Patents by Inventor Takuya Suzuki

Takuya Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymer and Asphalt Composition
    Publication number: 20160333132
    Abstract: The polymer according to the present invention is a polymer containing a conjugated diene monomer unit and a vinyl aromatic monomer unit, wherein the polymer has a polymer block (A) containing the vinyl aromatic monomer unit as a main component and a polymer block (B) containing the conjugated diene monomer unit and the vinyl aromatic monomer unit, a content of the polymer block (A) is 10% by mass or more and 40% by mass or less, a bulk density of the polymer is 0.05 g/mL or more and 0.45 g/mL or less, and a specific surface area of the polymer is 0.10 m2/g or more and 0.60 m2/g or less.
    Type: Application
    Filed: January 16, 2015
    Publication date: November 17, 2016
    Applicant: Asahi Kasei Kabushiki Kaisha
    Inventors: Takayuki Shiromoto, Shigeo Nakajima, Yoshifumi Araki, Nobuaki Kubo, Takuya Suzuki
  • High-frequency circuit package and sensor module
    Patent number: 9433080
    Abstract: Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: August 30, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Takuya Suzuki
  • Pressure reducer
    Patent number: 9400506
    Abstract: A pressure reducer includes a piston slidably accommodated in a cylinder to define a decompression chamber and a pressure adjusting chamber. A seal member includes an elastic member and a sliding portion. The sliding portion is pressed by the elastic member such that the sliding portion slides on an inner circumferential surface of the cylinder. An annular member is located on an outer circumferential surface of the piston and between the seal member and the pressure adjusting surface. The annular member is pressed against the inner circumferential surface of the cylinder with a force that is less than a force with which the sliding portion is pressed against the inner circumferential surface of the cylinder. Thus, the pressure reducer prevents the piston from being moved by an excessive amount with highly accurately adjusting pressure.
    Type: Grant
    Filed: December 26, 2005
    Date of Patent: July 26, 2016
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Toshihiko Shima, Hidetoshi Fujiwara, Munetoshi Kuroyanagi, Takuya Suzuki, Tsukuo Ishitoya, Akira Yamashita
  • Foreign matter removing apparatus at track branch, and nozzle used in the same
    Patent number: 9315959
    Abstract: Provided is a foreign matter removing apparatus at a track branch, and a nozzle used in this apparatus that are capable of sufficiently securing foreign matter removing performance as well as significantly reducing generation of noises. In the nozzle for the foreign matter removing apparatus at a track branch, compressed air supplied from piping is injected from each nozzle element. Slits are formed in each nozzle element, a sloped portion is formed at a front end of the nozzle element, and this sloped portion opposes a tongue rail.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: April 19, 2016
    Assignee: Nabtesco Corporation
    Inventors: Takanori Sekihara, Masafumi Sato, Junichi Chiba, Shigeru Takahashi, Jun Sato, Shogo Kigami, Takuya Suzuki
  • VALVE DEVICE
    Publication number: 20160104903
    Abstract: A valve device includes a body, a solenoid valve accommodated in an accommodation hole of the body, and a joint member fixed to the body. The solenoid valve includes: a sleeve having a tubular shape and fitted in the accommodation hole, and including an introduction passage and a delivery passage; and a valve element configured to open and close the passages. A U-seal is disposed between an outer wall surface of the sleeve and an inner wall surface of the accommodation hole. The body has an attachment hole that is located downstream of the delivery passage of the sleeve and opens on an outer surface of the body. The joint member including a backflow reduction valve is fixed to the attachment hole.
    Type: Application
    Filed: October 8, 2015
    Publication date: April 14, 2016
    Inventors: Akio NAKAMURA, Takuya SUZUKI, Shusuke INAGI, Akira YAMASHITA, Masaaki KONDO
  • GAS DETECTING DEVICE AND METHOD THEREOF
    Publication number: 20160084786
    Abstract: A gas detecting method includes heating a gas detector, formed of a gas sensing layer and an adsorption layer, for an oxygen adsorption period t0 at an oxygen adsorption temperature T0; heating the gas detector for a target gas adsorption period t1 at a target gas adsorption temperature T1 at which a target gas is adsorbed to the adsorption layer, heating the gas detector for a target gas desorption period t2 at a target gas desorption temperature T2 at which the target gas adsorbed to the adsorption layer is desorbed to move to the gas sensing layer; and calculating a gas concentration of the target gas from a sensor resistance of the gas sensing layer. A gas detecting device includes the gas detector and a drive processing unit configured to carry out the method.
    Type: Application
    Filed: December 4, 2015
    Publication date: March 24, 2016
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Takuya SUZUKI
  • Phosphorus-free based halogen-free flame-retardant resin composition, phosphorus-free based halogen-free flame-retardant insulated electric wire and phosphorus-free based halogen-free flame-retardant cable
    Patent number: 9267079
    Abstract: A phosphorus-free based halogen-free flame-retardant resin composition includes a base polymer including a copolymer of ethylene and ?-olefin having carbon number of 3 to 8 polymerized by a metallocene catalyst as a main component, and 5 to 30 weight % of an ethylene-vinyl acetate copolymer that has a melt flow rate of not less than 50 g/min and a vinyl acetate content of not less than 40%, a metal hydroxide blended with the base polymer in a ratio of 100 to 250 parts by weight relative to 100 parts by weight of the base polymer, and a mineral oil blended with the base polymer in a ratio of 1 to 20 parts by weight relative to 100 parts by weight of the base polymer.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: February 23, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hitoshi Kimura, Motoharu Kajiyama, Takuya Suzuki
  • Method for Producing Polymer
    Publication number: 20150353669
    Abstract: A method for producing a polymer has: a polymerization step of polymerizing at least a conjugated diene monomer in a hydrocarbon solvent using an organolithium compound as a polymerization initiator, and obtaining a polymer; and, following steps (1) to (4), successively performing after the polymerization step: (1) a step of mixing an acid and water of 20 to 300 parts by mass into the solution containing the polymer of 100 parts by mass, (2) a step of adjusting an amount of the water to 10 parts by mass or less based on 100 parts by mass of the solution containing the polymer, (3) a step of adding a carbon oxide gas and/or a compound to be decarboxylated to the solution containing the polymer, and (4) a step of removing a solvent from the solution containing the polymer until a concentration of the polymer reaches 95 mass % or more.
    Type: Application
    Filed: January 8, 2014
    Publication date: December 10, 2015
    Applicant: Asahi Kasei Chemicals Corporation
    Inventors: Yoshifumi Araki, Eiji Sasaya, Takuya Suzuki
  • METHOD FOR PRODUCING A POLYMER, POLYMER SOLUTION AND POLYMER
    Publication number: 20150299370
    Abstract: The present invention provides a method for producing a polymer by efficiently removing residue of metals such as titanium, aluminum and lithium from a polymer solution containing the residue of these metals to successfully obtain a purified polymer solution containing a smaller amount of the metal residue and having satisfactory color tone and transparency, a polymer solution and a polymer obtained by the production method.
    Type: Application
    Filed: May 13, 2013
    Publication date: October 22, 2015
    Applicant: Asahi Kasei Chemicals Corporation
    Inventors: Daisuke SHIMIZU, Kenta SHIBUYA, Takuya SUZUKI
  • Insulated wire using a resin composition
    Patent number: 9156979
    Abstract: An insulated wire uses a resin composition. The insulated wire includes a conductor; and an insulating material provided on the conductor, the insulating material includes a polyester resin in 100 parts by weight, a non-bromine flame retardant agent in 1-30 parts by weight, a polyorganosiloxane core-graft copolymer in 1-50 parts by weight, an inorganic porous filler in 0.1-50 parts by weight; and a hydrolysis resistance modifier in 0.05-10 parts by weight.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: October 13, 2015
    Assignee: HITACHI METALS, LTD.
    Inventors: Kenichiro Fujimoto, Tomiya Abe, Kentaro Segawa, Hitoshi Kimura, Katsuhisa Shishido, Akira Suzuki, Takuya Suzuki
  • HIGH-FREQUENCY CIRCUIT PACKAGE AND SENSOR MODULE
    Publication number: 20150257254
    Abstract: Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits.
    Type: Application
    Filed: May 22, 2015
    Publication date: September 10, 2015
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Takuya SUZUKI
  • High-frequency circuit package and sensor module
    Patent number: 9070961
    Abstract: Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits.
    Type: Grant
    Filed: September 2, 2009
    Date of Patent: June 30, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventor: Takuya Suzuki
  • METHOD FOR MANUFACTURING TURBOCHARGER BEARING HOUSING, AND TURBOCHARGER BEARING HOUSING
    Publication number: 20150093238
    Abstract: There is provided a method for manufacturing a turbocharger bearing housing which can prevent a collapsible core from being damaged when molten metal is cast in the mold. The method for manufacturing a bearing housing of a turbocharger is that the bearing housing of the turbocharger is formed with a cooling passage for circulating cooling liquid by casting using a collapsible core. The collapsible core includes the end part forming portions (a one end forming portion and an other end forming portion) corresponding to the end portions of the cooling passage and having a substantially elliptical cross-section, and a fixing portion holding the end part forming portions and being embedded in a mold and fixed to the mold.
    Type: Application
    Filed: April 25, 2013
    Publication date: April 2, 2015
    Applicant: TAIHO KOGYO CO., LTD.
    Inventors: Satoru Kanbara, Keijiro Maki, Kenji Muraoka, Yasuhiro Otake, Takuya Suzuki
  • FOREIGN MATTER REMOVING APPARATUS AT TRACK BRANCH, AND NOZZLE USED IN THE SAME
    Publication number: 20140298613
    Abstract: Provided is a foreign matter removing apparatus at a track branch, and a nozzle used in this apparatus that are capable of sufficiently securing foreign matter removing performance as well as significantly reducing generation of noises. In the nozzle for the foreign matter removing apparatus at a track branch, compressed air supplied from piping is injected from each nozzle element. Slits are formed in each nozzle element, a sloped portion is formed at a front end of the nozzle element, and this sloped portion opposes a tongue rail.
    Type: Application
    Filed: July 26, 2012
    Publication date: October 9, 2014
    Inventors: Takanori Sekihara, Masafumi Sato, Junichi Chiba, Shigeru Takahashi, Jun Sato, Shogo Kigami, Takuya Suzuki
  • HIGH-FREQUENCY PACKAGE
    Publication number: 20140085858
    Abstract: A high-frequency package includes a first dielectric substrate having a signal line and a grounding conductor provided on a back side, a high-frequency element connected to a back side of the first dielectric substrate with a first connection conductor therebetween, a second dielectric substrate having a signal line and a grounding conductor provided on a front side facing the back side with the high-frequency element therebetween, and second connection conductors that are arranged so as to surround the high-frequency element and connect the grounding conductor on the back side of the first dielectric substrate and the grounding conductor on the front side of the second dielectric substrate. In the high-frequency package, a dielectric space surrounded by a conductor pattern is formed in the front side of the second dielectric substrate under the high-frequency element.
    Type: Application
    Filed: January 31, 2012
    Publication date: March 27, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yusuke Kitsukawa, Takuya Suzuki, Tomoyuki Unno
  • Semiconductor chip and radio frequency circuit
    Patent number: 8548416
    Abstract: A two-terminal semiconductor device is formed on a semiconductor substrate. Two wiring patterns are respectively connected to terminals of the semiconductor device, and two electrode pads are respectively connected to the wiring patterns for connecting a signal input/output circuit formed on a separate substrate. Two parallel wiring patterns are respectively connected to the wiring patterns, and two reactance-circuit connection electrode pads are respectively connected to the parallel wiring patterns for electrically connecting a reactance circuit formed on the separate substrate separately from the signal input/output circuit.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: October 1, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takuya Suzuki, Kenji Kawakami, Ko Kanaya, Yoichi Kitamura
  • PHOSPHORUS-FREE BASED HALOGEN-FREE FLAME-RETARDANT RESIN COMPOSITION, PHOSPHORUS-FREE BASED HALOGEN-FREE FLAME-RETARDANT INSULATED ELECTRIC WIRE AND PHOSPHORUS-FREE BASED HALOGEN-FREE FLAME-RETARDANT CABLE
    Publication number: 20130240239
    Abstract: A phosphorus-free based halogen-free flame-retardant resin composition includes a base polymer including a copolymer of ethylene and ?-olefin having carbon number of 3 to 8 polymerized by a metallocene catalyst as a main component, and 5 to 30 weight % of an ethylene-vinyl acetate copolymer that has a melt flow rate of not less than 50 g/min and a vinyl acetate content of not less than 40%, a metal hydroxide blended with the base polymer in a ratio of 100 to 250 parts by weight relative to 100 parts by weight of the base polymer, and a mineral oil blended with the base polymer in a ratio of 1 to 20 parts by weight relative to 100 parts by weight of the base polymer.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 19, 2013
    Applicant: HITACHI CABLE, LTD.
    Inventors: Hitoshi KIMURA, Motoharu KAJIYAMA, Takuya SUZUKI
  • Valve device and manually operated shutoff valve device
    Patent number: 8474792
    Abstract: In a valve device for selectively opening and closing a flow passage formed to open on a valve seat by a valve body through a resin-made seat, a hollow portion is formed on either one of the valve body and the valve seat and receives the resin-made seat therein, the resin-made seat has a thickness so that the resin-made seat partly protrudes from the hollow portion, and when the valve body is operated to close the flow passage, the resin-made seat is compressed to bring an end surface of the valve body into contact with the valve seat.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: July 2, 2013
    Assignee: JTEKT Corporation
    Inventors: Toshikatsu Kubo, Toshihiko Shima, Takuya Suzuki, Munetoshi Kuroyanagi
  • Polybutylene naphthalate-based resin composition and electric wire using the polybutylene naphthalate-based resin composition
    Patent number: 8445785
    Abstract: A polybutylene naphthalate-based resin composition contains polybutylene naphthalate resin, a polyester block copolymer, and magnesium hydroxide; and an electric wire uses a polybutylene naphthalate-based resin composition, with an insulated coating layer formed on a conductor, by using a polybutylene naphthalate-based resin composition containing polybutylene naphthalate resin, a polyester block copolymer, and magnesium hydroxide as an insulating material.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: May 21, 2013
    Assignee: Hitachi Cable, Ltd.
    Inventors: Kenichiro Fujimoto, Tomiya Abe, Hitoshi Kimura, Katsuhisa Shishido, Akira Suzuki, Takuya Suzuki
  • Analysis device, and analysis apparatus and method using the same
    Patent number: 8415140
    Abstract: An analysis device includes: a separation cavity 18 for separating a test liquid into a solution component and a solid component by using a centrifugal force; a higher specific gravity component quantitative cavity 23 for holding a portion of the separated solid component which has been transferred; a sample solution overflow cavity 22 arranged between the higher specific gravity component quantitative cavity 23 and the separation cavity 18 and connected to a connecting channel 21 for transporting the sample liquid from the separation cavity 18; and a capillary cavity 19 formed in the separation cavity 18 for temporarily holding a separated solution component (blood plasma) in the separation cavity 18. A blood plasma component 57a remaining in the separation cavity 18 is trapped by the capillary cavity 19.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: April 9, 2013
    Assignee: Panasonic Corporation
    Inventors: Hiroshi Saiki, Takashi Miki, Takuya Suzuki