Patents by Inventor Takuya Ohno

Takuya Ohno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060032583
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: October 21, 2005
    Publication date: February 16, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20060005920
    Abstract: A method of fabricating bonded substrates with fewer production defects. The method includes forming a frame of a seal on a surface of a first substrate; disposing first and second substrates into a process chamber, depressurizing the process chamber; moving at least one of the first and second substrates in such a way that the first and second substrates approach each other, computing a pressing load acting on the first and second substrates; stopping movement of the at least one of the first and second substrates when the computed pressing load reaches a target load; and setting a pressure in the process chamber back to atmospheric pressure.
    Type: Application
    Filed: September 13, 2005
    Publication date: January 12, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Takuya Ohno, Kazushige Komatsu, Koji Hashizume, Tsukasa Adachi, Yoshimasa Miyajima, Katsuhiro Nakashima
  • Publication number: 20050236105
    Abstract: A laminated substrate manufacturing apparatus that seals an inner side of a seal frame into which liquid crystal is filled while reducing manufacturing deficiencies of laminated substrates. The substrate includes a first holding plate and a second holding plate for holding two substrates. A seal pressing device arranged on one of the first and second holding plates presses a seal formed between the substrates.
    Type: Application
    Filed: September 29, 2004
    Publication date: October 27, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Joji Hasegawa, Takuya Ohno, Akiyoshi Ito, Tetsuji Kadowaki, Takanori Muramoto
  • Publication number: 20030226633
    Abstract: An apparatus for fabricating bonded substrates with fewer production defects. A press machine includes a vacuum process chamber formed by an upper container and a lower container, two holding plates for holding two substrates, and a pressing mechanism for moving upper holding plate downward. The upper container is connected to the pressing mechanism via upper bellows. The lower container is connected to a positioning stage via lower bellows. The upper and lower bellows prevent deformation of the vacuum process chamber from being transmitted to the two holding plates.
    Type: Application
    Filed: June 4, 2003
    Publication date: December 11, 2003
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Kazushige Komatsu, Koji Hashizume, Tsukasa Adachi, Yoshimasa Miyajima, Katsuhiro Nakashima
  • Publication number: 20030178134
    Abstract: Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: January 22, 2003
    Publication date: September 25, 2003
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima