Patents by Inventor Takuto Oka

Takuto Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6153699
    Abstract: A primer composition comprising a silicone-modified acrylic resin, a polyisocyanate compound in an amount of 0.5 to 10 parts by weight, and 1,4-butanediol in an amount of 0.01 to 1.0 part by weight, the amounts being based on the weight of the silicone-modified acrylic resin. The primer composition imparts sufficient adhesion to polyurethane base adhesives irrespective of the type of polyvinyl chloride being used as an adherend.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: November 28, 2000
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Hideyuki Matsuda, Takuto Oka
  • Patent number: 5996403
    Abstract: A method and apparatus for measuring the sagging conditions of a sealant. The method is conducted by filling up a sealant in a retaining device, bringing the sealant into contact with a contacting device, moving the retaining device and/or the contacting device reciprocally and linearly to apply shear stress on the sealant and then separating the retaining device and the contacting device from each other to observe the shape of the sealant. The apparatus essentially comprises a retaining device for holding a sealant therein and a contacting device brought into contact with the sealant and a controlling device for moving the retaining device and the contacting device reciprocally and linearly.
    Type: Grant
    Filed: March 4, 1998
    Date of Patent: December 7, 1999
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Tsuyoshi Nishida, Takuto Oka