Patents by Inventor Takuroh Kamimura

Takuroh Kamimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9904335
    Abstract: An electronic apparatus capable of achieving sufficient heat transfer efficiency between a portable information device and a cooling device while preventing a heating member from being exposed at an outer surface of the portable information device is disclosed. The portable information device includes a heating body and a cooling device. The cooling device is detachably connected to the portable information device, and is configured to absorb heat from the heating body. The portable information device includes a heat-dissipation heat sink thermally connected to the heating body, and multiple apparatus shutter members covering the heat-dissipation heat sink so that the heat-dissipation heat sink can be freely covered and uncovered. The cooling device includes a shutter driving mechanism that opens the apparatus shutter members when the portable information device is connected to the cooling device, and a heat-receiving heat sink thermally connected to the heat-dissipation heat sink.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: February 27, 2018
    Assignee: LENOVO (SINGAPORE) PTE LTD
    Inventors: Takuroh Kamimura, Hiroaki Agata, Akinori Uchino, Tomoaki Kosugi, Yoshiyuki Shibayama, Eiji Shinohara
  • Publication number: 20180027694
    Abstract: An electronic apparatus which can achieve both a reduction in thickness of a chassis and an improvement in a heat releasing performance is provided. An electronic apparatus 10 includes a chassis 12 having an electronic component 18 arranged therein, a heat sink 20 which is provided in the chassis 12 and absorbs heat generated from the electronic component 18 when its one surface 20a is arranged to enable conduction of the heat from the electronic component 18, and a heat conducting sheet 22 which is arranged in the chassis 12, closely arranged on the other surface 20c on the side opposite to the one surface 20a of the heat sink, has an outer shape area larger than an outer shape area of the heat sink 20, and extends to the outside of an outer shape of the heat sink 20.
    Type: Application
    Filed: June 27, 2017
    Publication date: January 25, 2018
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: AKINORI UCHINO, TAKUROH KAMIMURA, HAJIME YOSHIZAWA, SHUSAKU TOMIZAWA
  • Publication number: 20170337895
    Abstract: A method, apparatus and computer program product are disclosed. The method includes detecting ambient light around an electronic device, determining whether a user is present based on the ambient light, and controlling an operation of the electronic device. The apparatus includes a component that consumes electric power, a light sensor that detects ambient light, a frequency analyzing unit that specifies a frequency component, and a control unit that determines whether a user is present and controls an operation of the component. The computer program product includes code to perform detecting ambient light around an electronic device, determining whether a user is present based on the ambient light, and controlling an operation of the electronic device.
    Type: Application
    Filed: May 18, 2017
    Publication date: November 23, 2017
    Inventors: Kazuhiro Kosugi, Takuroh Kamimura, Hiroki Oda, Atsushi Ohyama, Yuhsaku Sugai, Hideshi Tsukamoto, Hiroyuki Uchida
  • Publication number: 20170160772
    Abstract: An electronic apparatus capable of achieving sufficient heat transfer efficiency between a portable information device and a cooling device while preventing a heating member from being exposed at an outer surface of the portable information device is disclosed. The portable information device includes a heating body and a cooling device. The cooling device is detachably connected to the portable information device, and is configured to absorb heat from the heating body. The portable information device includes a heat-dissipation heat sink thermally connected to the heating body, and multiple apparatus shutter members covering the heat-dissipation heat sink so that the heat-dissipation heat sink can be freely covered and uncovered. The cooling device includes a shutter driving mechanism that opens the apparatus shutter members when the portable information device is connected to the cooling device, and a heat-receiving heat sink thermally connected to the heat-dissipation heat sink.
    Type: Application
    Filed: December 7, 2016
    Publication date: June 8, 2017
    Inventors: TAKUROH KAMIMURA, HIROAKI AGATA, AKINORI UCHINO, TOMOAKI KOSUGI, YOSHIYUKI SHIBAYAMA, EIJI SHINOHARA
  • Publication number: 20170153678
    Abstract: An electronic apparatus having a cooling device that can reduce size and cost thereof while maintaining sufficient cooling performance of cooling a portable information apparatus is disclosed. The electronic apparatus includes a portable information apparatus and a cooling device. The portable information apparatus includes a heat-dissipation heat sink thermally connected to a heating body. The cooling device includes a cooling unit for absorbing heat from the heating body. The cooling unit includes a heat-receiving heat sink that is thermally connected to a heat-dissipation heat sink when the portable information apparatus is connected to the cooling device, and a radiator that dissipates heat absorbed in the heat-receiving heat sink to outside. The radiator is disposed on an exhaust path from an air outlet of the portable information apparatus while the portable information apparatus is connected to the cooling device.
    Type: Application
    Filed: November 30, 2016
    Publication date: June 1, 2017
    Inventors: AKINORI UCHINO, HIROAKI AGATA, TAKUROH KAMIMURA, TOMOAKI KOSUGI
  • Patent number: 9436230
    Abstract: A hinge which may be used for example in portable electronic devices may raise the upper body of the device from the lower body in response to rotation of the upper body about the hinge. The need to include a half-pipe section on the upper surface of the lower body maybe avoided. Thus more internal space of the lower body may be used without having to accommodate for the hinge. In an exemplary embodiment, the hinge may include a cam surface. The cam surface may be configured to shift a longitudinal axis of the hinge on response to the rotation of the upper body. In some embodiments, the shift of the longitudinal axis may be away from the lower body allowing a rear edge of the upper body to move across a rear edge of an upper surface of the lower body.
    Type: Grant
    Filed: July 14, 2014
    Date of Patent: September 6, 2016
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Chin Kai Lee, Akinori Uchino, Takuroh Kamimura
  • Publication number: 20160011631
    Abstract: A hinge which may be used for example in portable electronic devices may raise the upper body of the device from the lower body in response to rotation of the upper body about the hinge. The need to include a half-pipe section on the upper surface of the lower body maybe avoided. Thus more internal space of the lower body may be used without having to accommodate for the hinge. In an exemplary embodiment, the hinge may include a cam surface. The cam surface may be configured to shift a longitudinal axis of the hinge on response to the rotation of the upper body. In some embodiments, the shift of the longitudinal axis may be away from the lower body allowing a rear edge of the upper body to move across a rear edge of an upper surface of the lower body.
    Type: Application
    Filed: July 14, 2014
    Publication date: January 14, 2016
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Chin Kai Lee, Akinori Uchino, Takuroh Kamimura
  • Publication number: 20140185231
    Abstract: An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed.
    Type: Application
    Filed: December 24, 2013
    Publication date: July 3, 2014
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Takuroh Kamimura, Tsutomu Chonan, Takateru Adachi, Kazuya Tatsuno, Shogo Akiyama
  • Patent number: 8427827
    Abstract: A cooling apparatus comprising an impeller, a housing that encloses the impeller, an inlet opening formed between the hosing and impeller and a projection formed on the housing that extends from the housing towards the impeller.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: April 23, 2013
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventor: Takuroh Kamimura
  • Publication number: 20120113588
    Abstract: A cooling apparatus comprising an impeller, a housing that encloses the impeller, an inlet opening formed between the hosing and impeller and a projection formed on the housing that extends from the housing towards the impeller.
    Type: Application
    Filed: November 5, 2010
    Publication date: May 10, 2012
    Inventor: Takuroh Kamimura
  • Publication number: 20120095719
    Abstract: An apparatus comprises a mother board, a memory slot on the motherboard, a thermal sensor, and an embedded controller. The thermal sensor may detect temperature of a memory module on the memory slot. The embedded controller may monitor temperature from the detector. A memory controller may be adapted to receive data from the embedded controller. A computing device comprises a mother board, a basic input/output system (BIOS), and a memory controller. The basic input/output system may be disposed on the mother board. The memory controller may be adapted to receive data from the BIOS regarding a quantity and a quality of memory installed in the computing device. The memory controller may be adapted to regulate bandwidth of memory access of a memory module.
    Type: Application
    Filed: October 19, 2010
    Publication date: April 19, 2012
    Inventors: NAOYUKI ARAKI, SHINJI MATSUSHIMA, TAKUROH KAMIMURA
  • Patent number: 6657860
    Abstract: A heat sink, cooling member, semi-conductor substrate cooling system, computer and method for providing sufficient cooling performance through a heat sink is provided. In part, there is provided a heat sink having a radiating portion for diffusing the heat conducted from a heat source and a blasting fan for blasting air to a duct-like structure formed by the radiating portion. Moreover, rates of airflows in the duct-like structure are averaged so that air circulates through all portions in the duct-like structure by forming a high-wind-pressure portion and a low-wind-pressure portion having wind pressures different from each other when air is blasted by the blasting fan in the duct-like structure and using the high-wind-pressure portion as a high-density area having a high arrangement density of radiating fins compared to the low-wind-pressure portion.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: December 2, 2003
    Assignee: International Business Machines Corporation
    Inventors: Yohichi Matsui, Taichiroh Nomura, Takuroh Kamimura
  • Publication number: 20030016497
    Abstract: A heat sink, cooling member, semi-conductor substrate cooling system, computer and method for providing sufficient cooling performance through a heat sink is provided. In part, there is provided a heat sink having a radiating portion for diffusing the heat conducted from a heat source and a blasting fan for blasting air to a duct-like structure formed by the radiating portion. Moreover, rates of airflows in the duct-like structure are averaged so that air circulates through all portions in the duct-like structure by forming a high-wind-pressure portion and a low-wind-pressure portion having wind pressures different from each other when air is blasted by the blasting fan in the duct-like structure and using the high-wind-pressure portion as a high-density area having a high arrangement density of radiating fins compared to the low-wind-pressure portion.
    Type: Application
    Filed: May 23, 2002
    Publication date: January 23, 2003
    Applicant: International Business Machines Corporation
    Inventors: Yohichi Matsui, Taichiroh Nomura, Takuroh Kamimura