Abstract: To provide a laminate type solid-state battery capable of preferably accommodating an electrode laminate. A laminate type solid-state battery comprising: an electrode laminate; and a casing body being formed of a laminate film and accommodating the electrode laminate, the casing body comprising an insulating member in an interior thereof, the insulating member abutting at least one of laminate end surfaces of the electrode laminate, the insulating member having an inclined surface that outwardly inclines from the electrode laminate in a cross-sectional view along the laminate direction, the inclined surface and the laminate surface of the electrode laminate forming an angle greater than 90° and less than 180°.

Abstract: To provide a vehicular braking control device which, at the time of a collision of a host vehicle, can apply a braking force to the host vehicle while reducing the potential for a rear-end collision from a following vehicle.

Abstract: The present invention provides a photomask, a semiconductor device, and a method for exposing through the photomask. The photomask comprises a photomask substrate, and an on-mask circuit area including an on-mask circuit pattern and an on-mask test mark area including an on-mask test pattern, both formed on the surface of the substrate, wherein the photomask substrate further includes an on-mask photolithography screening mark area including an on-mask comparison pattern and an on-mask screening pattern, the on-mask comparison pattern has substantially the same configuration as at least a part of the on-mask circuit pattern, and the on-mask screening pattern has substantially the same configuration as at least a part of the on-mask test pattern. The present invention allows it to measure the actual displacement generated from an overlaying (i.e. alignment) process for the purpose of eliminating of an the overlay displacement which can take place in a photolithography process.

Abstract: A product pattern and a test pattern for managing a focus offset value are patterned onto a product wafer by means of exposure, and is patterned onto the product wafer by means of exposure. The exposed product wafer is developed. A measurement section measures the dimension of the test pattern patterned on the product wafer. On the basis of the thus-measured dimension of the test pattern, the focus off set value set in a system for manufacturing a semiconductor device is computed by a computation section. The focus offset value set in a projection optical system of the system for manufacturing a semiconductor device is adjusted by means of an adjustment section so as to become identical with the computed focus offset value.

Abstract: A product pattern and a test pattern for managing a focus offset value are patterned onto a product wafer by means of exposure, and is patterned onto the product wafer by means of exposure The exposed product wafer is developed. A measurement section measures the dimension of the test pattern patterned on the product wafer. On the basis of the thus-measured dimension of the test pattern, the focus offset value set in a system for manufacturing a semiconductor device is computed by a computation section. The focus offset value set in a projection optical system of the system for manufacturing a semiconductor device is adjusted by means of an adjustment section so as to become identical with the computed focus offset value.