and a wiring board including a plurality of inner leads connected to respective electrode pads, wherein each of the inner leads includes a distal end portion, a bent portion and a rear end portion, the distal end portion is connected to the corresponding electrode pad, the bent portion includes a first bent portion having a recess shape relative to the light-receiving surface and a second bent portion having a protruding shape relative to the light-receiving surface, and the rear end portion is disposed in parallel with a side face of the image pickup device.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: August 13, 2019
    Assignee: OLYMPUS CORPORATION
    Inventors: Takuro Suyama, Takahiro Shimohata
  • Publication number: 20190175004
    Abstract: The disclosed technology is directed to an imaging module of an endoscope comprises a plurality of semiconductor devices includes first and second semiconductor devices being electrically stacked to one another with a sealing layer interposed therebetween to transmit signals via a signal cable connected to a rear wall of the plurality of semiconductor devices. The first semiconductor device includes respective opposed first and second major surfaces having a first central region. The first major surface includes a semiconductor circuit portion disposed in the central region thereof. A through-silicon via is disposed in an intermediate region surrounding the first central region and is connected to the semiconductor circuit portion. The second major surface includes a first electrode located in the first central region thereof. The first electrode is connected to the through-silicon via. The second semiconductor device includes respective opposed third and fourth major surfaces having a second central region.
    Type: Application
    Filed: February 20, 2019
    Publication date: June 13, 2019
    Applicant: Olympus Corporation
    Inventors: Takuro Suyama, Takatoshi Igarashi, Kensuke Suga
  • Patent number: 10213096
    Abstract: An image pickup apparatus includes a silicon layer, a rewiring layer including low-permittivity insulating bodies having a permittivity that is lower than a permittivity of silicon oxide, and a cover glass, and a cutout portion is provided in the silicon layer, wirings are provided on the cutout portion, the wirings do not cover at least a part of the low-permittivity insulating bodies in the rewiring layer, the low-permittivity insulating body being exposed at the cutout portion, and the cutout portion is covered by a second protection film including a metal material via a first protection film including an insulating material.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: February 26, 2019
    Assignee: OLYMPUS CORPORATION
    Inventor: Takuro Suyama
  • Publication number: 20180368661
    Abstract: An image pickup apparatus includes an image pickup device including a wiring that connects a first electrode on a light receiving surface and a second electrode on a rear surface, a first wiring board including a distal end surface, from which a flying lead protrudes, arranged to oppose the rear surface of the image pickup device, and a second wiring board including a second main surface to which an upper surface of the first wiring board is made to adhere and including a distal end surface arranged to oppose the rear surface, in which the flying lead is bent and is bonded to the second electrode, and a sealing member that seals a bonding section between the second electrode and the flying lead and an adhesion member that makes the distal end surface of the second wiring board and the rear surface adhere to each other are composed of integral curable resin.
    Type: Application
    Filed: August 31, 2018
    Publication date: December 27, 2018
    Applicant: OLYMPUS CORPORATION
    Inventor: Takuro SUYAMA
  • Publication number: 20180308794
    Abstract: A semiconductor apparatus includes a semiconductor device having a semiconductor circuit formed on a first main surface, and including a via having an opening at a second main surface, a first wiring disposed on the first main surface of the semiconductor device, partially exposed at a bottom surface of the via, and connected to the semiconductor circuit, a first insulating layer covering the first wiring, and a redistribution wiring extending from a contact portion in contact with the first wiring at the bottom surface of the via, through an inside of the via and onto the second main surface, where a first through hole is formed in the first wiring, and the contact portion is in contact with a plurality of surfaces of the first wiring.
    Type: Application
    Filed: April 23, 2018
    Publication date: October 25, 2018
    Applicant: OLYMPUS CORPORATION
    Inventor: Takuro SUYAMA