Abstract: Please replace the currently pending Abstract with the following amended A solid-state imaging device is provided with a plurality of photoelectric conversion elements, a plurality of current-voltage conversion circuits, a plurality of address event detection circuits, first ground wiring, and second ground wiring. The plurality of photoelectric conversion elements is arranged side by side in a first region. The plurality of current-voltage conversion circuits converts currents output from the plurality of photoelectric conversion elements into voltages, respectively. The plurality of address event detection circuits detects changes in voltages output from the plurality of current-voltage conversion circuits, respectively. The first ground wiring is provided in a second region located outside the first region, and supplies first ground potential to the plurality of photoelectric conversion elements.

Abstract: A solid-state image sensor according to the present disclosure includes a photodiode, a conversion circuit (current-voltage conversion circuit), a luminance change detection circuit (comparator), and a light-shielding unit (light-shielding film). The photodiode photoelectrically converts incident light to generate a photocurrent. The conversion circuit (current-voltage conversion circuit) converts the photocurrent into a voltage signal. The luminance change detection circuit (comparator) detects a change in luminance of the incident light on the basis of the voltage signal. The light-shielding unit (light-shielding film) shields incidence of light on the impurity diffusion region included in a circuit that inputs the voltage signal to the luminance change detection circuit (comparator).

Abstract: A solid-state imaging element according to the present disclosure is provided with a first substrate (light reception chip) and a second substrate (detection chip). The first substrate (light reception chip) is provided with a photodiode that photoelectrically converts incident light to generate a photocurrent. The second substrate (detection chip) is provided with a luminance change detection circuit (current-voltage conversion circuit) that detects a change in luminance of the incident light on the basis of a voltage signal converted by a conversion circuit (current-voltage conversion circuit) that converts the photocurrent into the voltage signal, and is bonded to the first substrate (light reception chip). A light shielding unit (light shielding film) provided in at least any one of the first substrate (light reception chip) or the second substrate (detection chip) and shields light between an active element (transistor TR) provided in the second substrate (detection chip) and the photodiode is included.

Abstract: A solid-state imaging device according to the present disclosure includes a light-receiving substrate, a circuit board, and a plurality of first connections. The light-receiving substrate includes a plurality of light-receiving circuits provided with photoelectric conversion elements. The circuit board is directly bonded to the light-receiving substrate and includes a plurality of address event detection circuits that detects individual changes in voltages output from the photoelectric conversion elements of the plurality of light-receiving circuits. The plurality of first connections is provided at a joint between the light-receiving substrate and the circuit board to electrically connect the light-receiving circuits and the address event detection circuits corresponding to each other.

Abstract: A solid-state imaging element according to the present disclosure includes a plurality of first photoelectric conversion elements, a plurality of second photoelectric conversion elements, a plurality of current-voltage conversion circuits, and a plurality of address event detection circuits. The plurality of first photoelectric conversion elements are arranged side by side in a first region. The second photoelectric conversion elements are arranged side by side in a second region adjacent to the first region. The current-voltage conversion circuits each convert currents output from the first photoelectric conversion elements or the second photoelectric conversion elements into voltages. The address event detection circuits each detect a change in the voltages output from the current-voltage conversion circuits.

Abstract: A maintenance assistance system outputs a facility maintenance plan for a facility device. The maintenance assistance system includes: an acquisition unit that obtains operation data of the facility device; a memory that stores maintenance cost data corresponding to a content and scheduled time for maintenance of the facility device; a maintenance planning unit that uses the operation data of the facility device to plan a content and scheduled time of maintenance that will become necessary after the operation data is obtained; a maintenance cost calculator that uses the maintenance cost data stored in the memory to calculate a maintenance cost corresponding to the planned content and scheduled time of the maintenance; and a maintenance plan output unit that generates a facility maintenance plan including information in which the content and the scheduled time of the maintenance and the maintenance cost are associated with each other, and outputs the facility maintenance plan.

Abstract: An information processing apparatus, based on a data set including a combination of information indicating a situation, information on the comfort of a user, and information on power consumption when an air conditioner has been operated, executes a process of determining an operation setting according to a situation when the air conditioner is operated, the comfort when the air conditioner is operated, and a condition related to the power consumption when the air conditioner is operated.

Abstract: A precursor detection device 6 detects a precursor of a stick-slip phenomenon in a drawing machine 1. The precursor detection device 6 includes a load measurement section 61 for measuring a load applied to a plug support bar 4 in the drawing direction, a precursor detection section 62 for detecting a precursor of a stick-slip phenomenon based on a load measurement value measured by the load measurement section 61, and a control section 63. After drawing is started, a load applied to the plug support bar 4 in the drawing direction is measured by the load measurement section 61 during a predetermined period from a measurement start point to a measurement end point, and based on the measured load measurement values, a precursor of a stick-slip phenomenon is detected by the precursor detection section 62.

Abstract: A method of producing a metal pipe which can suppress quenching defects is provided. In the method, a bend of the metal pipe is straightened by a straightening machine 10. Next, both pipe end portions of the metal pipe whose bend has been straightened are cut off by a pipe cutting apparatus 20. Next, a plurality of the metal pipes whose both pipe end portions have been cut off are aligned in the axial direction thereof to be conveyed to a quenching apparatus 30, and the metal pipes are quenched by being cooled after being heated by induction heating.

Abstract: Provided is a method for producing a double-wall tube with braided wires at its interface in which the braided wires are interposed between an outer-wall and inner-wall blank tubes and then a drawing process is applied so as for the braided wires to be brought into close contact with the inner surface of the outer-wall tube and the outer surface of the inner-wall tube, the method comprising: polishing the inner surface of the outer-wall blank tube and the outer surface of the inner-wall blank tube so that a surface roughness thereof satisfies Ra<1.0 ?m, followed by interposing the braided wires between the outer-wall and inner-wall blank tubes; performing a sinking drawing process so that the difference of the outer diameter of the resulting double-wall tube relative to a die bore diameter is 0.1 mm to 0.3 mm; and subsequently performing heat treatment. The double-wall tube produced is suitable as a heat-transfer tube.

Abstract: After an inner wall tube, made of steel or alloy containing not less than 2% of Cr, whose outer surface thereof is machined and/or ground to a thickness of 0.1 mm or more including the scale layer, is inserted into an outer wall tube, made of ferritic steel containing not less than 2% of Cr, in which an oxide scale layer containing Cr and having a thickness of 10 to 30 ?m is formed in the inner surface thereof, cold working at an outside diameter reduction rate of 5 to 30% is performed. Similarly cold worked after an inner wall tube having an oxide scale layer on the outer surface thereof, is inserted into an outer wall tube whose inner surface is machined and ground. A double-walled tube made has a uniform gap and an excellent thermal conductivity, and is suitable as materials for SG tubes of future FBR.

Abstract: A precursor detection device 6 detects a precursor of a stick-slip phenomenon in a drawing machine 1. The precursor detection device 6 includes a load measurement section 61 for measuring a load applied to a plug support bar 4 in the drawing direction, a precursor detection section 62 for detecting a precursor of a stick-slip phenomenon based on a load measurement value measured by the load measurement section 61, and a control section 63. After drawing is started, a load applied to the plug support bar 4 in the drawing direction is measured by the load measurement section 61 during a predetermined period from a measurement start point to a measurement end point, and based on the measured load measurement values, a precursor of a stick-slip phenomenon is detected by the precursor detection section 62.

Abstract: A production method of a metal pipe which can suppress quenching defects is provided. In the production method of a metal pipe according an embodiment of the present invention bend of the metal pipe is straightened by a straightening machine 10. Next, both pipe end portions of the metal pipe whose bend has been straightened are cut off by a pipe cutting apparatus 20. Next, a plurality of the metal pipes whose both pipe end portions have been cut off are aligned in the axial direction thereof to be conveyed to a quenching apparatus 30, and the metal pipes are quenched by being cooled after being heated by induction heating.

Abstract: Provided is a method for producing a double-wall tube with braided wires at its interface in which the braided wires are interposed between an outer-wall and inner-wall blank tubes and then a drawing process is applied so as for the braided wires to be brought into close contact with the inner surface of the outer-wall tube and the outer surface of the inner-wall tube, the method comprising: polishing the inner surface of the outer-wall blank tube and the outer surface of the inner-wall blank tube so that a surface roughness thereof satisfies Ra<1.0 ?m, followed by interposing the braided wires between the outer-wall and inner-wall blank tubes; performing a sinking drawing process so that the difference of the outer diameter of the resulting double-wall tube relative to a die bore diameter is 0.1 mm to 0.3 mm; and subsequently performing heat treatment. The double-wall tube produced is suitable as a heat-transfer tube.

Abstract: After an inner wall tube, made of steel or alloy containing not less than 2% of Cr, whose outer surface thereof is machined and/or ground to a thickness of 0.1 mm or more including the scale layer, is inserted into an outer wall tube, made of ferritic steel containing not less than 2% of Cr, in which an oxide scale layer containing Cr and having a thickness of 10 to 30 ?m is formed in the inner surface thereof , cold working at an outside diameter reduction rate of 5 to 30% is performed. Similarly cold worked after an inner wall tube having an oxide scale layer on the outer surface thereof, is inserted into an outer wall tube whose inner surface is machined and ground. A double-walled tube made has a uniform gap and an excellent thermal conductivity, and is suitable as materials for SG tubes of future FBR.