Patents by Inventor Takuya Hanada

Takuya Hanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109194
    Abstract: A control device includes an acquisition unit and a control unit. The acquisition unit acquires first information indicating information on an operating time of a first device and an environmental condition that influences a life of a first instrument provided for the first device, and information on an operating time of a second device and an environmental condition that influences a life of a second instrument provided for the second device. The control unit operates the first device and the second device in conjunction with each other based on the first information acquired by the acquisition unit.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 4, 2024
    Inventors: Hidetaka KISHIMOTO, Takuya HANADA, Masakazu OKAMOTO
  • Publication number: 20240085052
    Abstract: An air conditioning unit includes an indoor air conditioner, a power supply line, and a wireless power feeder. The indoor air conditioner conditions air in a target space. The power supply line supplies power to the indoor air conditioner. The wireless power feeder feeds power to a predetermined device disposed in the target space. The wireless power feeder acquires power from the power supply line.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Tadafumi NISHIMURA, Hiroshi DOUMAE, Tetsuya OKAMOTO, Takuya HANADA
  • Publication number: 20240067233
    Abstract: When an object that may possibly collide with a vehicle is detected from a sensor signal of one of sensors mounted on the vehicle, a vehicle controller changes the level of autonomous driving control applied to the vehicle from a first level that does not require a driver to operate an accelerator and steering and does not require the driver to look around the vehicle to a second level that requires the driver to look around the vehicle but does not require the driver to operate an accelerator and steering. When an object that may possibly collide with the vehicle is detected from sensor signals of two or more of the sensors, the vehicle controller changes the level of autonomous driving control from the first level to a third level that requires the driver to operate at least an accelerator or steering.
    Type: Application
    Filed: August 14, 2023
    Publication date: February 29, 2024
    Inventors: Wataru Kawashima, Ryusuke Kuroda, Kenichiro Aoki, Takehiko Hanada, Takuya Fujiki
  • Publication number: 20240053220
    Abstract: A defect location estimation system includes a controller configured to control a refrigerating and air-conditioning system, wherein the controller outputs defect information indicating a location where a defect has occurred, a possible location where the defect has occurred, or an area where the defect has occurred, by using both sensor information of a sensor that detects the defect that has occurred in the refrigerating and air-conditioning system and installation position information indicating one or more positions where one or more components are installed in the refrigerating and air-conditioning system.
    Type: Application
    Filed: January 6, 2022
    Publication date: February 15, 2024
    Inventors: Takuya HANADA, Hiroki UEDA, Satoshi ISHIDA
  • Publication number: 20230284172
    Abstract: An estimation system estimates the arrangement of objects. The estimation system includes an estimation unit. The estimation unit obtains information related to an arrangement pattern of the objects as first information and obtains, from wireless devices respectively connected to the objects, information including response times between the wireless devices as second information to estimate the arrangement of the objects based on the first information and the second information.
    Type: Application
    Filed: July 21, 2021
    Publication date: September 7, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hiroshi DOUMAE, Shin HIGASHIYAMA, Takuya HANADA, Hiroki UEDA, Hiroshi NAKAYAMA, Naotoshi FUJITA, Yuusuke ASADA
  • Publication number: 20230058009
    Abstract: A solid-state image sensor according to the present disclosure includes a photodiode, a conversion circuit (current-voltage conversion circuit), a luminance change detection circuit (comparator), and a light-shielding unit (light-shielding film). The photodiode photoelectrically converts incident light to generate a photocurrent. The conversion circuit (current-voltage conversion circuit) converts the photocurrent into a voltage signal. The luminance change detection circuit (comparator) detects a change in luminance of the incident light on the basis of the voltage signal. The light-shielding unit (light-shielding film) shields incidence of light on the impurity diffusion region included in a circuit that inputs the voltage signal to the luminance change detection circuit (comparator).
    Type: Application
    Filed: January 18, 2021
    Publication date: February 23, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Koya TSUCHIMOTO, Shin KITANO, Yusuke MURAKAWA, Makoto NAKAMURA, Takuya HANADA, Yuki NODA
  • Publication number: 20230058625
    Abstract: A solid-state imaging element according to the present disclosure is provided with a first substrate (light reception chip) and a second substrate (detection chip). The first substrate (light reception chip) is provided with a photodiode that photoelectrically converts incident light to generate a photocurrent. The second substrate (detection chip) is provided with a luminance change detection circuit (current-voltage conversion circuit) that detects a change in luminance of the incident light on the basis of a voltage signal converted by a conversion circuit (current-voltage conversion circuit) that converts the photocurrent into the voltage signal, and is bonded to the first substrate (light reception chip). A light shielding unit (light shielding film) provided in at least any one of the first substrate (light reception chip) or the second substrate (detection chip) and shields light between an active element (transistor TR) provided in the second substrate (detection chip) and the photodiode is included.
    Type: Application
    Filed: February 2, 2021
    Publication date: February 23, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Makoto NAKAMURA, Shin KITANO, Yusuke MURAKAWA, Koya TSUCHIMOTO, Takuya HANADA, Yuki NODA
  • Publication number: 20230059890
    Abstract: Please replace the currently pending Abstract with the following amended A solid-state imaging device is provided with a plurality of photoelectric conversion elements, a plurality of current-voltage conversion circuits, a plurality of address event detection circuits, first ground wiring, and second ground wiring. The plurality of photoelectric conversion elements is arranged side by side in a first region. The plurality of current-voltage conversion circuits converts currents output from the plurality of photoelectric conversion elements into voltages, respectively. The plurality of address event detection circuits detects changes in voltages output from the plurality of current-voltage conversion circuits, respectively. The first ground wiring is provided in a second region located outside the first region, and supplies first ground potential to the plurality of photoelectric conversion elements.
    Type: Application
    Filed: January 28, 2021
    Publication date: February 23, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takuya HANADA, Koya TSUCHIMOTO, Makoto NAKAMURA, Yuki NODA, Yusuke MURAKAWA, Shin KITANO
  • Publication number: 20230052364
    Abstract: A solid-state imaging device according to the present disclosure includes a light-receiving substrate, a circuit board, and a plurality of first connections. The light-receiving substrate includes a plurality of light-receiving circuits provided with photoelectric conversion elements. The circuit board is directly bonded to the light-receiving substrate and includes a plurality of address event detection circuits that detects individual changes in voltages output from the photoelectric conversion elements of the plurality of light-receiving circuits. The plurality of first connections is provided at a joint between the light-receiving substrate and the circuit board to electrically connect the light-receiving circuits and the address event detection circuits corresponding to each other.
    Type: Application
    Filed: January 22, 2021
    Publication date: February 16, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yuki NODA, Yusuke MURAKAWA, Takuya HANADA, Makoto NAKAMURA, Koya TSUCHIMOTO, Shin KITANO
  • Publication number: 20230033688
    Abstract: A solid-state imaging element according to the present disclosure includes a plurality of first photoelectric conversion elements, a plurality of second photoelectric conversion elements, a plurality of current-voltage conversion circuits, and a plurality of address event detection circuits. The plurality of first photoelectric conversion elements are arranged side by side in a first region. The second photoelectric conversion elements are arranged side by side in a second region adjacent to the first region. The current-voltage conversion circuits each convert currents output from the first photoelectric conversion elements or the second photoelectric conversion elements into voltages. The address event detection circuits each detect a change in the voltages output from the current-voltage conversion circuits.
    Type: Application
    Filed: January 15, 2021
    Publication date: February 2, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yusuke MURAKAWA, Shin KITANO, Makoto NAKAMURA, Takuya HANADA, Koya TSUCHIMOTO, Yuki NODA
  • Publication number: 20230024909
    Abstract: A maintenance assistance system outputs a facility maintenance plan for a facility device. The maintenance assistance system includes: an acquisition unit that obtains operation data of the facility device; a memory that stores maintenance cost data corresponding to a content and scheduled time for maintenance of the facility device; a maintenance planning unit that uses the operation data of the facility device to plan a content and scheduled time of maintenance that will become necessary after the operation data is obtained; a maintenance cost calculator that uses the maintenance cost data stored in the memory to calculate a maintenance cost corresponding to the planned content and scheduled time of the maintenance; and a maintenance plan output unit that generates a facility maintenance plan including information in which the content and the scheduled time of the maintenance and the maintenance cost are associated with each other, and outputs the facility maintenance plan.
    Type: Application
    Filed: October 23, 2020
    Publication date: January 26, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Takuya HANADA, Hiroki UEDA
  • Publication number: 20220316741
    Abstract: An information processing apparatus, based on a data set including a combination of information indicating a situation, information on the comfort of a user, and information on power consumption when an air conditioner has been operated, executes a process of determining an operation setting according to a situation when the air conditioner is operated, the comfort when the air conditioner is operated, and a condition related to the power consumption when the air conditioner is operated.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 6, 2022
    Inventors: Tadafumi NISHIMURA, Hiroyuki MURAYAMA, Takuya HANADA, Hiroki UEDA, Daisuke SATOU
  • Patent number: 10071408
    Abstract: A precursor detection device 6 detects a precursor of a stick-slip phenomenon in a drawing machine 1. The precursor detection device 6 includes a load measurement section 61 for measuring a load applied to a plug support bar 4 in the drawing direction, a precursor detection section 62 for detecting a precursor of a stick-slip phenomenon based on a load measurement value measured by the load measurement section 61, and a control section 63. After drawing is started, a load applied to the plug support bar 4 in the drawing direction is measured by the load measurement section 61 during a predetermined period from a measurement start point to a measurement end point, and based on the measured load measurement values, a precursor of a stick-slip phenomenon is detected by the precursor detection section 62.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: September 11, 2018
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventor: Takuya Hanada
  • Patent number: 9938602
    Abstract: A method of producing a metal pipe which can suppress quenching defects is provided. In the method, a bend of the metal pipe is straightened by a straightening machine 10. Next, both pipe end portions of the metal pipe whose bend has been straightened are cut off by a pipe cutting apparatus 20. Next, a plurality of the metal pipes whose both pipe end portions have been cut off are aligned in the axial direction thereof to be conveyed to a quenching apparatus 30, and the metal pipes are quenched by being cooled after being heated by induction heating.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: April 10, 2018
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Shunichi Otsuka, Kazuhiro Uchida, Takuya Hanada, Masami Sakiyama, Tsutomu Shima
  • Patent number: 9238258
    Abstract: Provided is a method for producing a double-wall tube with braided wires at its interface in which the braided wires are interposed between an outer-wall and inner-wall blank tubes and then a drawing process is applied so as for the braided wires to be brought into close contact with the inner surface of the outer-wall tube and the outer surface of the inner-wall tube, the method comprising: polishing the inner surface of the outer-wall blank tube and the outer surface of the inner-wall blank tube so that a surface roughness thereof satisfies Ra<1.0 ?m, followed by interposing the braided wires between the outer-wall and inner-wall blank tubes; performing a sinking drawing process so that the difference of the outer diameter of the resulting double-wall tube relative to a die bore diameter is 0.1 mm to 0.3 mm; and subsequently performing heat treatment. The double-wall tube produced is suitable as a heat-transfer tube.
    Type: Grant
    Filed: October 17, 2011
    Date of Patent: January 19, 2016
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Takuya Hanada, Takashi Nakashima, Tetsuo Yokoyama, Kouichi Kuroda, Tatsuya Okui
  • Patent number: 9153348
    Abstract: After an inner wall tube, made of steel or alloy containing not less than 2% of Cr, whose outer surface thereof is machined and/or ground to a thickness of 0.1 mm or more including the scale layer, is inserted into an outer wall tube, made of ferritic steel containing not less than 2% of Cr, in which an oxide scale layer containing Cr and having a thickness of 10 to 30 ?m is formed in the inner surface thereof, cold working at an outside diameter reduction rate of 5 to 30% is performed. Similarly cold worked after an inner wall tube having an oxide scale layer on the outer surface thereof, is inserted into an outer wall tube whose inner surface is machined and ground. A double-walled tube made has a uniform gap and an excellent thermal conductivity, and is suitable as materials for SG tubes of future FBR.
    Type: Grant
    Filed: May 2, 2011
    Date of Patent: October 6, 2015
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Atsuro Iseda, Takashi Nakashima, Tetsuo Yokoyama, Tadashi Kawakami, Takuya Hanada
  • Publication number: 20150082851
    Abstract: A precursor detection device 6 detects a precursor of a stick-slip phenomenon in a drawing machine 1. The precursor detection device 6 includes a load measurement section 61 for measuring a load applied to a plug support bar 4 in the drawing direction, a precursor detection section 62 for detecting a precursor of a stick-slip phenomenon based on a load measurement value measured by the load measurement section 61, and a control section 63. After drawing is started, a load applied to the plug support bar 4 in the drawing direction is measured by the load measurement section 61 during a predetermined period from a measurement start point to a measurement end point, and based on the measured load measurement values, a precursor of a stick-slip phenomenon is detected by the precursor detection section 62.
    Type: Application
    Filed: May 2, 2013
    Publication date: March 26, 2015
    Inventor: Takuya Hanada
  • Publication number: 20150068650
    Abstract: A production method of a metal pipe which can suppress quenching defects is provided. In the production method of a metal pipe according an embodiment of the present invention bend of the metal pipe is straightened by a straightening machine 10. Next, both pipe end portions of the metal pipe whose bend has been straightened are cut off by a pipe cutting apparatus 20. Next, a plurality of the metal pipes whose both pipe end portions have been cut off are aligned in the axial direction thereof to be conveyed to a quenching apparatus 30, and the metal pipes are quenched by being cooled after being heated by induction heating.
    Type: Application
    Filed: February 22, 2013
    Publication date: March 12, 2015
    Inventors: Shunichi Otsuka, Kazuhiro Uchida, Takuya Hanada, Masami Sakiyama, Tsutomu Shima
  • Publication number: 20130205861
    Abstract: Provided is a method for producing a double-wall tube with braided wires at its interface in which the braided wires are interposed between an outer-wall and inner-wall blank tubes and then a drawing process is applied so as for the braided wires to be brought into close contact with the inner surface of the outer-wall tube and the outer surface of the inner-wall tube, the method comprising: polishing the inner surface of the outer-wall blank tube and the outer surface of the inner-wall blank tube so that a surface roughness thereof satisfies Ra<1.0 ?m, followed by interposing the braided wires between the outer-wall and inner-wall blank tubes; performing a sinking drawing process so that the difference of the outer diameter of the resulting double-wall tube relative to a die bore diameter is 0.1 mm to 0.3 mm; and subsequently performing heat treatment. The double-wall tube produced is suitable as a heat-transfer tube.
    Type: Application
    Filed: October 17, 2011
    Publication date: August 15, 2013
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Takuya Hanada, Takashi Nakashima, Tetsuo Yokoyama, Kouichi Kuroda, Tatsuya Okui
  • Publication number: 20130070889
    Abstract: After an inner wall tube, made of steel or alloy containing not less than 2% of Cr, whose outer surface thereof is machined and/or ground to a thickness of 0.1 mm or more including the scale layer, is inserted into an outer wall tube, made of ferritic steel containing not less than 2% of Cr, in which an oxide scale layer containing Cr and having a thickness of 10 to 30 ?m is formed in the inner surface thereof , cold working at an outside diameter reduction rate of 5 to 30% is performed. Similarly cold worked after an inner wall tube having an oxide scale layer on the outer surface thereof, is inserted into an outer wall tube whose inner surface is machined and ground. A double-walled tube made has a uniform gap and an excellent thermal conductivity, and is suitable as materials for SG tubes of future FBR.
    Type: Application
    Filed: May 2, 2011
    Publication date: March 21, 2013
    Inventors: Atsuro Iseda, Takashi Nakashima, Tetsuo Yokoyama, Tadashi Kawakami, Takuya Hanada