Patents by Inventor Takuya Nakatani

Takuya Nakatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8070316
    Abstract: A lighting apparatus with LED includes a metal-made main body 90; a plurality of LED chip units 1 each including an LED chip and a pair of lead terminals 42, 43 electrically connected to electrodes of the LED chip; and a dielectric layer 80 disposed between the main body 90 and each LED chip unit 1 for making electrical insulation therebetween as well as bond the same. The circuit board 20 is formed with a plurality of windows 23 through which the individual LED chip units 1 extend respectively with the lead terminals held in electrical contact with the circuit pattern of the circuit board at the circumference of the window, each of the LED chip units being thermally coupled at its bottom face with the main body 90 through the dielectric layer 80, and the heat generated in the LED chip is conducted to the main body through the dielectric layer without passing through the circuit board.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: December 6, 2011
    Assignee: Panasonic Electric Works Co., Ltd.
    Inventors: Youji Urano, Takuya Nakatani, Yasuhiro Hidaka, Yoshiro Goto
  • Patent number: 8044424
    Abstract: A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: October 25, 2011
    Assignee: Panasonic Electric Works Co., Ltd.
    Inventors: Youji Urano, Takuya Nakatani, Yasuhiro Hidaka
  • Patent number: 7960751
    Abstract: A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: June 14, 2011
    Assignee: Panasonic Electric Works Co., Ltd.
    Inventors: Youji Urano, Takuya Nakatani, Yasuhiro Hidaka
  • Publication number: 20100301373
    Abstract: A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.
    Type: Application
    Filed: August 16, 2010
    Publication date: December 2, 2010
    Inventors: Youji Urano, Takuya Nakatani, Yasuhiro Hidaka
  • Patent number: 7800124
    Abstract: A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: September 21, 2010
    Assignee: Panasonic Electric Works Co., Ltd.
    Inventors: Youji Urano, Takuya Nakatani, Yasuhiro Hidaka
  • Publication number: 20090046456
    Abstract: A lighting apparatus with LED includes a metal-made main body 90; a plurality of LED chip units 1 each including an LED chip and a pair of lead terminals 42, 43 electrically connected to electrodes of the LED chip; and a dielectric layer 80 disposed between the main body 90 and each LED chip unit 1 for making electrical insulation therebetween as well as bond the same. The circuit board 20 is formed with a plurality of windows 23 through which the individual LED chip units 1 extend respectively with the lead terminals held in electrical contact with the circuit pattern of the circuit board at the circumference of the window, each of the LED chip units being thermally coupled at its bottom face with the main body 90 through the dielectric layer 80, and the heat generated in the LED chip is conducted to the main body through the dielectric layer without passing through the circuit board.
    Type: Application
    Filed: December 21, 2006
    Publication date: February 19, 2009
    Applicant: MATSUSHITA ELECTRIC WORKS., LTD.
    Inventors: Youji Urano, Takuya Nakatani, Yasuhiro Hidaka, Yoshiro Goto
  • Publication number: 20090026485
    Abstract: A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 29, 2009
    Applicant: MATSUSHITA ELECTRIC WORKS, LTD.
    Inventors: Youji Urano, Takuya Nakatani, Yasuhiro Hidaka
  • Patent number: 5586387
    Abstract: An automated part assembly machine has a work table supported to a base and movable relative thereto and at least two separate robots each having an end effector movable around within an individual work region. The two robots are positioned in such a relation as to give a common work region in which the individual work regions of the two robots overlap. A parts supply is arranged to the work table for storing parts to be picked-up by the robots. A plurality of operator hands are selectively and removably attached to the end effector of the robot for handling the parts by the robot. Disposed within the common region is a jig which positions the parts for assembly by the robot. The robots and the work table are controlled to operate in cooperation for assembly of the parts.
    Type: Grant
    Filed: December 21, 1994
    Date of Patent: December 24, 1996
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Takuya Nakatani, Mitsutaka Abe, Shigeru Dono, Youji Urano