Abstract: There is provided an information processing device, an information processing method, and a program capable of converting a real space image into a virtual space image by appropriately reflecting a relationship (interaction) with a person or an object in real space. A real space image including a user and a person or an object around the user is acquired from an imaging device, a relationship (interaction) indicating a motion that the user takes with respect to the person or the object is extracted from the real space image, the user and the person or the object are converted into an avatar and a virtual object in a virtual space on the basis of the relationship, and the real space image is converted and generated into a virtual space image. The present disclosure can be applied to a virtual space display system.

Abstract: A connector includes: a plurality of terminal-attached electric wires in each of which a terminal is attached to an electric wire in a direction intersecting an extending direction of the electric wire; and a housing including a plurality of compartments that holds the terminal in a fitting direction, and a plurality of electric wire insertion portions that is provided penetrating a side wall portion and configured to extract the electric wire in the plurality of terminal-attached electric wires from an internal space in a direction intersecting the fitting direction. The housing has guide portions provided between individual accommodating regions for the plurality of terminal-attached electric wires arrayed and accommodated in the internal space. The guide portion has an inclined surface inclined with respect to the extending direction of the electric wire.

Abstract: he The target includes a plurality of keypoints of a body including a plurality of joints and the 3D position of the target is identified by positions of the plurality of keypoints. A bounding box and reference 2D joint position determining unit determines a bounding box surrounding the target in a camera image at a target frame to be predicted subsequent to at least one frame at which imaging is performed by the plurality of cameras using the 3D positions of the keypoints of the target at the at least one frame and acquires reference 2D positions of the keypoints projected from the 3D positions of the keypoints of the target onto a predetermined plane. A 3D pose acquiring unit acquires the 3D positions of the keypoints of the target at the target frame using image information in the bounding box and the reference 2D positions.

Abstract: A connector configured to be connected to an object includes: an electric wire with a terminal; a housing; a shield shell; and a fixing element. The fixing element is fixed to the shield shell and protrudes toward a front side. In a state of the fixing element being inserted in a guiding section in the object, displacement of the fixing element along an axial direction is limited. An end of the fixing element oriented toward the front side is located further toward the front side than ends of the housing and the shield shell oriented toward the front side.

Abstract: A connection structure is a structure for connecting a housing and a cover. In the cover, an engagement portion which protrudes from a main body portion disposed in an opening of the housing is provided. The engagement portion includes a first protruding portion protruding to an outside in an inside-outside direction and a second protruding portion continuing with the first protruding portion to extend in a front-rear direction. In the housing, an accommodation groove for accommodating the engagement portion is provided. The accommodation groove includes a first groove extending in the inside-outside direction and a second groove continuing with the first groove to extend in the front-rear direction. In a state in which the housing and the cover are connected, the first protruding portion is accommodated in the first groove, and the second protruding portion is accommodated in the second groove.

Abstract: A housing is provided which accommodates a plurality of terminal-equipped electric wires side by side in an arrangement direction, in which a first terminal fitting causes a first coupling portion to protrude from a first electric wire connection portion to a side opposite to a drawing direction of an electric wire and causes a first terminal connection portion to protrude from the first coupling portion in a protruding direction, a second terminal fitting causes a second coupling portion to protrude from a second electric wire connection portion to a side of the drawing direction of the electric wire and causes a second terminal connection portion to protrude from the second coupling portion in the protruding direction, the second terminal connection portion is disposed at a position overlapping a coating of the electric wire drawn out from the second electric wire connection portion.

Abstract: Provided are a molding process of molding a shield shell with a mold provided with a first molding die and a second molding die, and a molded product extraction process of extracting the first molding die from the shield shell in a vertically providing direction of a peripheral wall body and extracting the second molding die from the shield shell in a second extraction direction orthogonal to a first extraction direction of the first molding die, in which, in the molding process, a first molding die that is a wall surface for forming a side wall surface with a draft angle relative to the first extraction direction and the second molding die that has a size enough to leave a gap between a screw hole and a male screw member and has a protrusion for forming the screw hole with the second extraction direction as a hole axis direction.

Abstract: A connector includes a terminal fitting physically and electrically connected to a terminal of an electric wire to form a terminal-equipped electric wire; and a housing configured to accommodate a plurality of the terminal-equipped electric wires, hold two adjacent electric wires side by side in a direction orthogonal to an axial direction by an electric wire holding portion, and draw out each of the electric wires from the electric wire holding portion while keeping an arrangement state. The electric wire holding portion has an electric wire insertion path formed by a first and a second grooves joined in an assembly direction of the first holding portion and the second holding portion orthogonal to the axial direction. The two adjacent electric wire insertion paths are offset from each other in the direction orthogonal to the axial direction and the assembly direction, and are offset from each other in the assembling direction.

Abstract: The present invention provides a motion capture with a high accuracy which can replace an optical motion capture technology, without attaching optical markers and sensors to a subject. A subject with an articulated structure has a plurality of feature points in the body of the subject including a plurality of joints wherein a distance between adjacent feature points is obtained as a constant. A spatial distribution of a likelihood of a position of each feature point is obtained based on a single input image or a plurality of input images taken at the same time. One or a plurality of position candidates corresponding to each feature point are obtained based on the spatial distribution of the likelihood of the position of each feature point. Each join angle is obtained by performing an optimization calculation based on inverse kinematics using the candidates and the articulated structure.

Abstract: The present invention provides a motion capture with a high accuracy which can replace an optical motion capture technology, without attaching optical markers and sensors to a subject. A subject with an articulated structure has a plurality of feature points in the body of the subject including a plurality of joints wherein a distance between adjacent feature points is obtained as a constant. A spatial distribution of a likelihood of a position of each feature point is obtained based on a single input image or a plurality of input images taken at the same time. One or a plurality of position candidates corresponding to each feature point are obtained based on the spatial distribution of the likelihood of the position of each feature point. Each join angle is obtained by performing an optimization calculation based on inverse kinematics using the candidates and the articulated structure.

Abstract: A novel photocurable resin composition including: a polymer with a weight average molecular weight of 1,000 to 50,000, the polymer having a structural unit of formula (1), and having a structure of formula (2) at an end: wherein X is a C1-6 alkyl group, vinyl group, allyl group, or glycidyl group; m and n are each independently 0 or 1; Q is a divalent hydrocarbon group having a carbon atom number of 1 to 16; Z is a divalent linking group having a carbon atom number of 1 to 4, wherein the divalent linking group is attached to the —O— group in formula (1); and R1 is a hydrogen atom or methyl group; a radical photopolymerization initiator; and a solvent.

Abstract: A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), (wherein X is a C1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C1-16 hydrocarbon group, Z is a divalent C1-4 linking group, the divalent linking group being bonded to an —O— group in formula (1), and R1 is a hydrogen atom or a methyl group.

Abstract: A resin composition which is for an insulating film and from which a cured product having a further reduced dielectric constant and dielectric loss tangent is obtained; a photosensitive resin composition; a method for producing a cured relief pattern using the photosensitive resin composition; and a semiconductor device with the cured relief pattern. This resin composition for an insulating film includes: a polyimide precursor; and a compound which is a polyimide precursor containing a polyamic acid ester, a thermal imidization accelerator, and a solvent, wherein the thermal imidization accelerator has a carboxyl group and an amino group or imino group which is deprotected by heat and exhibits basicity, and does not accelerate the imidization of the polyimide precursor before the protective group is released. Furthermore, a photosensitive resin composition which is for an insulating film and includes a photopolymerization initiator.

Abstract: A photosensitive resin composition which enables the achievement of a cured body that is further decreased in dielectric constant and dielectric loss tangent; a method for producing a cured relief pattern with use of this photosensitive resin composition; and a semiconductor device which is provided with this cured relief pattern. A negative photosensitive resin composition which contains 100 parts by mass of (A) a polyimide precursor that has a specific unit structure; and 0.1 to 20 parts by mass of (B) a radical photopolymerization initiator.

Abstract: A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), (wherein X is a C1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C1-16 hydrocarbon group, Z is a divalent C1-4 linking group, the divalent linking group being bonded to an —O— group in formula (1), and R1 is a hydrogen atom or a methyl group.

Abstract: A photosensitive resin composition comprises a polymer having a repeating structural unit of the following Formula (1): (wherein R1 and R2 are each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a bifunctional (meth)acrylate compound, a polyfunctional thiol compound, a photo-radical generator and an organic solvent, and then the bifunctional (meth)acrylate compound contained in an amount of 5% to 50% by mass and the polyfunctional thiol compound is contained in an amount of 0.1% to 10% by mass, relative to the content of the polymer.

Abstract: There is provided a novel polymer, a composition containing the polymer, and a novel adhesive composition containing the polymer from which a cured film having desired properties is obtained. A polymer comprising a structural unit of Formula (1): wherein Q is a bivalent group, R1 is a C1-10 alkylene group, a C2-10 alkenylene group or C2-10 alkynylene group, a C6-14 arylene group, a C4-10 cyclic alkylene group, etc., or a polymer comprising a structural unit of Formula (6): wherein Q4 is an allyl group, a vinyl group, an epoxy group, or a glycidyl group, and R5 is a bivalent organic group having a main chain containing only carbon atom or at least one of oxygen atom, nitrogen atom and sulfur atom in addition to carbon atom, a composition comprising the polymer, and an adhesive composition comprising the polymer and a solvent.

Abstract: A novel photocurable resin composition including: a polymer with a weight average molecular weight of 1,000 to 50,000, the polymer having a structural unit of formula (1), and having a structure of formula (2) at an end: wherein X is a C1-6 alkyl group, vinyl group, allyl group, or glycidyl group; m and n are each independently 0 or 1; Q is a divalent hydrocarbon group having a carbon atom number of 1 to 16; Z is a divalent linking group having a carbon atom number of 1 to 4, wherein the divalent linking group is attached to the —O— group in formula (1); and R1 is a hydrogen atom or methyl group; a radical photopolymerization initiator; and a solvent.

Abstract: A photosensitive resin composition comprises a polymer having a repeating structural unit of the following Formula (1): (wherein R1 and R2 are each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a bifunctional (meth)acrylate compound, a polyfunctional thiol compound, a photo-radical generator and an organic solvent, and then the bifunctional (meth)acrylate compound contained in an amount of 5% to 50% by mass and the polyfunctional thiol compound is contained in an amount of 0.1% to 10% by mass, relative to the content of the polymer.

Abstract: Novel thermosetting resin composition is provided. A thermosetting resin composition containing a polymer having a repeating structural unit of the following Formula (1-a): (wherein each of R1 and R2 is independently a hydrogen atom, a C1-4 alkyl group, phenyl group, or a C3-6 cyclic alkyl group, X is a single bond or a divalent organic group, and Y is a divalent organic group), and a terminal structure of the following Formula (1-b): (wherein Q is a C1-5 alkylene group, phenylene group in which at least one hydrogen atom may be substituted by a halogen atom, or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and R3 is a hydrogen atom or methyl group).