Abstract: According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous existence of the light-emitting element section is equal to or higher than 10 lm/mm2 and equal to or lower than 100 lm/mm2. The thermal radiation member has an area equal to or larger than five times the area of the mounting region.

Abstract: According to one embodiment, there is provided a light emitting module including a board, a semiconductor light emitting element, an electronic component, a first pad, and a second pad. The surface of the first pad on the board is covered with a metal film. The semiconductor light emitting element is mounted on the first pad. The surface of the second pad on the board is covered with a metal film. The electric component is mounted on the second pad. The semiconductor light emitting element is wire-bonded on the first pad covered with the metal film. The electric component is joined by solder on the second pad covered with the metal film. The metal film covering the first pad has a film structure lower in density than the metal film covering the second pad.

Abstract: According to one embodiment, a light-emitting device includes a ceramic substrate, a light-emitting element, a metal layer, a metal connector and a joint member. The ceramic substrate includes a main surface. The light-emitting element is provided on the main surface. The metal layer is provided on the main surface and is electrically connected to the light-emitting element. The metal connector includes a connector part and an extension part extending from the connector part. The joint member joins at least a part of the extension part to the metal layer. An angle between a lower portion of a side surface of the joint member on the connector part side and a lower surface of the joint member in contact with the metal layer is 90 degrees or less. A portion of the extension part on an opposite side to the connector part is partly covered with the joint member.

Abstract: According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous exitance of the light-emitting element section is equal to or higher than 101 m/mm2 and equal to or lower than 1001 m/mm2. The thermal radiation member has an area equal to or larger than five times the area of the mounting region.

Abstract: According to one embodiment, a wiring board includes a base assuming a flat plate shape, a wiring pattern provided in a position on one surface of the base and apart from a peripheral edge of the base, a first metal layer provided on the opposite side of the base side of the wiring pattern, and a second metal layer configured to cover the first metal layer and a sidewall of the wiring pattern.

Abstract: A light emitting module according to embodiments includes a substrate. In addition, the light emitting module according to the embodiments includes a light emitting element which is provided on the substrate. In addition, the light emitting module according to the embodiments includes a reflecting member which is provided on the substrate, formed of a material containing silicon resin, of which Martens hardness of the material is any value in a range of 0.05 (N/mm2) or more and 10.0 (N/mm2) or less, and which reflects light which is emitted from the light emitting element.

Abstract: According to one embodiment, a wiring board device is provided in which even if the temperature of a ceramic board becomes high, the influence on a connector can be reduced and the occurrence of defects due to heat can be prevented. The wiring board device includes a common member. The ceramic board and the connector are placed on the common member. A wiring pattern of the ceramic board and the connector are electrically connected by wiring.

Abstract: According to one embodiment, a wiring board device includes a ceramic board including a first surface and a second surface. A first electrode layer is formed on the first surface of the ceramic board, and a second electrode layer is formed on the second surface of the ceramic board. The first electrode layer and the second electrode layer are not electrically connected to each other. A first copper plated layer as a wiring pattern is formed on the first electrode layer, and a second copper plated layer is formed on the second electrode layer. The first copper plated layer and the second copper plated layer are not electrically connected to each other. A heat spreader is thermally connected to the second copper plated layer.

Abstract: A tire building apparatus 1 forms a preset bead by winding and laminating a ribbon-shaped bead filler rubber Fr on the radially outer side of a bead core B for two or more laps. The apparatus includes: a bead core-supporting ring 2 extending along a circumferential direction and supporting the bead core B on a radially outer surface of the ring 2; a lamination plate 3 raised from one axial end of the ring 2 and having a side surface on which the bead filler rubber Fr is laminated; a winding device 4 for winding the bead filler rubber Fr on the side face of the lamination plate 3; and a bead core-positioning device 5 for axially positioning the bead core B on the ring 2. The device 5 has a swing plate 10 swinging around an axis Z parallel to a tangential direction of the ring 2.

Abstract: A high-pressure discharge lamp is characterized by including a translucent airtight container having a discharging space in an internal portion, electrodes for causing discharge in the discharging space of the translucent airtight container, and an ionization medium sealed in the translucent airtight container and containing a metal halide and rare gas, the metal halide including at least one type of halides of thulium and holmium whose sealing ratio with respect to the total amount of sealed metal halides is not lower than 30 mass % and the rare gas is xenon at not lower than 3 atm at 25° C., and the high-pressure discharge lamp is characterized in that mercury and a metal halide for formation of lamp voltage are not substantially contained in the translucent airtight container.

Abstract: A high-pressure discharge lamp includes a translucent ceramic discharge vessel having a surrounding part formed of translucent ceramic, and a pipe connected to the surrounding part, formed of translucent ceramic having an average crystal particle size of 50 ?m or less in a region close to an intended sealing portion, and having a smaller diameter than the surrounding part. A current introducing conductor is inserted into the pipe of the translucent ceramic discharge vessel, and is sealed at least by a sealing portion formed by fusion of the translucent ceramic in the pipe. An electrode is connected to and disposed in the current introducing conductor in the translucent ceramic discharge vessel. A discharge medium is sealed in the translucent ceramic discharge vessel.

Abstract: A metal halide lamp comprises a discharge container including a discharge space and a pair of sealing sections. A discharge medium containing a metal halide and a rare gas and essentially free from mercury is sealed in the discharge container. A pair of electrodes are arranged to face each other within the discharge space, and the side edge portions on the side of the proximal end portion of these electrodes are held by the sealing sections. The amount of water contained in the metal halide, i.e., the light-emitting material, included in the metal halide lamp essentially free from mercury, i.e., Hg-less metal halide lamp, is controlled to 50 ppm or less.

Abstract: A metal halide lamp comprises a discharge container including a discharge space and a pair of sealing sections. A discharge medium containing a metal halide and a rare gas and essentially free from mercury is sealed in the discharge container. A pair of electrodes are arranged to face each other within the discharge space, and the side edge portions on the side of the proximal end portion of these electrodes are held by the sealing sections. The amount of water contained in the metal halide, i.e., the light-emitting material, included in the metal halide lamp essentially free from mercury, i.e., Hg-less metal halide lamp, is controlled to 50 ppm or less.