Abstract: A liquid ejection head includes a recording element substrate including an energy generating element configured to generate energy for ejecting liquid from an ejection port; an electrical wiring board electrically connected to the recording element substrate to supply an electric signal for driving the energy generating element; a first support member supporting the recording element substrate; and a second support member supporting the first support member and having a greater linear expansion coefficient than that of the electrical wiring board. The electrical wiring board is bonded to a first surface of the first support member and a second surface of the second support member, and an adhesive that bonds the electrical wiring board to the second surface has a lower elastic modulus than that of an adhesive that bonds the electrical wiring board to the first surface.

Abstract: A liquid ejection head includes a recording element substrate, a flow path member having a common supply flow path and a common collection flow path through which a liquid having a temperature higher than a temperature of the common supply flow path flows, and a support member supporting the flow path member. The common supply flow path and the common collection flow path are formed to extend along a longitudinal direction of the flow path member and be arranged side by side with each other in a lateral direction of the flow path member. The positions of the flow path member in the longitudinal direction and in the lateral direction are defined at a center portion in the longitudinal direction, and at a side surface located on the common supply flow path side in the lateral direction, among side surfaces extending in the longitudinal direction, respectively.

Abstract: Provided is a liquid ejection head and a liquid ejection apparatus in which separation of ejection modules from a support member is suppressed. To this end, a liquid supply unit is aligned with respect to the support member to which the ejection modules are bonded. Moreover, in a connection unit of an ejection unit and the liquid supply unit, liquid connection units of the ejection unit are connected to be movable relative to the liquid supply unit.

Abstract: A technology capable of suppressing misalignment of the arrangement position of an ejection substrate even if a flow path member thermally expands is provided. A module equipped with a substrate that ejects a liquid and a flow path that is fluidly connected to the substrate is inserted and engaged with a frame that supports a support member for supporting the substrate so that the frame and the flow path face each other via a space in a direction intersecting an inserting direction. Further, the module abuts on the frame in the inserting direction in a case of being inserted and engaged with the frame, so as to be supported.

Abstract: An object is to improve the structural reliability of a liquid ejection head. To achieve this, a liquid ejection head includes a first substrate having ejection ports, liquid chambers, and energy generation elements, and a second substrate joined to a second surface of the first substrate situated opposite to its first surface. The first substrate includes projecting areas projecting from end portions of the second substrate in a planar direction perpendicular to a first-axis direction (z-axis direction). Terminals to be electrically connected to the energy generation elements are provided at the second surfaces of the projecting areas. A support member 401 is joined to the first surface of the first substrate, has an opening at a position opposed to where the ejection ports are formed, and is fixed to the frame.

Abstract: A manufacturing method of a liquid ejection head including manufacturing a flow path constituting member for supplying a liquid to an ejection module, the manufacturing a flow path constituting member including using a metal mold which is constituted of a fixed mold and a movable mold, the manufacturing a flow path constituting member including: a first step of molding a first member, a second member, and a third member independently at locations different from each other in the metal mold, the first member, the second member, and the third member constituting the flow path constituting member; a second step of joining the first member and the second member in a specific manner; and a third step of joining the second member and the third member in a specific manner.

Abstract: A liquid ejection head with which print of good print quality can be obtained and a method of manufacturing the liquid ejection head are provided. For that purpose, warped flow path members are joined to each other as flow path members used for a print head to form a flow path member warped in a direction opposite to a direction of warpage due to a temperature rise during printing.

Abstract: A liquid ejection head includes a recording element substrate including an energy generating element configured to generate energy for ejecting liquid from an ejection port; an electrical wiring board electrically connected to the recording element substrate to supply an electric signal for driving the energy generating element; a first support member supporting the recording element substrate; and a second support member supporting the first support member and having a greater linear expansion coefficient than the electrical wiring board, wherein the electrical wiring board is bonded to a first surface of the first support member and a second surface of the second support member, and an adhesive that bonds the electrical wiring board to the second surface has a lower elastic modulus than an adhesive that bonds the electrical wiring board to the first surface.

Abstract: A liquid ejection head 3 includes: a liquid ejection part 3a configured to eject a liquid; and a guide part 20b provided upstream of the liquid ejection part 3a with respect to a conveying direction A of a recording medium 2 and configured to guide the front end of a recording medium 2 conveyed to the liquid ejection part 3a. The guide part 20b has an inclined surface 20c inclined so as to be more spaced apart from a conveyance path for the recording medium 2 as the inclined surface 20c is more distant from the liquid ejection part 3a.

Abstract: A liquid ejection head includes a recording element substrate, a flow path member having a common supply flow path and a common collection flow path through which a liquid having a temperature higher than a temperature of the common supply flow path flows, and a support member supporting the flow path member. The common supply flow path and the common collection flow path are formed to extend along a longitudinal direction of the flow path member and be arranged side by side with each other in a lateral direction of the flow path member. The positions of the flow path member in the longitudinal direction and in the lateral direction are defined at a center portion in the longitudinal direction, and at a side surface located on the common supply flow path side in the lateral direction, among side surfaces extending in the longitudinal direction, respectively.

Abstract: A manufacturing method of a liquid ejection head including manufacturing a flow path constituting member for supplying a liquid to an ejection module, the manufacturing a flow path constituting member including using a metal mold which is constituted of a fixed mold and a movable mold, the manufacturing a flow path constituting member including: a first step of molding a first member, a second member, and a third member independently at locations different from each other in the metal mold, the first member, the second member, and the third member constituting the flow path constituting member; a second step of joining the first member and the second member in a specific manner; and a third step of joining the second member and the third member in a specific manner.

Abstract: A resin molding method includes a first molding step, a sliding step, a second molding step and a mold opening step. In the first molding step, first molded part supported in a fixed mold and a second molded part supported in a die slide mold are molded in different positions in a second direction. In the sliding step, the movable mold is removed in a first direction and the first molded part and the second molded part are aligned by the die slide mold is moved in the second direction. In the second molding step, the movable mold is clamped again with the fixed mold and resin is injected into engaged portions. Each of the first molded part and the second molded part includes at least one wall extending in the first direction, and in the second molding step, the first molded part and the second molded part are engaged with each other at sides of the walls extending in the first direction.

Abstract: An inkjet printing apparatus includes a print head, to which a protective member configured to protect an ejection opening surface is attachable, and a head holder configured to hold the print head detachably. The inkjet printing apparatus further includes a guide portion provided in the head holder and configured to guide, in a width direction, the print head with the ejection opening surface protected by the protective member. The guide portion guides the print head with the protective member attached up to a predetermined position in the width direction and guides only the print head ahead of the predetermined position to prevent the protective member from exceeding the predetermined position.

Abstract: There is provided a liquid supply member capable of suppressing deformation of a liquid supply path and decrease in sealing property of a liquid supply path, during molding, and a manufacturing method of the liquid supply member. For that purpose, in die-slide injection molding that combines two components, a protection portion that protects a part of one component easily affected by heat and pressure, is provided on the other component.

Abstract: There is provided a manufacturing method of a liquid supply member capable of suppressing decrease in sealing property of a liquid supply path and deformation of the liquid supply path or the external shape. For that purpose, a manufacturing process of a liquid supply member prevents inflow of a molten resin into a concave portion of a portion other than a liquid supply flow path in a liquid supply member.

Abstract: A method of manufacturing a liquid supply unit includes a first molding step and a second molding step. In a first molding step, a resin is injected into different positions inside a mold assembly and a first member having a first contact portion, a second member having a second contact portion and an intermediate passage member having a passage structure to connect the first contact portion to the second contact portion are molded. In a second molding step, the mold assembly is disassembled, a die slide mold disposed inside the mold assembly is moved for positioning the members. Then, the mold assembly is clamped again and a resin is injected into the mold assembly. The first contact portion and the second contact portion are respectively held on the same surfaces inside the mold assembly during a period from the first molding step to completion of the second molding step.

Abstract: A molded part including a first member having a plurality of openings and a second member contacting with a peripheral edge of each of the plurality of openings so as to cover the openings, and having a hollow portion formed by sealing the contact portion with a sealing material, wherein: the second member defines a flow channel for filling the sealing material between the first member and the second member; the second member has a branched shape in which sections corresponding to positions covering the plurality of openings are branched from each other, and portions near a gate of the flow channel are connected as a common section; and the branched shape has a bridge structure for connecting the respective branched sections.

Abstract: A liquid ejection head includes an element substrate including an energy-generating element that applies ejection energy to liquid, a first electric wiring board electrically connected to the element substrate, and a second electric wiring board on which an integrated circuit element is mounted and which is electrically connected to the first electric wiring board. An electric signal is supplied to the integrated circuit element mounted on the second electric wiring board through the first electric wiring board, processed by the integrated circuit element, and supplied to the energy-generating element through the second electric wiring board and the first electric wiring board.

Abstract: A liquid ejection head includes an element substrate including an energy-generating element that applies ejection energy to liquid, a first electric wiring board electrically connected to the element substrate, and a second electric wiring board on which an integrated circuit element is mounted and which is electrically connected to the first electric wiring board. An electric signal is supplied to the integrated circuit element mounted on the second electric wiring board through the first electric wiring board, processed by the integrated circuit element, and supplied to the energy-generating element through the second electric wiring board and the first electric wiring board.

Abstract: A liquid ejection head unit is formed by arranging a plurality of recording element substrates in a first direction. Each recording element substrate has an ejection orifice from which a liquid is ejected. The liquid ejection head unit includes rail portions extending in the first direction and a protective member which is detachably fitted on the rail portions. The protective member is movable along the rail portions between a first position and a second position. The first position allows the protective member to cover whole surfaces of the plurality of recording element substrates. The second position allows the plurality of recording element substrates to be exposed so as to allow a liquid to be ejected from the ejection orifices.