Abstract: The present invention provides a motion capture with a high accuracy which can replace an optical motion capture technology, without attaching optical markers and sensors to a subject. A subject with an articulated structure has a plurality of feature points in the body of the subject including a plurality of joints wherein a distance between adjacent feature points is obtained as a constant. A spatial distribution of a likelihood of a position of each feature point is obtained based on a single input image or a plurality of input images taken at the same time. One or a plurality of position candidates corresponding to each feature point are obtained based on the spatial distribution of the likelihood of the position of each feature point. Each join angle is obtained by performing an optimization calculation based on inverse kinematics using the candidates and the articulated structure.

Abstract: A cold rolling mill rolling condition calculation method includes: an estimation step of estimating a rolling constraint condition with respect to a target steady rolling condition of a roll target material, by inputting second multi-dimensional data to a prediction model, the prediction model having been trained with explanatory variable and response variable, the explanatory variable being first multi-dimensional data generated based on non-steady rolling performance data, among past rolling performance in rolling a roll material by a cold rolling mill, and the response variable being steady rolling performance data and rolling constraint condition data during steady rolling, and the second multi-dimensional data having been generated based on non-steady rolling performance data of the roll target material; and a change step of changing the target steady rolling condition so that the estimated rolling constraint condition satisfies a predetermined condition.

Abstract: The present invention provides a motion capture with a high accuracy which can replace an optical motion capture technology, without attaching optical markers and sensors to a subject. A subject with an articulated structure has a plurality of feature points in the body of the subject including a plurality of joints wherein a distance between adjacent feature points is obtained as a constant. A spatial distribution of a likelihood of a position of each feature point is obtained based on a single input image or a plurality of input images taken at the same time. One or a plurality of position candidates corresponding to each feature point are obtained based on the spatial distribution of the likelihood of the position of each feature point. Each join angle is obtained by performing an optimization calculation based on inverse kinematics using the candidates and the articulated structure.

Abstract: A novel photocurable resin composition including: a polymer with a weight average molecular weight of 1,000 to 50,000, the polymer having a structural unit of formula (1), and having a structure of formula (2) at an end: wherein X is a C1-6 alkyl group, vinyl group, allyl group, or glycidyl group; m and n are each independently 0 or 1; Q is a divalent hydrocarbon group having a carbon atom number of 1 to 16; Z is a divalent linking group having a carbon atom number of 1 to 4, wherein the divalent linking group is attached to the —O— group in formula (1); and R1 is a hydrogen atom or methyl group; a radical photopolymerization initiator; and a solvent.

Abstract: A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), (wherein X is a C1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C1-16 hydrocarbon group, Z is a divalent C1-4 linking group, the divalent linking group being bonded to an —O— group in formula (1), and R1 is a hydrogen atom or a methyl group.

Abstract: A resin composition which is for an insulating film and from which a cured product having a further reduced dielectric constant and dielectric loss tangent is obtained; a photosensitive resin composition; a method for producing a cured relief pattern using the photosensitive resin composition; and a semiconductor device with the cured relief pattern. This resin composition for an insulating film includes: a polyimide precursor; and a compound which is a polyimide precursor containing a polyamic acid ester, a thermal imidization accelerator, and a solvent, wherein the thermal imidization accelerator has a carboxyl group and an amino group or imino group which is deprotected by heat and exhibits basicity, and does not accelerate the imidization of the polyimide precursor before the protective group is released. Furthermore, a photosensitive resin composition which is for an insulating film and includes a photopolymerization initiator.

Abstract: A photosensitive resin composition which enables the achievement of a cured body that is further decreased in dielectric constant and dielectric loss tangent; a method for producing a cured relief pattern with use of this photosensitive resin composition; and a semiconductor device which is provided with this cured relief pattern. A negative photosensitive resin composition which contains 100 parts by mass of (A) a polyimide precursor that has a specific unit structure; and 0.1 to 20 parts by mass of (B) a radical photopolymerization initiator.

Abstract: A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), (wherein X is a C1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C1-16 hydrocarbon group, Z is a divalent C1-4 linking group, the divalent linking group being bonded to an —O— group in formula (1), and R1 is a hydrogen atom or a methyl group.

Abstract: A photosensitive resin composition comprises a polymer having a repeating structural unit of the following Formula (1): (wherein R1 and R2 are each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a bifunctional (meth)acrylate compound, a polyfunctional thiol compound, a photo-radical generator and an organic solvent, and then the bifunctional (meth)acrylate compound contained in an amount of 5% to 50% by mass and the polyfunctional thiol compound is contained in an amount of 0.1% to 10% by mass, relative to the content of the polymer.

Abstract: There is provided a novel polymer, a composition containing the polymer, and a novel adhesive composition containing the polymer from which a cured film having desired properties is obtained. A polymer comprising a structural unit of Formula (1): wherein Q is a bivalent group, R1 is a C1-10 alkylene group, a C2-10 alkenylene group or C2-10 alkynylene group, a C6-14 arylene group, a C4-10 cyclic alkylene group, etc., or a polymer comprising a structural unit of Formula (6): wherein Q4 is an allyl group, a vinyl group, an epoxy group, or a glycidyl group, and R5 is a bivalent organic group having a main chain containing only carbon atom or at least one of oxygen atom, nitrogen atom and sulfur atom in addition to carbon atom, a composition comprising the polymer, and an adhesive composition comprising the polymer and a solvent.

Abstract: A novel photocurable resin composition including: a polymer with a weight average molecular weight of 1,000 to 50,000, the polymer having a structural unit of formula (1), and having a structure of formula (2) at an end: wherein X is a C1-6 alkyl group, vinyl group, allyl group, or glycidyl group; m and n are each independently 0 or 1; Q is a divalent hydrocarbon group having a carbon atom number of 1 to 16; Z is a divalent linking group having a carbon atom number of 1 to 4, wherein the divalent linking group is attached to the —O— group in formula (1); and R1 is a hydrogen atom or methyl group; a radical photopolymerization initiator; and a solvent.

Abstract: A photosensitive resin composition comprises a polymer having a repeating structural unit of the following Formula (1): (wherein R1 and R2 are each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a bifunctional (meth)acrylate compound, a polyfunctional thiol compound, a photo-radical generator and an organic solvent, and then the bifunctional (meth)acrylate compound contained in an amount of 5% to 50% by mass and the polyfunctional thiol compound is contained in an amount of 0.1% to 10% by mass, relative to the content of the polymer.

Abstract: Novel thermosetting resin composition is provided. A thermosetting resin composition containing a polymer having a repeating structural unit of the following Formula (1-a): (wherein each of R1 and R2 is independently a hydrogen atom, a C1-4 alkyl group, phenyl group, or a C3-6 cyclic alkyl group, X is a single bond or a divalent organic group, and Y is a divalent organic group), and a terminal structure of the following Formula (1-b): (wherein Q is a C1-5 alkylene group, phenylene group in which at least one hydrogen atom may be substituted by a halogen atom, or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and R3 is a hydrogen atom or methyl group).

Abstract: There is provided novel thermosetting resin composition. A thermosetting resin composition comprising a polymer having at least one structural unit of the following Formula (1): {wherein each of R1 and R2 is independently a hydrogen atom or a C1-4 alkyl group, X is a single bond or a divalent organic group, and Y is an arylene group of the following Formula (2): (wherein Z1 is a carbonyl group or a —CONH— group, Z2 is a C1-5 alkylene group or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Z3 is a 5- or 6-membered aromatic heterocyclic group containing two nitrogen atoms in which at least one of hydrogen atoms may be substituted by a C1-5 alkyl group)}.

Abstract: There is provided novel thermosetting resin composition. A thermosetting resin composition comprising a polymer having at least one structural unit of the following Formula (1): {wherein each of R1 and R2 is independently a hydrogen atom or a C1-4 alkyl group, X is a single bond or a divalent organic group, and Y is an arylene group of the following Formula (2): (wherein Z1 is a carbonyl group or a —CONH— group, Z2 is a C1-5 alkylene group or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Z3 is a 5- or 6-membered aromatic heterocyclic group containing two nitrogen atoms in which at least one of hydrogen atoms may be substituted by a C1-5 alkyl group)}.

Abstract: There is provided a novel polymer, a composition containing the polymer, and a novel adhesive composition containing the polymer from which a cured film having desired properties is obtained. A polymer comprising a structural unit of Formula (1): wherein Q is a bivalent group, R1 is a C1-10 alkylene group, a C2-10 alkenylene group or C2-10 alkynylene group, a C6-14 arylene group, a C4-10 cyclic alkylene group, etc., or a polymer comprising a structural unit of Formula (6): wherein Q4 is an allyl group, a vinyl group, an epoxy group, or a glycidyl group, and R5 is a bivalent organic group having a main chain containing only carbon atom or at least one of oxygen atom, nitrogen atom and sulfur atom in addition to carbon atom, a composition comprising the polymer, and an adhesive composition comprising the polymer and a solvent.

Abstract: Novel thermosetting resin composition is provided. A thermosetting resin composition containing a polymer having a repeating structural unit of the following Formula (1-a): (wherein each of R1 and R2 is independently a hydrogen atom, a C1-4 alkyl group, phenyl group, or a C3-6 cyclic alkyl group, X is a single bond or a divalent organic group, and Y is a divalent organic group), and a terminal structure of the following Formula (1-b): (wherein Q is a C1-5 alkylene group, phenylene group in which at least one hydrogen atom may be substituted by a halogen atom, or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and R3 is a hydrogen atom or methyl group).

Abstract: The problem of the present invention is to achieve both an enhancement of beer-like taste and an effect of suppressing an increase in blood neutral fat with respect to a non-fermented beer taste drink. The means for solving the problem is a non-fermented beer taste drink, which contains indigestible dextrin at a concentration of 8 g/L or more, and a bitter-taste substance.

Abstract: An adhesive or underfill composition includes: a polymer exclusively including at least one structural unit of Formula (1) as a repeating unit except a terminal: {R1 and R2 are each independently a hydrogen atom or a methyl group; X is a sulfonyl or divalent organic group of Formula (2): (R3 and R4 are each independently a hydrogen atom or methyl group; at least one hydrogen atom of the methyl group is optionally substituted by a halogen atom; and m is 0 or 1), and Y is a divalent organic group of Formula (3) or (4): (Z is a single bond, a methylene, sulfonyl, —O—, or a divalent organic group of Formula (2) where m is 0; R5 is a hydrogen atom, methyl, ethyl, or methoxy group; R6 is a methyl, vinyl, allyl, or phenyl group; and n is 0 or 1)}; and an organic solvent.

Abstract: There is provided a novel polymer, a composition containing the polymer, and a novel adhesive composition containing the polymer from which a cured film having desired properties is obtained. A polymer comprising a structural unit of Formula (1): wherein Q is a bivalent group, R1 is a C1-10 alkylene group, a C2-10 alkenylene group or C2-10 alkynylene group, a C6-14 arylene group, a C4-10 cyclic alkylene group, etc., or a polymer comprising a structural unit of Formula (6): wherein Q4 is an allyl group, a vinyl group, an epoxy group, or a glycidyl group, and R5 is a bivalent organic group having a main chain containing only carbon atom or at least one of oxygen atom, nitrogen atom and sulfur atom in addition to carbon atom, a composition comprising the polymer, and an adhesive composition comprising the polymer and a solvent.