Abstract: In a substrate treating unit, a removal liquid supplying mechanism supplies a removal liquid to the surface of a substrate. In order to retain the removal liquid on the surface of the substrate for a fixed time, a spin chuck is operated to spin the substrate at such a low speed as to retain the removal liquid on the substrate, or spins the substrate intermittently, or temporarily stops spinning of the substrate. Thus, treatment with the removal liquid progresses without a further supply of the removal liquid, thereby restraining consumption of the removal liquid.

Abstract: In a substrate treating unit, a removal liquid supplying mechanism supplies a removal liquid to the surface of a substrate. In order to retain the removal liquid on the surface of the substrate for a fixed time, a spin chuck is operated to spin the substrate at such a low speed as to retain the removal liquid on the substrate, or spins the substrate intermittently, or temporarily stops spinning of the substrate. Thus, treatment with the removal liquid progresses without a further supply of the removal liquid, thereby restraining consumption of the removal liquid.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: A substrate treating apparatus includes a cleaning medium feed mechanism having a discharge nozzle for discharging warm water as a cleaning medium toward a substrate. The discharge nozzle is reciprocable between a position opposed to the center of rotation of the substrate held and rotated by a spin chuck and a position opposed to the edge of the substrate. The discharge nozzle is connected to a deionized water source through a solenoid valve and a heater. Deionized water fed from the deionized water source is heated warm and supplied to the substrate through the discharge nozzle.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: The invention provides a highly-reliable face collation apparatus and biometrics data collation apparatus in both of which when a person is to be identified, even at the time of a collation in which characteristic data on the person approximates to characteristic data on one of the other persons, the characteristic data are comprehensively collated by combination, whereby the person and the other person can be clearly discriminated from each other to reduce collation errors.

Abstract: In a substrate treating unit, a removal liquid supplying mechanism supplies a removal liquid to the surface of a substrate. In order to retain the removal liquid on the surface of the substrate for a fixed time, a spin chuck is operated to spin the substrate at such a low speed as to retain the removal liquid on the substrate, or spins the substrate intermittently, or temporarily stops spinning of the substrate. Thus, treatment with the removal liquid progresses without a further supply of the removal liquid, thereby restraining consumption of the removal liquid.

Abstract: A substrate treating apparatus includes a cleaning medium feed mechanism having a discharge nozzle for discharging warm water as a cleaning medium toward a substrate. The discharge nozzle is reciprocable between a position opposed to the center of rotation of the substrate held and rotated by a spin chuck and a position opposed to the edge of the substrate. The discharge nozzle is connected to a deionized water source through a solenoid valve and a heater. Deionized water fed from the deionized water source is heated warm and supplied to the substrate through the discharge nozzle.

Abstract: A removal liquid is supplied to a substrate on which a thin film formed is patterned by dry etching using a resist film as a mask, and cleaning is made with de-ionized water, thereby removing a reaction product generated on the surface of the substrate. After that, the processed substrate is heated, thereby completely drying the substrate from which the reaction product has been eliminated.

Abstract: There are provided a living body collating device, a living body collating system and a living body collating method, which is equipped with optimization candidate data extracting means 35 for extracting optimization candidate data for data renewal from past record data of living body information achieved, optimization candidate data storage means 36 for storing the optimization candidate data extracted by the optimization candidate data extracting means 35, and renewal storage means 37 for storing, as new registration data, the data having higher priorities of the optimization candidate data stored in the optimization candidate data storage means 36 and registration data stored in registration data storage means.

Abstract: A removal liquid is supplied to a substrate on which a thin film formed is patterned by dry etching using a resist film as a mask, and cleaning is made with de-ionized water, thereby removing a reaction product generated on the surface of the substrate. After that, the processed substrate is heated, thereby completely drying the substrate from which the reaction product has been eliminated.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.