Abstract: In an antenna element, a planar ground conductor layer on an insulation substrate is connected to ground. A radiation conductor layer radiates and/or receives high-frequency signals. The radiation conductor layer is in or on the insulation substrate and above the planar ground conductor layer. A lower principal surface of the radiation conductor layer overlaps an upper principal surface of the planar ground conductor layer as viewed in an up-down direction. The ground conductor is in the insulation substrate and connected to the ground potential. An upper end of the ground conductor is above the radiation conductor layer. The ground conductor layer is spaced away from the radiation conductor layer as viewed in the up-down direction. Only a conductor through which the high-frequency signals are transmitted and a conductor connected to the ground potential are between the ground conductor and the radiation conductor layer.

Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

Abstract: A light emitting device includes: a substrate including a main surface; a first projection positioned on the main surface, the first projection including an upper surface and first and second lateral surfaces, wherein the first lateral surface of the first projection comprises a first reflective part, and the second lateral surface of the first projection comprises a second reflective part; a first laser element positioned on the main surface at a first reflective part side with respect to the first projection, the first laser element being configured to irradiate first laser light to the first reflective part; a second laser element positioned on the main surface at a second reflective part side with respect to the first projection, the second laser element being configured to irradiate second laser light to the second reflective part; and a first optical member bonded to the upper surface of the first projection.

Abstract: A light emitting device includes: a first light emitting element having a light emitting surface; an optical member having a lower surface, a first reflecting surface inclined to the lower surface, transmitting part of a first light emitted from the light emitting surface, and reflecting the rest upward, and a second reflecting surface located farther from the light emitting surface than the first reflecting surface and reflecting part or all of the first light passing through the first reflecting surface; and a photodetector located below the optical member and having a top surface provided with one or a plurality of light receiving regions including a first light receiving region configured to receive the first light reflected by the second reflecting surface. In a top view, part or all of the first light receiving region overlaps part or all of the first reflecting surface.

Abstract: A game system, a game method, and a game program, which allow the user to enjoy a game with peace of mind even if a bias is provided in predetermined parameters. The game system is configured to acquire, as available environment information indicating an available environment for a game to be executed on a user terminal used by the user, information indicating a type of an operating system (OS); and determine a parameter to be used to provide a content to the user each time the user performs an input operation on the basis of the information indicating the type of the OS associated with the user at the time of the input operation.

Abstract: A light emitting device includes: a lens member having at least one lens surface; a submount; and a plurality of light emitting elements arranged in a row on an upper face of the submount, including a first light emitting element configured to emit first light having an emission peak at a first wavelength and a second light emitting element configured to emit second light having an emission peak at a second wavelength from a second light emission point, the second wavelength being different from the first wavelength, and the second light emission point being located farther from the lens member than a first plane that is perpendicular to an optical axis of the lens surface and that passes through the first light emission point.

Abstract: A metal titanium production apparatus includes: a reductor that subjects titanium tetrachloride to a reduction process in presence of bismuth and magnesium to obtain a liquid alloy containing titanium and the bismuth; a segregator that subjects the liquid alloy to a segregation process to obtain a precipitate; and a distillator that subjects the precipitate to a distillation process to obtain metal titanium, and the distillator sets an atmosphere so as to preferentially vaporize the bismuth attached to the precipitate and then sets the atmosphere so as to vaporize the bismuth forming the precipitate.

Abstract: A heat exchange structure includes: two flow channels stacked in a stacking direction (Y direction) and thermally coupled to each other; and a fin structure detachably installed in at least one flow channel of the two flow channels. The fin structure includes fins arranged in a longitudinal direction (Z direction) of the at least one flow channel in which the fin structure is installed, the fins configured to form openings alternately arranged along the at least one flow channel on one side and the other side of the at least one flow channel in the stacking direction.

Abstract: A heat exchange structure includes: two flow channels stacked in a stacking direction (Y direction) and thermally coupled to each other; and a fin structure detachably installed in at least one flow channel of the two flow channels. The fin structure includes fins arranged in a longitudinal direction (Z direction) of the at least one flow channel in which the fin structure is installed, the fins configured to form openings alternately arranged along the at least one flow channel on one side and the other side of the at least one flow channel in a width direction (X direction).

Abstract: A light emitting device includes: a substrate including a main surface; a first projection positioned on the main surface, the first projection including an upper surface and first and second lateral surfaces, wherein the first lateral surface of the first projection comprises a first reflective part, and the second lateral surface of the first projection comprises a second reflective part; a first laser element configured to irradiate laser light to the first reflective part; a second laser element configured to irradiate laser light to the second reflective part; and a first optical member fixed to the upper surface of the first projection, wherein the first optical member comprises a first lens part positioned above the first reflective part, and a second lens part positioned above the second reflective part.

Abstract: A light-emitting device includes a mounting member, first to third light-emitting elements mounted on a mounting surface, and first to third protective elements mounted on the mounting surface and respectively electrically connected to the first to third light-emitting elements. In a plan view viewed along a normal direction of the mounting surface, at least a part of the first protective element is disposed between the first light-emitting element and the second light-emitting element, at least a part of the second protective element and at least a part of the third protective element are disposed between the second light-emitting element and the third light-emitting element, and the second light-emitting element is disposed between the first light-emitting element and the third light-emitting element.

Abstract: A light emitting module includes: a first light emitting device including: a first package, a plurality of first semiconductor laser elements mounted in the first package, and a first lens member having lens portions, a number of the lens portion is the same as a number of the first semiconductor laser elements; and a second light emitting device including: a second package, a plurality of second semiconductor laser elements mounted in the second package, wherein a quantity of the second semiconductor laser elements is fewer than a quantity of the first semiconductor laser elements, and a second lens member which is structured the same as the first lens member; and one or more mounting substrates in which the first light emitting device and the second light emitting device are mounted.

Abstract: A transmission line includes a substrate including insulator layers, a mounting electrode on a front layer of the substrate, a signal conductor, a first ground conductor, a first connecting electrode that electrically connects the mounting electrode and the signal conductor and is between the signal conductor and the first ground conductor in a laminating direction, a first inter-layer connecting conductor that is electrically connected between the mounting electrode and the first connecting electrode and is bonded to the first connecting electrode, and a second inter-layer connecting conductor that is electrically connected between the signal conductor and the first connecting electrode, is bonded to the first connecting electrode, and does not overlap with the first inter-layer connecting conductor when viewed in the laminating direction. The first ground conductor does not overlap with at least a portion of the first connecting electrode when viewed in the laminating direction.

Abstract: A light emission device includes: a base part; a semiconductor laser device disposed on the base part; a frame body fixed to the base part and provided around the semiconductor laser device; a lid bonded to an upper surface of the frame body; and a first electrical conduction member bonded to an outer surface of the base part or an outer surface of the frame body, the first electrical conduction member having a first conductive region and a second conductive region that are electrically connected to the semiconductor laser device. In a top plan view, the first electrical conduction member includes a first portion overlapping the frame body and a second portion not overlapping the frame body, the first conductive region being contained in the first portion, and the second conductive region being contained in the second portion.

Abstract: A method of manufacturing a light emitting module comprising at least one light emitting device in which a plurality of light emitting elements are mounted, includes: providing a plurality of light emitting devices including one or more first light emitting devices and one or more second light emitting devices, wherein a number of the light emitting elements mounted in the first light emitting device is different from a number of the light emitting elements mounted in the second light emitting device; providing a first mounting substrate having a mounting surface provided with a plurality of connection patterns having the same pattern, each of the connection patterns corresponding to a respective one of the light emitting devices; and mounting at least some of the plurality of light emitting devices, selected from the one or more first light emitting devices and one or more second light emitting devices, on the connection patterns.

Abstract: An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.

Abstract: A light-emitting device includes first and second light-emitting elements, upper submounts, and a lower submount. The upper submounts include a first submount having a first upper surface and a first lateral surface located on a same side as an emission end surface of the first light-emitting element, and a second submount having a second upper surface and a second lateral surface located on a same side as an emission end surface of the second light-emitting element. In a top plan view, the first lateral surface is located forward relative to the second lateral surface, and the emission end surface of the first light-emitting element is located forward relative to the emission end surface of the second light-emitting element. At least a portion of the first lateral surface is protruded forward relative to an edge along which an upper surface and a lateral surface of the lower submount meet.

Abstract: A light emission device includes: a base part; a semiconductor laser device disposed on the base part; a frame body fixed to the base part and provided around the semiconductor laser device; a lid bonded to an upper surface of the frame body; and a first electrical conduction member bonded to an outer surface of the base part or an outer surface of the frame body, the first electrical conduction member having a first conductive region and a second conductive region that are electrically connected to the semiconductor laser device. In a top plan view, the first electrical conduction member includes a first portion overlapping the frame body and a second portion not overlapping the frame body, the first conductive region being contained in the first portion, and the second conductive region being contained in the second portion.

Abstract: A light emitting device includes a package, a cap fixed to the package, and at least one laser element. The cap includes a light-transmissive member having a lower surface facing the package and an upper surface opposite to the lower surface, and a light blocking film arranged on the lower surface of the light-transmissive member and having a shape which has at least one opening. The at least one laser element is disposed in a space bounded by the cap and the package at a position such that the at least one opening is irradiated by laser light emitted from the at least one laser element, at least a part of each of the at least one laser element being disposed in the at least one opening in the light blocking film in a top view.

Abstract: A light-emitting device includes: a first light-emitting element including a first light-emission surface through which first light is emitted along a first optical axis; a second light-emitting element disposed apart from the first light-emitting element in a first direction that is perpendicular to the first optical axis, the second light-emitting element including a second light-emission surface through which second light is emitted along a second optical axis that is inclined with respect to the first optical axis in a second direction opposite to the first direction; and a third light-emitting element disposed apart from the first light-emitting element in the second direction, wherein the third light-emitting element includes a third light-emission surface through which third light is emitted along a third optical axis that is inclined with respect to the first optical axis in the first direction.