Patents by Inventor Takuya MIKI
Takuya MIKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11664406Abstract: A light-emitting device includes an inner light-emitting element having an n-sided polygonal shape (n is an integer of 3 or more) in a plan view with a peak emission wavelength in a range of 490 nm to 570 nm; m (m is an integer of 3 or more) outer light-emitting elements with a peak emission wavelength of 430 nm or greater and less than 490 nm; and a first phosphor with a peak emission wavelength in a range of 580 nm to 680 nm covering the inner light-emitting element and the m outer light-emitting elements. Each of n lateral surfaces of the inner light-emitting element faces a corresponding one of the m outer light-emitting elements in a top view.Type: GrantFiled: April 21, 2021Date of Patent: May 30, 2023Assignee: NICHIA CORPORATIONInventors: Takuya Miki, Naoki Matsuda
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Patent number: 11489099Abstract: A light-emitting device includes: a resin package; and a first light-emitting element and a second light-emitting element. The resin package includes: a resin portion; a first lead having an upper surface and an end surface; a second lead having an upper surface and an end surface; and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. The first light-emitting element and the second light-emitting element are disposed in the recess. The first lead and the second lead are arranged in a first direction. The first light-emitting element and the second light-emitting element are arranged in a second direction perpendicular to the first direction.Type: GrantFiled: February 8, 2021Date of Patent: November 1, 2022Assignee: NICHIA CORPORATIONInventors: Yuta Horikawa, Takuya Miki, Shoichi Ishikawa, Ryosuke Wakaki
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Patent number: 11287293Abstract: A sensor apparatus has a sensor protruding portion and a sensor support which are formed integrally with each other. The sensor apparatus also includes a retainer, an inner seal, an outer seal, a fastener, and a friction reducer. The retainer is rotatable relative to the sensor protruding portion and the sensor support. The inner seal is disposed between the sensor support and the retainer. The outer seal is disposed between a wall and the retainer. The fastener includes a fitting groove formed in one of the sensor support and the retainer and a protrusion formed on the other of the sensor support and the retainer. The protrusion is engaged in the fitting groove to achieve installation of the sensor apparatus in the wall. The friction reducer works to increase an interval between the sensor support and the retainer to reduce a degree of friction produced by the inner seal when the sensor support is turned relative to the retainer to install the sensor apparatus in the wall.Type: GrantFiled: March 16, 2021Date of Patent: March 29, 2022Assignee: DENSO CORPORATIONInventor: Takuya Miki
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Publication number: 20210293587Abstract: A sensor apparatus has a sensor protruding portion and a sensor support which are formed integrally with each other. The sensor apparatus also includes a retainer, an inner seal, an outer seal, a fastener, and a friction reducer. The retainer is rotatable relative to the sensor protruding portion and the sensor support. The inner seal is disposed between the sensor support and the retainer. The outer seal is disposed between a wall and the retainer. The fastener includes a fitting groove formed in one of the sensor support and the retainer and a protrusion formed on the other of the sensor support and the retainer. The protrusion is engaged in the fitting groove to achieve installation of the sensor apparatus in the wall. The friction reducer works to increase an interval between the sensor support and the retainer to reduce a degree of friction produced by the inner seal when the sensor support is turned relative to the retainer to install the sensor apparatus in the wall.Type: ApplicationFiled: March 16, 2021Publication date: September 23, 2021Inventor: Takuya MIKI
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Publication number: 20210242275Abstract: A light-emitting device includes an inner light-emitting element having an n-sided polygonal shape (n is an integer of 3 or more) in a plan view with a peak emission wavelength in a range of 490 nm to 570 nm; m (m is an integer of 3 or more) outer light-emitting elements with a peak emission wavelength of 430 nm or greater and less than 490 nm; and a first phosphor with a peak emission wavelength in a range of 580 nm to 680 nm covering the inner light-emitting element and the m outer light-emitting elements. Each of n lateral surfaces of the inner light-emitting element faces a corresponding one of the m outer light-emitting elements in a top view.Type: ApplicationFiled: April 21, 2021Publication date: August 5, 2021Applicant: NICHIA CORPORATIONInventors: Takuya MIKI, Naoki MATSUDA
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Patent number: 11024667Abstract: A light-emitting device includes an inner light-emitting element having an n-sided polygonal shape (n is an integer of 3 or more) in a plan view with a peak emission wavelength in a range of 490 nm to 570 nm; m (m is an integer of 3 or more) outer light-emitting elements with a peak emission wavelength of 430 nm or greater and less than 490 nm; and a first phosphor with a peak emission wavelength in a range of 580 nm to 680 nm covering the inner light-emitting element and the m outer light-emitting elements. Each of n lateral surfaces of the inner light-emitting element faces a corresponding one of the m outer light-emitting elements in a top view.Type: GrantFiled: December 17, 2018Date of Patent: June 1, 2021Assignee: NICHIA CORPORATIONInventors: Takuya Miki, Naoki Matsuda
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Publication number: 20210159380Abstract: A light-emitting device includes: a resin package; and a first light-emitting element and a second light-emitting element. The resin package includes: a resin portion; a first lead having an upper surface and an end surface; a second lead having an upper surface and an end surface; and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. The first light-emitting element and the second light-emitting element are disposed in the recess. The first lead and the second lead are arranged in a first direction. The first light-emitting element and the second light-emitting element are arranged in a second direction perpendicular to the first direction.Type: ApplicationFiled: February 8, 2021Publication date: May 27, 2021Applicant: NICHIA CORPORATIONInventors: Yuta HORIKAWA, Takuya MIKI, Shoichi ISHIKAWA, Ryosuke WAKAKI
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Patent number: 10944035Abstract: A light-emitting device includes: a resin package including: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion; and a first light-emitting element and a second light-emitting element that are disposed in the recess.Type: GrantFiled: January 27, 2020Date of Patent: March 9, 2021Assignee: NICHIA CORPORATIONInventors: Yuta Horikawa, Takuya Miki, Shoichi Ishikawa, Ryosuke Wakaki
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Publication number: 20200161523Abstract: A light-emitting device includes: a resin package including: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion; and a first light-emitting element and a second light-emitting element that are disposed in the recess.Type: ApplicationFiled: January 27, 2020Publication date: May 21, 2020Applicant: NICHIA CORPORATIONInventors: Yuta HORIKAWA, Takuya MIKI, Shoichi ISHIKAWA, Ryosuke WAKAKI
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Patent number: 10586905Abstract: A resin package includes: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. In a top view, the upper surface of the first lead includes a first groove overlapping a first side of the bottom surface, a second groove overlapping a second side of the bottom surface, a third groove overlapping a third side of the bottom surface, and one or more fourth grooves extending from a portion of the third groove to an end surface of the first lead facing the second lead.Type: GrantFiled: November 21, 2018Date of Patent: March 10, 2020Assignee: NICHIA CORPORATIONInventors: Yuta Horikawa, Takuya Miki, Shoichi Ishikawa, Ryosuke Wakaki
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Publication number: 20190198559Abstract: A light-emitting device includes an inner light-emitting element having an n-sided polygonal shape (n is an integer of 3 or more) in a plan view with a peak emission wavelength in a range of 490 nm to 570 nm; m (m is an integer of 3 or more) outer light-emitting elements with a peak emission wavelength of 430 nm or greater and less than 490 nm; and a first phosphor with a peak emission wavelength in a range of 580 nm to 680 nm covering the inner light-emitting element and the m outer light-emitting elements. Each of n lateral surfaces of the inner light-emitting element faces a corresponding one of the m outer light-emitting elements in a top view.Type: ApplicationFiled: December 17, 2018Publication date: June 27, 2019Applicant: NICHIA CORPORATIONInventors: Takuya MIKI, Naoki MATSUDA
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Publication number: 20190165233Abstract: A resin package includes: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. In a top view, the upper surface of the first lead includes a first groove overlapping a first side of the bottom surface, a second groove overlapping a second side of the bottom surface, a third groove overlapping a third side of the bottom surface, and one or more fourth grooves extending from a portion of the third groove to an end surface of the first lead facing the second lead.Type: ApplicationFiled: November 21, 2018Publication date: May 30, 2019Applicant: NICHIA CORPORATIONInventors: Yuta HORIKAWA, Takuya MIKI, Shoichi ISHIKAWA, Ryosuke WAKAKI