Patents by Inventor Takuto Abe

Takuto Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12724517
    Abstract: An adherend-equipped substrate includes a substrate and an adherend. The adherend is bonded to a front face of the substrate with the adhesive. The substrate includes a substrate body and a protective layer. The protective layer having a front face is disposed at a side of a front face of the substrate body. The front face of the protective layer has a first region and a second region. The first region is a region to which the adherend is bonded with the adhesive. The first region has a first contact angle. The second region is a region other than the first region and has a second contact angle. The first contact angle is smaller than the second contact angle.
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: September 1, 2026
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takuto Abe, Keishu Muraoka, Kota Araki, Takeshi Haritani
  • Publication number: 20260231295
    Abstract: In a moisture removal system of the present disclosure, a base member has a first transmission part capable of transmitting an electromagnetic wave. A first electrode has a second transmission part capable of transmitting the electromagnetic wave and is disposed on the base member such that the second transmission part overlaps the first transmission part. A second electrode has a third transmission part capable of transmitting the electromagnetic wave and is disposed on the base member such that the third transmission part overlaps the first transmission part. A control circuit performs first operation of detecting capacitance between the first electrode and the second electrode and second operation of energizing at least one electrode of the first electrode or the second electrode to generate Joule heat at the at least one electrode.
    Type: Application
    Filed: January 23, 2024
    Publication date: August 6, 2026
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takuto Abe, Masaki Sawada, Hiroaki Nishiono, Kota Araki
  • Publication number: 20260016920
    Abstract: An adherend-equipped substrate includes a substrate and an adherend. The adherend is bonded to a front face of the substrate with the adhesive. The substrate includes a substrate body and a protective layer. The protective layer having a front face is disposed at a side of a front face of the substrate body. The front face of the protective layer has a first region and a second region. The first region is a region to which the adherend is bonded with the adhesive. The first region has a first contact angle. The second region is a region other than the first region and has a second contact angle. The first contact angle is smaller than the second contact angle.
    Type: Application
    Filed: June 15, 2023
    Publication date: January 15, 2026
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takuto Abe, Keishu Muraoka, Kota Araki, Takeshi Haritani
  • Publication number: 20240212952
    Abstract: An input device includes a fixed electrode, a reference electrode, a switch electrode, an operating member, and a moving electrode. The moving electrode is provided for the operating member and is movable integrally with the operating member. The moving electrode includes a first connection portion and a second connection portion. Subjecting the operating member to no press operation keeps the moving electrode out of contact with the fixed electrode, the reference electrode, or the switch electrode. Subjecting the operating member to a press operation brings the first connection portion into contact with the reference electrode and then brings the second connection portion into contact with the switch electrode.
    Type: Application
    Filed: February 4, 2022
    Publication date: June 27, 2024
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Satoshi Yoshihara, Takuto Abe, Hiroaki Nishiono, Kenji Shibata