Abstract: An optical module includes a substrate, an optical element, and an optical coupling module. The substrate includes a glass cloth constituted of glass threads serving as weft and warp. An outer edge of the substrate has a rectangular shape defined by a pair of first side surfaces in a predetermined direction and a pair of second side surfaces in a direction orthogonal to the predetermined direction. The weft is inclined with respect to the first side surfaces and the second side surfaces. The warp is inclined with respect to the first side surfaces and the second side surfaces. A cavity is formed in the substrate. At least a part of the optical coupling module is accommodated in the cavity. A side surface of the cavity includes an inclined region inclined with respect to an extension direction of the weft and an extension direction of the warp.

Abstract: An optical waveguide component includes a base member, and a plurality of optical waveguides extending in a first direction inside the base member and being arranged in a second direction intersecting the first direction. Each of the plurality of optical waveguides has a pair of end portions. The base member includes a positioning structure configured to position the base member and has a surface at which the pairs of end portions are exposed. Each of the plurality of optical waveguides includes a curved portion curved in the second direction. The positioning structure is disposed at a position overlapping with the curved portions in the second direction.

Abstract: An optical device includes: a host device having a first housing, a first optical connector arranged inside the first housing, and an electrical connector arranged inside the first housing; and a light-emitting device having a second optical connector optically connected to the first optical connector, an electrical plug electrically connected to the electrical connector, and a second housing accommodating the second optical connector and the electrical plug and inserted into the first housing. The second housing has a latch structure latched onto the first housing when inserted into the first housing.

Abstract: A metal magnetic particle provided with an oxide layer on a surface of an alloy particle containing Fe and Si. The oxide layer has a first oxide layer, a second oxide layer, a third oxide layer, and a fourth oxide layer. Also, in line analysis of element content by using a scanning transmission electron microscope-energy dispersive X-ray spectroscopy, the first oxide layer is a layer where Fe content takes a local maximum value, the second oxide layer is a layer where Fe content takes a local maximum value, the third oxide layer is a layer where Si content takes a local maximum value, and the fourth oxide layer is a layer where Fe content takes a local maximum value.

Abstract: A monitoring system according to one aspect of the present disclosure includes: a sensor to measure physical quantities at one or a plurality of measurement points of a structural body; processing circuitry configured to acquire measured values from the measurer; a memory to store the measured values acquired from the measurer; and a data storage that, when one or some of the measured values stored in the memory satisfy a predetermined trigger condition, and as a result, it is determined that the structural body has received impact, records a group of data of the measured values which are within a certain time range and include the measured value based on which it is determined that the trigger condition is satisfied.

Abstract: A die pad, a signal processing IC, an adhesive layer, and at least one magnetoelectric conversion element included in a magnetic sensor are encapsulated by a molding resin. At least a part of the first end surface of the signal processing IC is positioned on a side closer to the at least one magnetoelectric conversion element than a first end surface of the die pad on a side of the at least one magnetoelectric conversion element in a plan view. An isolation portion into which the molding resin enters is provided between the first surface of the die pad on a side of the first end surface, and the first surface of the signal processing IC on a side of the first end surface, and a thickness of the isolation portion is smaller than a thickness of the die pad.

Abstract: Advantage is taken of the fact that tin has a higher efficiency of absorption of a laser beam than, for example, copper. A method of manufacturing a coil component includes preparing a wire that includes a linear, central conductor and an insulating coating that covers a circumferential surface of the central conductor, preparing a metal terminal that is to be electrically connected to the central conductor at an end portion of the wire and that has a surface on which a tin-containing film that contains tin is disposed and above which at least the end portion of the wire is to be disposed, and welding the central conductor of the wire to the metal terminal by irradiating at least the tin-containing film with a laser beam with the end portion of the wire disposed along the tin-containing film.

Abstract: A metal magnetic particle provided with an oxide layer on a surface of an alloy particle containing Fe and Si, wherein the oxide layer has a first oxide layer, a second oxide layer, and a third oxide layer from the alloy particle side. Also, in line analysis of element content by using a scanning transmission electron microscope-energy dispersive X-ray spectroscopy, the first oxide layer is a layer where Si content takes a local maximum value, the second oxide layer is a layer where Fe content takes a local maximum value, and the third oxide layer is a layer where Si content takes a local maximum value.

Abstract: An optical module includes a substrate, an optical element, and an optical coupling module. The substrate includes a glass cloth constituted of glass threads serving as weft and warp. An outer edge of the substrate has a rectangular shape defined by a pair of first side surfaces in a predetermined direction and a pair of second side surfaces in a direction orthogonal to the predetermined direction. The weft is inclined with respect to the first side surfaces and the second side surfaces. The warp is inclined with respect to the first side surfaces and the second side surfaces. A cavity is formed in the substrate. At least a part of the optical coupling module is accommodated in the cavity. A side surface of the cavity includes an inclined region inclined with respect to an extension direction of the weft and an extension direction of the warp.

Abstract: A metal magnetic particle provided with an oxide layer on a surface of an alloy particle containing Fe and Si, wherein the oxide layer has a first oxide layer, a second oxide layer, and a third oxide layer from the alloy particle side. Also, in line analysis of element content by using a scanning transmission electron microscope-energy dispersive X-ray spectroscopy, the first oxide layer is a layer where Si content takes a local maximum value, the second oxide layer is a layer where Fe content takes a local maximum value, and the third oxide layer is a layer where Si content takes a local maximum value.

Abstract: An inductor is provided so that reduction in DC superposition characteristics can be suppressed even when a filling rate of a magnetic powder is increased. The inductor includes a coil including a winding portion and a pair of extended portions extended from the winding portion, and a body having the coil embedded therein and containing a magnetic powder containing a first magnetic powder and a second magnetic powder, in which an average particle diameter of the first magnetic powder is larger than an average particle diameter of the second magnetic powder. In a cross section of the body including a winding axis of the winding portion and extending in a long side direction of the body, Voronoi partition is performed with a center of gravity of each magnetic powder as a generating point.

Abstract: A current sensor is configured by at least one magnetoelectric conversion element, a conductor, and a signal processing IC being encapsulated by an encapsulating portion. The current sensor includes a pair of first lead terminals that is partially exposed outside of the encapsulating portion, is electrically connected to the conductor, inputs the measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor; and a supporting portion that supports the at least one magnetoelectric conversion element, the signal processing IC, and the metal member on a first surface, is separated from the conductor, and is separate from the metal member.

Abstract: An optical module includes a substrate, an optical element, and a lens module. The optical element is mounted on the substrate. The lens module includes an outer surface and an inner surface facing each other and a lens provided on the inner surface so as to be optically coupled to the optical element and optically couples an optical fiber with the optical element through the lens. The lens module is mounted on the substrate such that the inner surface faces the substrate and is attached to the substrate with an adhesive introduced into a gap between the inner surface and the substrate. The optical module is provided with an inflow prevention structure that prevents inflow of the adhesive to an optical axis of the lens between the substrate and the lens module and between the lens and the adhesive.

Abstract: An optical module includes a substrate, an optical element, an optical coupling module, and an adhesive. The substrate includes a glass cloth therein. The optical element is mounted on the substrate. The optical coupling module is configured to be optically coupled to the optical element. The adhesive fixes the optical coupling module to the substrate. A cavity recessed from a first main surface of the substrate toward a second main surface of the substrate so as to include a bottom portion is formed in the substrate. At least a part of the optical coupling module is accommodated in the cavity. The glass cloth includes a protruding portion protruding into the cavity from a side surface of the cavity. The protruding portion is stuck into the adhesive positioned between the side surface and the optical coupling module.

Abstract: A current sensor is configured by at least one magnetoelectric conversion element, a conductor, and a signal processing IC being encapsulated by an encapsulating portion. The current sensor includes a pair of first lead terminals that is partially exposed outside of the encapsulating portion, is electrically connected to the conductor, inputs the measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor; and a supporting portion that supports the at least one magnetoelectric conversion element, the signal processing IC, and the metal member on a first surface, is separated from the conductor, and is separate from the metal member.