Abstract: A life determining device capable of performing life determination while suppressing a processing load is provided. A life determining device 1 includes a measured value acquiring unit 2 that acquires a measured value for a stressor at predetermined time intervals, an acceleration factor acquiring unit 3 that acquires a first acceleration factor, which is the ratio of a second life to a first life, at predetermined time intervals, and a life determining unit 5 that determines life expiration of a device whose life is to be determined by comparing a value obtained by multiplying an accumulated value of the first acceleration factor by a predetermined time with a second life. The acceleration factor acquiring unit 3 uses a look-up table 4 that stores a second acceleration factor for each predetermined value when it acquires the first acceleration factor.

Abstract: Provided is a warp correction method which can correct warping in a warped sputtering target with a backing plate (BP) by a simple method. This warp correction method involves: an arrangement step of arranging a BP-attached sputtering target on a lower pressing surface of a pressing device in such a way that a target side located above, the pressing device including an upper pressing surface and the lower pressing surface opposing each other in a vertical direction, and of arranging a spacer between outer edge of the backing plate side of the BP-attached target and the lower pressing surface; and a pressing step of pressing the BP-attached target in the vertical direction by means of the pressing device after the arrangement step, wherein the target is a composite including at least one of metal oxide and carbon, the at least one of metal oxide and carbon being dispersed in a matrix metal.