Abstract: In a heat radiating device and electronic equipment mounted on a vehicle, grid-shaped grooves 16 are formed on a lower face of a fan casing 7 which functions as a heat sink, and an annular ditch 15 is formed a round a region in which the grid-shaped grooves 16 are formed. Heat-conductive grease 14 interposed between IC chip 5 and a lower face of the fan casing 7 is prevented by the grid-shaped grooves 16 from slipping out. Even when a quantity of the coated heat-conductive grease 14 is excessively large in the beginning and forced out from a region in which the grid-shaped grooves 16 are formed, the heat-conductive grease 14, which has forced out in this way, is stored in an annular ditch 15 and not forced outside. In a cooling device in which heat of an object to be cooled is transmitted to a heat sink via the heat-conductive grease and radiated outside, the heat-conductive grease is prevented from being forced out from between the object to be cooled and the heat sink.

Abstract: In fixing a sensor element for sensing stress on a substrate by using an adhesive for semiconductors, the present invention aims to solve both the problems of stress applied from the substrate side due to temperature change and defects in wire bonding in the wire bonding process. In a semiconductor device equipped with a sensor element for sensing stress fixed on a substrate, an adhesive for semiconductors is used which is prepared by compounding resin beads made of resin with a base adhesive made of flexible resin.

Abstract: A semiconductor strain sensor having a stem with a lead hole in which a lead terminal is installed and electrically coupled to an external circuit. A sensor chip having piezo-resistors to a bride circuit is joined with a front surface of the stem. A shell is joined with the front surface of the stem by projection welding after the back surface of the stem is flattened to within a predetermined limit. A space formed by the shell and stem is filled with a damping liquid. The stem is integrally coupled to the sensor chip through an adhesive, and spacers are added to the adhesive to keep the thickness of the adhesive to a predetermined value. This arrangement can effectively prevent propagation of the welding strain of the stem from adversely affecting the sensor chip.