Patents by Inventor Takuya ARITA

Takuya ARITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface modifier for polyimide resin and surface-modifying method for polyimide resin
    Patent number: 9656482
    Abstract: The present invention relates to a polyimide resin surface modifier which modifies the surface of a polyimide resin to permit easy absorption of metal ions, and a surface-modifying method for polyimide resins using the same. The surface modifier contains an alkali component, an organic solvent having hydroxy groups and a boiling point of 120° C. or higher, and a water content of 0-10% by weight. The surface-modifying method includes a printing process wherein a predetermined pattern is printed on the surface of a polyimide resin substrate using the polyimide resin surface modifier, an organic solvent-removing process wherein an organic solvent in the polyimide resin surface modifier pattern-printed on the surface of said polyimide resin substrate is removed and a water-treatment process wherein said polyimide resin surface modifier after removing the organic solvent is brought into contact with water.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: May 23, 2017
    Assignee: SEIREN CO., LTD.
    Inventors: Akimitsu Bamba, Takuya Arita, Hiroyuki Hayashi, Kouichi Kugimiya
  • SURFACE MODIFIER FOR POLYIMIDE RESIN AND SURFACE-MODIFYING METHOD FOR POLYIMIDE RESIN
    Publication number: 20160159112
    Abstract: The present invention relates to a polyimide resin surface modifier which modifies the surface of a polyimide resin to permit easy absorption of metal ions, and a surface-modifying method for polyimide resins using the same. The surface modifier contains an alkali component, an organic solvent having hydroxy groups and a boiling point of 120° C. or higher, and a water content of 0-10% by weight. The surface-modifying method includes a printing process wherein a predetermined pattern is printed on the surface of a polyimide resin substrate using the polyimide resin surface modifier, an organic solvent-removing process wherein an organic solvent in the polyimide resin surface modifier pattern-printed on the surface of said polyimide resin substrate is removed and a water-treatment process wherein said polyimide resin surface modifier after removing the organic solvent is brought into contact with water.
    Type: Application
    Filed: February 12, 2016
    Publication date: June 9, 2016
    Inventors: Akimitsu BAMBA, Takuya ARITA, Hiroyuki HAYASHI, Kouichi KUGIMIYA
  • SURFACE MODIFIER FOR POLYIMIDE RESIN AND SURFACE-MODIFYING METHOD FOR POLYIMIDE RESIN
    Publication number: 20140227446
    Abstract: The present invention relates to a polyimide resin surface modifier which modifies the surface of a polyimide resin to permit easy absorption of metal ions, and a surface-modifying method for polyimide resins using the same. The surface modifier contains an alkali component, an organic solvent having hydroxy groups and a boiling point of 120° C. or higher, and a water content of 0-10% by weight. The surface-modifying method includes a printing process wherein a predetermined pattern is printed on the surface of a polyimide resin substrate using the polyimide resin surface modifier, an organic solvent-removing process wherein an organic solvent in the polyimide resin surface modifier pattern-printed on the surface of said polyimide resin substrate is removed and a water-treatment process wherein said polyimide resin surface modifier after removing the organic solvent is brought into contact with water.
    Type: Application
    Filed: February 10, 2014
    Publication date: August 14, 2014
    Applicant: SEIREN CO., LTD.
    Inventors: Akimitsu BAMBA, Takuya ARITA, Hiroyuki HAYASHI, Kouichi KUGIMIYA