Patents by Inventor Takuya MIKI

Takuya MIKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11664406
    Abstract: A light-emitting device includes an inner light-emitting element having an n-sided polygonal shape (n is an integer of 3 or more) in a plan view with a peak emission wavelength in a range of 490 nm to 570 nm; m (m is an integer of 3 or more) outer light-emitting elements with a peak emission wavelength of 430 nm or greater and less than 490 nm; and a first phosphor with a peak emission wavelength in a range of 580 nm to 680 nm covering the inner light-emitting element and the m outer light-emitting elements. Each of n lateral surfaces of the inner light-emitting element faces a corresponding one of the m outer light-emitting elements in a top view.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: May 30, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Miki, Naoki Matsuda
  • Patent number: 11489099
    Abstract: A light-emitting device includes: a resin package; and a first light-emitting element and a second light-emitting element. The resin package includes: a resin portion; a first lead having an upper surface and an end surface; a second lead having an upper surface and an end surface; and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. The first light-emitting element and the second light-emitting element are disposed in the recess. The first lead and the second lead are arranged in a first direction. The first light-emitting element and the second light-emitting element are arranged in a second direction perpendicular to the first direction.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: November 1, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Yuta Horikawa, Takuya Miki, Shoichi Ishikawa, Ryosuke Wakaki
  • Patent number: 11287293
    Abstract: A sensor apparatus has a sensor protruding portion and a sensor support which are formed integrally with each other. The sensor apparatus also includes a retainer, an inner seal, an outer seal, a fastener, and a friction reducer. The retainer is rotatable relative to the sensor protruding portion and the sensor support. The inner seal is disposed between the sensor support and the retainer. The outer seal is disposed between a wall and the retainer. The fastener includes a fitting groove formed in one of the sensor support and the retainer and a protrusion formed on the other of the sensor support and the retainer. The protrusion is engaged in the fitting groove to achieve installation of the sensor apparatus in the wall. The friction reducer works to increase an interval between the sensor support and the retainer to reduce a degree of friction produced by the inner seal when the sensor support is turned relative to the retainer to install the sensor apparatus in the wall.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: March 29, 2022
    Assignee: DENSO CORPORATION
    Inventor: Takuya Miki
  • Publication number: 20210293587
    Abstract: A sensor apparatus has a sensor protruding portion and a sensor support which are formed integrally with each other. The sensor apparatus also includes a retainer, an inner seal, an outer seal, a fastener, and a friction reducer. The retainer is rotatable relative to the sensor protruding portion and the sensor support. The inner seal is disposed between the sensor support and the retainer. The outer seal is disposed between a wall and the retainer. The fastener includes a fitting groove formed in one of the sensor support and the retainer and a protrusion formed on the other of the sensor support and the retainer. The protrusion is engaged in the fitting groove to achieve installation of the sensor apparatus in the wall. The friction reducer works to increase an interval between the sensor support and the retainer to reduce a degree of friction produced by the inner seal when the sensor support is turned relative to the retainer to install the sensor apparatus in the wall.
    Type: Application
    Filed: March 16, 2021
    Publication date: September 23, 2021
    Inventor: Takuya MIKI
  • Publication number: 20210242275
    Abstract: A light-emitting device includes an inner light-emitting element having an n-sided polygonal shape (n is an integer of 3 or more) in a plan view with a peak emission wavelength in a range of 490 nm to 570 nm; m (m is an integer of 3 or more) outer light-emitting elements with a peak emission wavelength of 430 nm or greater and less than 490 nm; and a first phosphor with a peak emission wavelength in a range of 580 nm to 680 nm covering the inner light-emitting element and the m outer light-emitting elements. Each of n lateral surfaces of the inner light-emitting element faces a corresponding one of the m outer light-emitting elements in a top view.
    Type: Application
    Filed: April 21, 2021
    Publication date: August 5, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Takuya MIKI, Naoki MATSUDA
  • Patent number: 11024667
    Abstract: A light-emitting device includes an inner light-emitting element having an n-sided polygonal shape (n is an integer of 3 or more) in a plan view with a peak emission wavelength in a range of 490 nm to 570 nm; m (m is an integer of 3 or more) outer light-emitting elements with a peak emission wavelength of 430 nm or greater and less than 490 nm; and a first phosphor with a peak emission wavelength in a range of 580 nm to 680 nm covering the inner light-emitting element and the m outer light-emitting elements. Each of n lateral surfaces of the inner light-emitting element faces a corresponding one of the m outer light-emitting elements in a top view.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: June 1, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Miki, Naoki Matsuda
  • Publication number: 20210159380
    Abstract: A light-emitting device includes: a resin package; and a first light-emitting element and a second light-emitting element. The resin package includes: a resin portion; a first lead having an upper surface and an end surface; a second lead having an upper surface and an end surface; and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. The first light-emitting element and the second light-emitting element are disposed in the recess. The first lead and the second lead are arranged in a first direction. The first light-emitting element and the second light-emitting element are arranged in a second direction perpendicular to the first direction.
    Type: Application
    Filed: February 8, 2021
    Publication date: May 27, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Yuta HORIKAWA, Takuya MIKI, Shoichi ISHIKAWA, Ryosuke WAKAKI
  • Patent number: 10944035
    Abstract: A light-emitting device includes: a resin package including: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion; and a first light-emitting element and a second light-emitting element that are disposed in the recess.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: March 9, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Yuta Horikawa, Takuya Miki, Shoichi Ishikawa, Ryosuke Wakaki
  • Publication number: 20200161523
    Abstract: A light-emitting device includes: a resin package including: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion; and a first light-emitting element and a second light-emitting element that are disposed in the recess.
    Type: Application
    Filed: January 27, 2020
    Publication date: May 21, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Yuta HORIKAWA, Takuya MIKI, Shoichi ISHIKAWA, Ryosuke WAKAKI
  • Patent number: 10586905
    Abstract: A resin package includes: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. In a top view, the upper surface of the first lead includes a first groove overlapping a first side of the bottom surface, a second groove overlapping a second side of the bottom surface, a third groove overlapping a third side of the bottom surface, and one or more fourth grooves extending from a portion of the third groove to an end surface of the first lead facing the second lead.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: March 10, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Yuta Horikawa, Takuya Miki, Shoichi Ishikawa, Ryosuke Wakaki
  • Publication number: 20190198559
    Abstract: A light-emitting device includes an inner light-emitting element having an n-sided polygonal shape (n is an integer of 3 or more) in a plan view with a peak emission wavelength in a range of 490 nm to 570 nm; m (m is an integer of 3 or more) outer light-emitting elements with a peak emission wavelength of 430 nm or greater and less than 490 nm; and a first phosphor with a peak emission wavelength in a range of 580 nm to 680 nm covering the inner light-emitting element and the m outer light-emitting elements. Each of n lateral surfaces of the inner light-emitting element faces a corresponding one of the m outer light-emitting elements in a top view.
    Type: Application
    Filed: December 17, 2018
    Publication date: June 27, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Takuya MIKI, Naoki MATSUDA
  • Publication number: 20190165233
    Abstract: A resin package includes: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. In a top view, the upper surface of the first lead includes a first groove overlapping a first side of the bottom surface, a second groove overlapping a second side of the bottom surface, a third groove overlapping a third side of the bottom surface, and one or more fourth grooves extending from a portion of the third groove to an end surface of the first lead facing the second lead.
    Type: Application
    Filed: November 21, 2018
    Publication date: May 30, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Yuta HORIKAWA, Takuya MIKI, Shoichi ISHIKAWA, Ryosuke WAKAKI