Patents by Inventor Takuya Kyouda

Takuya Kyouda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8315031
    Abstract: The case mold type capacitor has a capacitor element, a pair of terminals, and molding resin. Each terminal of the pair is connected to a first electrode and a second electrode of the capacitor element, respectively. The capacitor element is embedded in the molding resin in a manner that a terminal section disposed at an end of each of terminals are partially exposed to outside. The molding resin has epoxy resin containing inorganic filler and a moisture absorbent mixed in the epoxy resin.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: November 20, 2012
    Assignee: Panasonic Corporation
    Inventors: Takuya Kyouda, Makoto Tomita, Toshiharu Saito, Shigeo Okuno
  • Patent number: 8310802
    Abstract: A metallization film capacitor that achieves both high heat resistance and high withstand voltage at the same time. A metal-deposited electrode is formed on a PEN film in each of a pair of metalized films. These metalized films are wound such that the metal-deposited electrodes face each other via the dielectric film in between. A metalized contact electrode is formed on both end faces of these wound metalized films to configure the metallization film capacitor. A divisional electrode is provided on the metal-deposited electrode. In addition, a fuse is coupled to this divisional electrode for providing a self-maintaining function. Pass rate a/b of a deposition pattern is set to 4.0 or smaller, where ‘a’ is the fuse width, and ‘b’ is the length of the divisional electrode in a lengthwise direction of the metalized films.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: November 13, 2012
    Assignee: Panasonic Corporation
    Inventors: Hiroshi Fujii, Takuya Kyouda, Hiroki Takeoka
  • Publication number: 20100226065
    Abstract: A metallization film capacitor that achieves both high heat resistance and high withstand voltage at the same time. A metal-deposited electrode is formed on a PEN film in each of a pair of metalized films. These metalized films are wound such that the metal-deposited electrodes face each other via the dielectric film in between. A metalized contact electrode is formed on both end faces of these wound metalized films to configure the metallization film capacitor. A divisional electrode is provided on the metal-deposited electrode. In addition, a fuse is coupled to this divisional electrode for providing a self-maintaining function. Pass rate a/b of a deposition pattern is set to 4.0 or smaller, where ‘a’ is the fuse width, and ‘b’ is the length of the divisional electrode in a lengthwise direction of the metalized films.
    Type: Application
    Filed: August 27, 2007
    Publication date: September 9, 2010
    Applicant: PANASONIC CORPORATION
    Inventors: Hiroshi Fujii, Takuya Kyouda, Hiroki Takeoka
  • Publication number: 20100202095
    Abstract: The case mold type capacitor has a capacitor element, a pair of terminals, and molding resin. Each terminal of the pair is connected to a first electrode and a second electrode of the capacitor element, respectively. The capacitor element is embedded in the molding resin in a manner that a terminal section disposed at an end of each of terminals are partially exposed to outside. The molding resin has epoxy resin containing inorganic filler and a moisture absorbent mixed in the epoxy resin.
    Type: Application
    Filed: October 2, 2008
    Publication date: August 12, 2010
    Inventors: Takuya Kyouda, Makoto Tomita, Toshiharu Saito, Shigeo Okuno