Abstract: A switching converter includes: a reactor having one end to be connected to an AC power source; and a rectifier circuit connected to an opposite end of the reactor, the rectifier circuit converting a power source voltage applied by the AC power source into a DC voltage. The rectifier circuit includes a first leg and a second leg connected in parallel to the first leg. The first leg includes a first upper-arm element and a first lower-arm element connected in series. The second leg includes a second upper-arm element and a second lower-arm element connected in series. A snubber circuit including a resistor and a capacitor is connected to each of upper and lower-arm elements in one of the first and second legs. No snubber circuit is connected to upper and lower-arm elements in another of the first and second legs.

Abstract: A direct-current power supply includes: a rectifier circuit in which switching elements are bridge-connected; a reactor; a gate circuitry that drives the switching elements; and a gate circuitry that drives the switching elements. A connection point between the switching element and the switching element is connected to an alternating-current power supply via the reactor, and a connection point between the switching element and the switching element is connected to the alternating-current power supply without via the reactor. A time during which the gate circuitry turns on the switching elements is longer than a time during which the gate circuitry turns on the switching elements.

Abstract: To allow short time spreading for adhesive, verifying whether the adhesive is spread out to a member end. In obtaining a bonded member by applying the adhesive to a surface of one of two members and bonding the members with a member bonding device, a tilt adjusting device acquires with a camera an image of spreading state of the adhesive in the members' bonding surface, and adjusts the tilt of the bonded member when a non-spreading part of the adhesive between ends of the bonded member and the adhesive has a size bias so that the adhesive moves to the larger side of the part, and a spreading adjustment device controls a pushing amount and a pushing time interval of a pressing-side member to adjust spreading of the adhesive so that the part size reduces to a predetermined size depending on the part size acquired with the camera, and cures the adhesive in the bonded member edge with the non-spreading part eliminated.

Abstract: A method of manufacturing a thin-film photovoltaic module in which a photoelectric conversion element is deposited on a substrate, includes removing the photoelectric conversion element at a frame shape area from sides of the substrate toward inside with a predetermined width by a first removing step of scanning a first photoelectric conversion element removing device at the area along the sides of the substrate to remove the photoelectric conversion element for the predetermined width, and a second removing step of scanning a second photoelectric conversion element removing device within the area along the sides of the substrate to remove the photoelectric conversion element that is not removed in the first removing step at a width narrower than the predetermined width and without superimposing a center line of a scanning path on a center line of a scanning path of the first photoelectric conversion element removing device.

Abstract: To allow short time spreading for adhesive, verifying whether the adhesive is spread out to a member end. In obtaining a bonded member by applying the adhesive to a surface of one of two members and bonding the members with a member bonding device, a tilt adjusting device acquires with a camera an image of spreading state of the adhesive in the members' bonding surface, and adjusts the tilt of the bonded member when a non-spreading part of the adhesive between ends of the bonded member and the adhesive has a size bias so that the adhesive moves to the larger side of the part, and a spreading adjustment device controls a pushing amount and a pushing time interval of a pressing-side member to adjust spreading of the adhesive so that the part size reduces to a predetermined size depending on the part size acquired with the camera, and cures the adhesive in the bonded member edge with the non-spreading part eliminated.

Abstract: A method of manufacturing a thin-film photovoltaic module in which a photoelectric conversion element is deposited on a substrate, includes removing the photoelectric conversion element at a frame shape area from sides of the substrate toward inside with a predetermined width by a first removing step of scanning a first photoelectric conversion element removing device at the area along the sides of the substrate to remove the photoelectric conversion element for the predetermined width, and a second removing step of scanning a second photoelectric conversion element removing device within the area along the sides of the substrate to remove the photoelectric conversion element that is not removed in the first removing step at a width narrower than the predetermined width and without superimposing a center line of a scanning path on a center line of a scanning path of the first photoelectric conversion element removing device.