Abstract: Provided are a semiconductor device capable of reducing damage on a resin case by heating during manufacture and a method of manufacturing a semiconductor device capable of reducing damage on a resin case by heating during manufacture. A semiconductor device includes a base plate, an insulating substrate, a semiconductor element, and a resin case. The base plate includes first and second regions whose positions differ from each other in a plan view. The insulating substrate is bonded on an upper surface of the second region. The insulating substrate includes a circuit pattern on an upper surface. The semiconductor element is bonded on the circuit pattern. The resin case is bonded on an upper surface of the first region. Thermal resistance between the upper surface and a lower surface of the first region is higher than thermal resistance between the upper surface and a lower surface of the second region.

Abstract: In a semiconductor device, a frame includes a first frame portion extending in a direction parallel to a connection surface to be connected to the connection surface and a second frame portion connecting a case and the first frame portion. The first frame portions are divided into a plurality of divided portions. At least one divided portion in the plurality of divided portions in the first frame portions is an elastic portion which can be elastically deformed from a first state where a tip end portion is inclined to be located on a lower side of the connection surface to a second state where the tip end portion extends in a direction parallel to the connection surface. The divided portion as the elastic portion is connected to the connection surface while being elastically deformed from the first state to the second state.