Patents by Inventor Takuya KOTSUBO

Takuya KOTSUBO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing resin multilayer substrate
    Patent number: 9894780
    Abstract: A method of manufacturing a resin multilayer substrate with a cavity, includes stacking insulation substrates including thermoplastic resins and thermocompression-bonding the insulation substrates. At least one of the insulation substrates is formed by affixing a peelable carrier film to one main surface of the insulation substrate, making a cut in the insulation substrate having the carrier film affixed thereto, the cut being designed to form the cavity, penetrating the insulation substrate in a thickness direction and not penetrating the carrier film in a thickness direction, and removing the carrier film and a portion of the insulation substrate that is cut out by the cut.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: February 13, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takuya Kotsubo, Shunsuke Chisaka
  • METHOD OF MANUFACTURING RESIN MULTILAYER SUBSTRATE
    Publication number: 20150113802
    Abstract: A method of manufacturing a resin multilayer substrate with a cavity, includes stacking insulation substrates including thermoplastic resins and thermocompression-bonding the insulation substrates. At least one of the insulation substrates is formed by affixing a peelable carrier film to one main surface of the insulation substrate, making a cut in the insulation substrate having the carrier film affixed thereto, the cut being designed to form the cavity, penetrating the insulation substrate in a thickness direction and not penetrating the carrier film in a thickness direction, and removing the carrier film and a portion of the insulation substrate that is cut out by the cut.
    Type: Application
    Filed: January 9, 2015
    Publication date: April 30, 2015
    Inventors: Takuya KOTSUBO, Shunsuke CHISAKA