Patents by Inventor Takuya Satou

Takuya Satou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240118612
    Abstract: An embodiment of the present invention relates to a photosensitive resin composition, a method for manufacturing a resist pattern film, and a method for manufacturing a plated shaped article; the photosensitive resin composition comprises (A) an alkali-soluble resin, (B1) a polymerizable compound having at least two (meth)acryloyl groups and at least two hydroxy groups in one molecule and having a ring structure, (C) a photoradical polymerization initiator, (D) at least one compound selected from the group consisting of a nitrogen-containing heterocyclic compound (d1) containing two or more nitrogen atoms, a thiol compound (d2), and a polymerization inhibitor (d3), and (F) a solvent.
    Type: Application
    Filed: September 25, 2023
    Publication date: April 11, 2024
    Applicant: JSR CORPORATION
    Inventors: Keiichi SATOU, Akira Ishii, Takuya Tomita, Kazuhiko Koumura
  • Publication number: 20230402985
    Abstract: A filter includes a first input/output terminal, a second input/output terminal, a third input/output terminal, a fourth input/output terminal, a first stage resonant circuit connected between the first input/output terminal and the second input/output terminal, at least one intermediate stage resonant circuit, and a final stage resonant circuit connected between the third input/output terminal and the fourth input/output terminal. The first stage resonant circuit and the final stage resonant circuit each include an inductor. The at least one intermediate stage resonant circuit includes an inductor and a capacitor connected in parallel to each other, and one end of the inductor and one end of the capacitor connected in parallel to the inductor are connected to a reference potential.
    Type: Application
    Filed: August 28, 2023
    Publication date: December 14, 2023
    Inventor: Takuya SATOU
  • Patent number: 8956141
    Abstract: A die piece for extrusion molded noodles is a die piece in which a contact angle of a water droplet on a die piece surface is 61 to 73 degrees and a water absorption of the die piece is 0.01 to 0.15% by weight after the die piece is immersed in water for 24 hours. The use of the die piece for extrusion molded noodles makes it possible to produce pasta, spaghetti, or any other extrusion molded noodles with no increase or decrease in its surface roughness (degree of surface roughness) over time and also makes it possible to stably produce, over a prolonged period of time, extrusion molded noodles having proper surface roughness.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: February 17, 2015
    Assignee: Nisshin Foods Inc.
    Inventors: Takuya Satou, Masahiro Higuchi
  • Publication number: 20130344189
    Abstract: A die piece for extrusion molded noodles is a die piece in which a contact angle of a water droplet on a die piece surface is 61 to 73 degrees and a water absorption of the die piece is 0.01 to 0.15% by weight after the die piece is immersed in water for 24 hours. The use of the die piece for extrusion molded noodles makes it possible to produce pasta, spaghetti, or any other extrusion molded noodles with no increase or decrease in its surface roughness (degree of surface roughness) over time and also makes it possible to stably produce, over a prolonged period of time, extrusion molded noodles having proper surface roughness.
    Type: Application
    Filed: March 16, 2012
    Publication date: December 26, 2013
    Applicant: NISSHIN FOODS INC.
    Inventors: Takuya Satou, Masahiro Higuchi
  • Publication number: 20110155821
    Abstract: This pearlite rail consists of a steel including: in terms of percent by mass, C: 0.65 to 1.20%; Si: 0.05 to 2.00%; Mn: 0.05 to 2.00%; P?0.0150%; S?0.0100%; Ca: 0.0005 to 0.0200%, and Fe and inevitable impurities as the balance, wherein a head surface portion which ranges from surfaces of head corner portions and a head top portion to a depth of 10 mm has a pearlite structure, a hardness Hv of the pearlite structure is in a range of 320 to 500, and Mn sulfide-based inclusions having major lengths in a range of 10 to 100 ?m are present at an amount per unit area in a range of 10 to 200/mm2 in a cross-section taken along a lengthwise direction in the pearlite structure.
    Type: Application
    Filed: October 30, 2009
    Publication date: June 30, 2011
    Inventors: Masaharu Ueda, Kazunori Seki, Takuya Satou, Takeshi Yamamoto
  • Patent number: 7898293
    Abstract: One aspect of the invention is directed to the provision of a circuit board mounted with a plurality of circuit components connected via a transmission line. The circuit components mounted on the circuit board includes at least a signal processor for processing a signal, a driver for transmitting the signal, and a receiver for receiving the signal. The driver includes a basic buffer, which is always on, and at least one control buffer, which can be individually controlled on and off, and which is connected in parallel with the basic buffer, and the output impedance of the basic buffer is set higher than the characteristic impedance of the transmission line.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: March 1, 2011
    Assignee: Fujitsu Limited
    Inventor: Takuya Satou
  • Publication number: 20080317164
    Abstract: One aspect of the invention is directed to the provision of a circuit board mounted with a plurality of circuit components connected via a transmission line. The circuit components mounted on the circuit board includes at least a signal processor for processing a signal, a driver for transmitting the signal, and a receiver for receiving the signal. The driver includes a basic buffer, which is always on, and at least one control buffer, which can be individually controlled on and off, and which is connected in parallel with the basic buffer, and the output impedance of the basic buffer is set higher than the characteristic impedance of the transmission line.
    Type: Application
    Filed: August 27, 2008
    Publication date: December 25, 2008
    Applicant: Fujitsu Limited
    Inventor: Takuya Satou
  • Patent number: 6325267
    Abstract: A clipping device is provided which comprises: a cartridge containing a belt of plate-shaped clips arranged like a belt; a pair of clamps for holding and bending the upper and lower ends of a clip occupying the front of the clip-arranged belt and thereby separating the front clip from the clip-arranged belt and fastening the end of a bundle of sheets with the separated front clip; a slider that reciprocates between the cartridge and the pair of clamps so that the clip-arranged belt is fed from the cartridge to the pair of clamps; a control unit that controls and drives the pair of clamps and the slider; and a clip-setting-detecting unit that detects whether the separated clip is held by the pair of clamps or not.
    Type: Grant
    Filed: November 28, 1997
    Date of Patent: December 4, 2001
    Assignee: Max Co., Ltd.
    Inventors: Toru Yoshie, Takuya Satou
  • Patent number: 6088883
    Abstract: This invention relates to a clip with which sheets can be fastened without being pricked. A plurality of long-and-narrow rectangular plate-like clips to be used in a clipping apparatus are arranged to be spaced away from the neighboring clips in parallel. The plurality of plate-like clips are connected by connecting members, and the connected unit of the clips is wound into a roll so that the connecting members are positioned outside the roll.
    Type: Grant
    Filed: November 28, 1997
    Date of Patent: July 18, 2000
    Assignee: Max Co., Ltd.
    Inventors: Toru Yoshie, Toshiya Ishida, Takuya Satou