Abstract: A power conversion apparatus for vehicle use having a small size and a light weight is obtained. The power conversion apparatus is provided with: a plurality of semiconductor modules in which semiconductor devices are molded with a resin, and each of which has a module body, an input terminal, and an output terminal; a heat sink of a rectangular parallelepiped shape which has cooling principal planes on opposite surfaces thereof, respectively, for cooling these semiconductor modules; and a plurality of control boards which control the driving of the semiconductor modules. Each of the semiconductor modules is arranged such that its module body has a principal plane in surface contact with one of the cooling principal planes of the heat sink, and each of the control boards is arranged in opposition to a surface of the module body at an opposed side of the principal plane thereof.

Abstract: A power conversion apparatus for vehicle use having a small size and a light weight is obtained. The power conversion apparatus is provided with: a plurality of semiconductor modules in which semiconductor devices are molded with a resin, and each of which has a module body, an input terminal, and an output terminal; a heat sink of a rectangular parallelepiped shape which has cooling principal planes on opposite surfaces thereof, respectively, for cooling these semiconductor modules; and a plurality of control boards which control the driving of the semiconductor modules. Each of the semiconductor modules is arranged such that its module body has a principal plane in surface contact with one of the cooling principal planes of the heat sink, and each of the control boards is arranged in opposition to a surface of the module body at an opposed side of the principal plane thereof.

Abstract: Even when one of IGBTs fails in a semiconductor power converter apparatus in which a plurality of semiconductor elements are connected in parallel, the remaining IGBT(s) is prevented from failing with a simple circuit configuration. The semiconductor power converter apparatus includes: a semiconductor power conversion circuit in which a first IGBT having a temperature sensing unit and a second IGBT having a current sensing unit are connected in parallel, for causing the first and second semiconductor elements to perform switching operations; an overheat protection circuit for performing overheat protection for the first and second IGBTs based on temperature information obtained from the temperature sensing unit of the first IGBT; and an overcurrent protection circuit for performing overcurrent protection for the first and second IGBTs based on current information obtained from the current sensing unit of the second IGBT.

Abstract: Even when one of IGBTs fails in a semiconductor power converter apparatus in which a plurality of semiconductor elements are connected in parallel, the remaining IGBT(s) is prevented from failing with a simple circuit configuration. The semiconductor power converter apparatus includes: a semiconductor power conversion circuit in which a first IGBT having a temperature sensing unit and a second IGBT having a current sensing unit are connected in parallel, for causing the first and second semiconductor elements to perform switching operations; an overheat protection circuit for performing overheat protection for the first and second IGBTs based on temperature information obtained from the temperature sensing unit of the first IGBT; and an overcurrent protection circuit for performing overcurrent protection for the first and second IGBTs based on current information obtained from the current sensing unit of the second IGBT.