Patents by Inventor Takuto SAKAI

Takuto SAKAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240407085
    Abstract: A printed circuit board includes a base film having a main surface, and an electrically conductive pattern disposed on the main surface. The electrically conductive pattern includes an electrically conductive base layer disposed on the main surface directly or indirectly, and a copper electroplating layer disposed on the electrically conductive base layer. The void density, being a value obtained by dividing a sum of areas of voids within a predetermined observation length at an interface between the electrically conductive base layer and the copper electroplating layer by the observation length, is more than 0.01 ?m2/?m and 5.5 ?m2/?m or less.
    Type: Application
    Filed: June 7, 2023
    Publication date: December 5, 2024
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Yosuke FUKAYA, Koji NITTA, Shoichiro SAKAI, Takuto HIDANI, Yoshihito YAMAGUCHI
  • Patent number: 11312418
    Abstract: A subframe arranged below a power plant room located in a forward part of a vehicle includes: a left-right pair of extension members extending in a vehicle front-rear direction; a rear member connected to rear end portions of the extension members and extending in a vehicle width direction; and U-shaped brackets respectively attached to front portions of the extension members and each extending downward and inclined forward in side view. The extension members each have left and right side faces spaced apart in the vehicle width direction. Each of the U-shaped brackets is made from a flat plate and includes a left-right pair of connection portions respectively connected to the left and right side faces of the corresponding one of the extension members. Each of the U-shaped brackets has a bottom face portion having a sloped surface that rises upward as the sloped surface extends forward.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: April 26, 2022
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Hayato Takahashi, Takuto Sakai
  • Publication number: 20200307700
    Abstract: A subframe arranged below a power plant room located in a forward part of a vehicle includes: a left-right pair of extension members extending in a vehicle front-rear direction; a rear member connected to rear end portions of the extension members and extending in a vehicle width direction; and U-shaped brackets respectively attached to front portions of the extension members and each extending downward and inclined forward in side view. The extension members each have left and right side faces spaced apart in the vehicle width direction. Each of the U-shaped brackets is made from a flat plate and includes a left-right pair of connection portions respectively connected to the left and right side faces of the corresponding one of the extension members. Each of the U-shaped brackets has a bottom face portion having a sloped surface that rises upward as the sloped surface extends forward.
    Type: Application
    Filed: March 30, 2020
    Publication date: October 1, 2020
    Inventors: Hayato TAKAHASHI, Takuto SAKAI