Abstract: There is a micro-machining apparatus for removing the micro-machining dust generated at the time of machining while a workpiece M is machined within a liquid W using a probe tip. The apparatus includes a stage on which the workpiece is to be placed; a probe having the probe tip, a machining device having a moving means that moves the stage and the probe relative to each other to machine the workpiece by the probe tip, and a micro-machining dust removing device having a first electrode and a second electrode that are arranged in the liquid so as to sandwich the probe tip therebetween, and a voltage application means that applies a voltage to between both the electrodes to move the micro-machining dust in the liquid.

Abstract: Provided is a photomask defect correction method of correcting a defect on a photomask including a substrate (2) and a mask pattern (3) by cutting and removing processing a defect portion (5) based on observation data obtained through AFM observation of the photomask in advance, including: an area setting step of setting a processing area (E1) based on the observation data, and setting areas adjacent to the processing area as removing processing areas (E2) of cutting wastes for cutting and removing the cutting wastes which are produced by the cutting and removing processing and may be firmly adhered; a processing step of cutting and removing processing the defect portion with a probe; and a moving step of moving the cutting wastes by scanning the probe with a weaker pressing force than the pressing force at the time of cutting and processing within the removing processing areas of cutting wastes to conduct a cutting wastes removing process.

Abstract: Provided is a photomask defect correction method including: an observing step of scanning plurality of lines one after another while controlling a distance between the probe tip and a surface (2a) of the substrate so that displacement of the probe becomes constant to recognize a shape of the defect portion (5) through AFM observation; and a processing step of scanning a plurality of lines one after another while pressing the probe tip to the recognized defect portion with a predetermined force to subject the defect portion to cutting and removing processing, in which, at the observing step, the scanning for every one line is set in a parallel direction (C direction) to an edge (3a) of a mask pattern (3), and the scanning of the plurality of lines is performed one after another from the mask pattern side towards a tip side (D direction) of the defect portion.

Abstract: To recognize a defect portion and a mask pattern with a distinctly distinguished state through AFM observation of a photomask without being influenced by a double-tips image, provided is a method of recognizing, through AFM observation of a photomask including a substrate (2) and the mask pattern formed on the substrate (2a) with a predetermined pattern, a shape (5) of a projection type defect portion projected from the mask pattern, including the steps of storing a reference image an observation image in which an edge line of the defect portion is first confirmed at the time of AFM observation; and correcting, after the storing step, the edge line (L2) of the defect portion confirmed through the observation image obtained by the scanning performed hereinafter into a normal line (L1) with reference to the reference image, in which the shape of the defect portion is recognized based on the observed image after the correction.

Abstract: The present invention provides a working method using a scanning probe which can enhance a working speed and prolong a lifetime of the probe. The present invention provides the working method using a scanning probe which works a sample by performing the relative scanning of a probe supported on a cantilever on the sample at a predetermined scanning speed. The working method can work the object to be worked while forcibly and relatively vibrating the probe in the direction orthogonal to or parallel to a working surface of the sample at low frequency of 100 to 1000 Hz.

Abstract: There is a micro-machining apparatus for removing the micro-machining dust generated at the time of machining while a workpiece M is machined within a liquid W using a probe tip. The apparatus includes a stage on which the workpiece is to be placed; a probe having the probe tip, a machining device having a moving means that moves the stage and the probe relative to each other to machine the workpiece by the probe tip, and a micro-machining dust removing device having a first electrode and a second electrode that are arranged in the liquid so as to sandwich the probe tip therebetween, and a voltage application means that applies a voltage to between both the electrodes to move the micro-machining dust in the liquid.

Abstract: Under the condition that the height is fixed at a target height by turning off a feedback control system of a Z piezoelectric actuator of a cantilever of an atomic force microscope having a probe, which is harder than a processed material, flexure and twisting of the cantilever when carrying out mechanical processing while selectively repeating scanning only on the processed area (in the case of detecting flexure, parallel with the cantilever and in the case of detecting twisting, vertical with the cantilever) is monitored by a quadrant photodiode position sensing detector and the processing is repeated till a flexure amount or a twisting amount, namely, till an elastic deformation amount of the cantilever becomes not more than a determined threshold. It is not necessary to carry out scanning of the observation in obtaining the height information for detection of an end point, so that it is possible to improve a throughput of processing.

Abstract: A probe to which a foreign matter has adhered is pressed to a sample. At this time, between a scanner in a cantilever side and a sample base, there are relatively generated a horizontal oscillation and a vertical oscillation. By generating a suitable friction to the probe tip, the foreign matter having adhered to the tip of the probe is removed, and it can be washed.

Abstract: The present invention provides a working method using a scanning probe which can enhance a working speed and prolong a lifetime of the probe. The present invention provides the working method using a scanning probe which works a sample by performing the relative scanning of a probe supported on a cantilever on the sample at a predetermined scanning speed. The working method can work the object to be worked while forcibly and relatively vibrating the probe in the direction orthogonal to or parallel to a working surface of the sample at low frequency of 100 to 1000 Hz.