Abstract: A signal processing device includes a detection circuit, a correction circuit, and a comparator circuit. The detection circuit generates a first detection signal, based on an output signal of a capacitive detection element that detects inertial force. The correction circuit corrects non-linearity of the first detection signal and outputs a second detection signal thus corrected. The comparator circuit compares the first detection signal and the second detection signal with each other and outputs a comparison signal representing a result of comparison.

Abstract: A signal processing device includes detection circuitry and correction circuitry. The detection circuitry includes a first detection unit and a second detection unit. The first detection unit generates at least one detection signal based on an associated one of output signals corresponding to each of at least two directions. The second detection unit has a broader detection range than the first detection unit and generates at least one correction signal based on the associated one of the output signals corresponding to each of the at least two directions. The correction circuitry corrects an associated one of the detection signals corresponding to each of the at least two directions with at least an associated one of the correction signals corresponding to at least one direction, other than one direction subjected to correction, out of the at least two directions.

Abstract: A signal processing device includes a detection circuit, a correction circuit, and a comparator circuit. The detection circuit generates a first detection signal, based on an output signal of a capacitive detection element that detects inertial force. The correction circuit corrects non-linearity of the first detection signal and outputs a second detection signal thus corrected. The comparator circuit compares the first detection signal and the second detection signal with each other and outputs a comparison signal representing a result of comparison.

Abstract: A connection assembly includes a sensor substrate, a layer substrate coupled to the sensor substrate so as to face an upper surface of the sensor substrate, and a wire connected between the sensor substrate and the layer substrate. The sensor substrate includes first and second projections provide on the upper surface of the sensor substrate and extending in an extension direction along the upper surface of the sensor substrate. The wire has a first end sandwiched between the layer substrate and the first projection, and a second end sandwiched between the layer substrate and the second projection. The connection assembly provides reliable connection.

Abstract: A connection assembly includes a sensor substrate, a layer substrate coupled to the sensor substrate so as to face an upper surface of the sensor substrate, and a wire connected between the sensor substrate and the layer substrate. The sensor substrate includes first and second projections provide on the upper surface of the sensor substrate and extending in an extension direction along the upper surface of the sensor substrate. The wire has a first end sandwiched between the layer substrate and the first projection, and a second end sandwiched between the layer substrate and the second projection. The connection assembly provides reliable connection.

Abstract: An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process.

Abstract: An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process.