Abstract: A working machine includes a machine body, a working device on the machine body, an operation room structure on the machine body and including an operation room and a floor surface body to define a floor surface of the operation room, and a heater to heat an interior of the operation room. The heater includes a heat generator to generate heat by using electric power, and a hot water circulator to cause water heated as a result of heat generation of the heat generator to circulate. Among components of the heater, at least the heat generator is located in a space in the machine body below the floor surface body.

Abstract: A working machine includes a machine body; a seat on the machine body; a console located outward of the seat in a machine-body width direction; a meter provided at a front portion of the console; a communication unit located forward of the meter; and a unit support to support the communication unit. The unit support includes a unit bracket to which the communication unit is attached, a support bracket located outward of the meter in the machine-body width direction and attached directly or indirectly to the machine body, and an attachment tool to attach the unit bracket to the support bracket. The unit bracket includes an attached section. The support bracket includes an attaching section with which the attached section overlaps in the machine-body width direction. The attachment tool attaches the attached section to the attaching section in the machine-body width direction.

Abstract: A working machine includes a machine body; a seat on the machine body; and a communication unit including an information processing device and a communication device to receive data from and transmit data to the information processing device, the communication device containing a communication antenna and configured to transmit data. The communication unit is located at a position rearward of the seat and lower than an upper end of the seat such that the communication unit overlaps the seat in rear view.

Abstract: A floor mat arranged in a working machine includes a floor portion, a wall portion arranged on a circumferential portion of the floor portion, and an opening portion arranged on a part of a connecting portion of the wall portion, the connecting portion connecting to the floor portion. The floor mat includes a mat main body arranged on the floor portion, a covering portion configured to cover the opening portion, and an connecting portion configured to connect the covering portion flexibly to a circumferential portion of the mat main body.

Abstract: A floor mat arranged in a working machine includes a floor portion, a wall portion arranged on a circumferential portion of the floor portion, and an opening portion arranged on a part of a connecting portion of the wall portion, the connecting portion connecting to the floor portion. The floor mat includes a mat main body arranged on the floor portion, a covering portion configured to cover the opening portion, and an connecting portion configured to connect the covering portion flexibly to a circumferential portion of the mat main body.

Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.