Abstract: A molding die includes a fixed die, a movable die movable toward and away from the fixed die, a first slide core slidable in sliding engagement with the fixed die, and a second slide core having a presser for pressing the first slide core when the second slide core is held in pressing contact with the first slide core. The fixed die, the movable die, the first slide core, and the second slide core jointly define a cavity for molding a product. The presser includes a reactive force plate for producing reactive forces against the pressure of a molten material introduced into the cavity.

Abstract: A molding die includes a fixed die, a movable die movable toward and away from the fixed die, a first slide core slidable in sliding engagement with the fixed die, and a second slide core having a presser for pressing the first slide core when the second slide core is held in pressing contact with the first slide core. The fixed die, the movable die, the first slide core, and the second slide core jointly define a cavity for molding a product. The presser includes a reactive force plate for producing reactive forces against the pressure of a molten material introduced into the cavity.

Abstract: A resin composition for semiconductor encapsulation having good moldability, of which the cured product has effective electromagnetic wave shieldability, is provided. A resin composition for semiconductor encapsulation, containing spherical sintered ferrite particles having the following properties (a) to (c) : (a) the soluble ion content of the particles is at most 5 ppm; (b) the mean particle size of the particles is from 10 to 50 ?m; (c) the crystal structure of the particles by X-ray diffractiometry is a spinel structure.

Abstract: The present invention relates to an epoxy resin composition for semiconductor encapsulation, the epoxy resin composition including the following ingredients (A) to (C) and further including the following ingredient (D) as a flame retardant: (A) an epoxy resin; (B) a phenolic resin; (C) an inorganic filler; and (D) an aluminum hydroxide powder having a 50% volume cumulative diameter D50 (?m) of 1.5 to 5 ?m and a BET specific surface area S (m2/g) of 3.3/D50?S?4.2/D50, and having a ratio D50/D10 of 1.5 to 4 wherein D10 is a 10% volume cumulative diameter thereof.

Abstract: An epoxy resin composition for semiconductor encapsulation which does not contain conductive foreign metallic particles having such a size that they cannot be detected and eliminated by the conventional method for eliminating conductive foreign metallic particles. The epoxy resin composition for semiconductor encapsulation comprises the following components (A) to (D). Conductive foreign metallic particles having a size of 20 ?m or more are substantially not contained in the aforementioned epoxy resin composition. (A) An epoxy resin. (B) A phenol resin. (C) A hardening accelerator. (D) An inorganic filler.

Abstract: An epoxy resin composition for semiconductor encapsulation which does not contain conductive foreign metallic particles having such a size that they cannot be detected and eliminated by the conventional method for eliminating conductive foreign metallic particles. The epoxy resin composition for semiconductor encapsulation comprises the following components (A) to (D). Conductive foreign metallic particles having a size of 20 ?M or more are substantially not contained in the aforementioned epoxy resin composition. (A) An epoxy resin. (B) A phenol resin. (C) A hardening accelerator. (D) An inorganic filler.

Abstract: An image forming apparatus has a plurality of developing units for developing toner images of different colors, an intermediate transfer belt for transferring the toner images of the respective colors onto a surface of the belt or onto a recording sheet transported over the belt surface, a first or drive roller for driving the belt while the belt is wound around the first roller, a second or driven roller and a tension roller, which is driven along with the driving of the belt driven by the first roller. The image forming apparatus satisfies a relation defined by the following equation: D2=N·D1 where D1 is a belt-inclusive outer diameter of the first roller where the belt is wound, including the thickness t of the belt, D2 is an outer diameter of the second roller, and N=n or 1/n where n is a positive integer.

Abstract: A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.

Abstract: An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.

Abstract: An image forming apparatus has a plurality of developing units for developing toner images of different colors, an intermediate transfer belt for transferring the toner images of the respective colors onto a surface of the belt or onto a recording sheet transported over the belt surface, a first or drive roller for driving the belt while the belt is wound around the first roller, a second or driven roller and a tension roller, which is driven along with the driving of the belt driven by the first roller. The image forming apparatus satisfies a relation defined by the following equation: D2=N·D1 where D1 is a belt-inclusive outer diameter of the first roller where the belt is wound, including the thickness t of the belt, D2 is an outer diameter of the second roller, and N=n or 1/n where n is a positive integer.

Abstract: A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.

Abstract: A roller shaft extends between a pair of frame walls. A feed roller is mounted on the roller shaft for feeding a stack of sheets placed on a feeding tray one by one from an uppermost sheet. A transmission gear is concentrically coupled to one end portion of the roller shaft to be rotated by driving of a driving motor. A boss extends axially inwardly from a center position of the transmission gear. The roller shaft has a flat key portion at the one end portion thereof. The flat key portion has a substantially D-shape in cross section. The flat key portion is coupled to the boss by being received in a non-circular hole of the boss. With this arrangement, an eccentric displacement of the roller shaft relative to the transmission gear is suppressed, and the feed roller is easily detachable from the roller shaft with a simplified operation.

Abstract: An automatic document feeder comprising a reversing device and a discharge device is disclosed. The reversing device and the discharge device are disposed such that the distance in the horizontal direction from an original document reading position in the automatic document feeder to the discharge device is longer than the distance in the horizontal direction from the original document reading position to the reversing device. This configuration allows the use of original documents whose length in the transport direction is short, and also shortens the transport path in the automatic document feeder as well as the amount of time needed to read an original document. Furthermore, this configuration increases the visibility of original documents discharged to the discharge tray by the discharge device because the discharge device is disposed relatively far away from the original document reading position.

Abstract: An automatic document feeder comprising a reversing device and a discharge device is disclosed. The reversing device and the discharge device are disposed such that the distance in the horizontal direction from an original document reading position in the automatic document feeder to the discharge device is longer than the distance in the horizontal direction from the original document reading position to the reversing device. This configuration allows the use of original documents whose length in the transport direction is short, and also shortens the transport path in the automatic document feeder as well as the amount of time needed to read an original document. Furthermore, this configuration increases the visibility of original documents discharged to the discharge tray by the discharge device because the discharge device is disposed relatively far away from the original document reading position.

Abstract: An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.