Patents by Inventor Takuya Teranishi
Takuya Teranishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230275277Abstract: A battery pack having a first cell unit and a second cell unit in which multiple battery cells are connected in series is provided. When the battery pack is not connected to an electric apparatus main body, the first cell unit and the second cell unit are in a non-connection state in which the first cell unit and the second cell unit are not electrically connected to each other. The battery pack includes: a microcomputer, connected to one of the first cell unit and the second cell unit; a residual quantity display portion, connected to the microcomputer and displaying a battery residual quantity of the battery pack; and a switch, being operated by a worker. When the switch is operated while in the non-connection state, the microcomputer is configured to perform a light-on control to display the battery residual quantity by the residual quantity display portion.Type: ApplicationFiled: May 2, 2023Publication date: August 31, 2023Applicant: Koki Holdings Co., Ltd.Inventors: Yasushi NAKANO, Satoshi YAMAGUCHI, Hiroyuki HANAWA, Kazuhiko FUNABASHI, Tomomasa NISHIKAWA, Shota Kanno, Toshio Mizoguchi, Takuya Teranishi
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Patent number: 11618803Abstract: Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.Type: GrantFiled: March 16, 2021Date of Patent: April 4, 2023Assignee: Mitsubishi Chemical CorporationInventors: Takuya Teranishi, Masahiro Ichino, Akira Oota
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Publication number: 20230046977Abstract: A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25° C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester.Type: ApplicationFiled: October 7, 2022Publication date: February 16, 2023Applicant: Mitsubishi Chemical CorporationInventors: Akira OTA, Masahiro ICHINO, Takuya TERANISHI
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Publication number: 20220302510Abstract: A battery pack and an electric apparatus are provided. The battery pack is configured to be connectable to an electric apparatus main body of the electric apparatus. The battery pack includes: a first cell unit, including a first plurality of battery cells connected to each other, a first positive terminal, and a first negative terminal; a second cell unit, including a second plurality of battery cells connected to each other, a second positive terminal, and a second negative terminal; a microcomputer; and a casing, accommodating the first cell unit, the second cell unit, and the microcomputer. The first cell unit and the second cell unit are configured to be switched a connection state each other. The microcomputer is configured to be electrically connected to a positive terminal and a negative terminal of one of the first cell unit and the second cell unit and to be provided a power from the one of the first cell unit and the second cell unit.Type: ApplicationFiled: June 6, 2022Publication date: September 22, 2022Applicant: Koki Holdings Co., Ltd.Inventors: Yasushi Nakano, Satoshi YAMAGUCHI, Hiroyuki HANAWA, Kazuhiko FUNABASHI, Tomomasa NISHIKAWA, Shota KANNO, Toshio Mizoguchi, Takuya Teranishi
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Publication number: 20220227951Abstract: A prepreg may include: a reinforcing fiber material including carbon fibers; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition may include an epoxy resin (A), an amine curing agent (B), and an imidazole curing agent (C). The amine curing agent (B) may be present in a range of from 1 to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin (A). The amine curing agent (B) and the imidazole curing agent (C) may be present in a total amount of not more than 10 parts by mass, relative to 100 parts by mass of the epoxy resin (A). The imidazole curing agent may include an imidazole compound including, in its molecular structure, a triazine ring.Type: ApplicationFiled: April 5, 2022Publication date: July 21, 2022Applicant: Mitsubishi Chemical CorporationInventors: Takuya TERANISHI, Satoshi OKAMOTO, Akira OOTA, Masahiro ICHINO
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Patent number: 11367907Abstract: A battery pack includes cell units in which upper and lower battery cells are connected in series, wherein an output of series-connection and an output of parallel-connection can be switched. The cell units are respectively provided with protection circuit ICs for monitoring the state of the battery cells, and only the protection circuit on the lower cell unit side is provided with a controller 350 including a microcomputer. To adjust the power consumption for the microcomputer only provided in the lower cell unit, the circuit on the upper cell unit side is provided with a current consumption control means including dummy loads. The current consumption control means is operated in conjunction with the start-up of the microcomputer in the controller so as to equalize power consumption on the upper cell unit side and the lower cell unit side.Type: GrantFiled: May 30, 2018Date of Patent: June 21, 2022Assignee: Koki Holdings Co., Ltd.Inventors: Yasushi Nakano, Satoshi Yamaguchi, Hiroyuki Hanawa, Kazuhiko Funabashi, Tomomasa Nishikawa, Shota Kanno, Toshio Mizoguchi, Takuya Teranishi
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Patent number: 11339261Abstract: A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.Type: GrantFiled: July 10, 2020Date of Patent: May 24, 2022Assignee: Mitsubishi Chemical CorporationInventors: Takuya Teranishi, Satoshi Okamoto, Akira Oota, Masahiro Ichino
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Publication number: 20220153923Abstract: A thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.Type: ApplicationFiled: February 1, 2022Publication date: May 19, 2022Applicant: Mitsubishi Chemical CorporationInventors: Takuya TERANISHI, Masahiro ICHINO, Kazuhisa IKEDA, Akira OOTA
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Patent number: 11292874Abstract: Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.Type: GrantFiled: February 21, 2019Date of Patent: April 5, 2022Assignee: Mitsubishi Chemical CorporationInventors: Takuya Teranishi, Masahiro Ichino, Kazuhisa Ikeda, Akira Oota
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Patent number: 11205820Abstract: In an upper cell unit (2146) and a lower cell unit (2147) comprising five battery cells, positive electrode terminals (2162, 2172) are set apart and aligned vertically, and negative electrode terminals (2167, 2177) are set apart and aligned vertically. When an electrical device body is rated at 36V, device-side terminals are in contact only at the upper terminals (2162, 2167), and short circuiting of the lower terminals (2172, 2177) is effected using a short bar 2059. When the electrical device body is rated at 18V, the upper and lower terminals (2162 and 2172, 2167 and 2177) are simultaneously made to contact the device-side terminals, and the upper cell unit (2146) and the lower cell unit (2147) assume a parallel connected state. Thus, it is possible to automatically switch the output voltage when a battery pack is mounted according to the difference in terminal shape on the electrical device body side.Type: GrantFiled: October 27, 2017Date of Patent: December 21, 2021Assignee: Koki Holdings Co., Ltd.Inventors: Hiroyuki Hanawa, Tomomasa Nishikawa, Shota Kanno, Toshio Mizoguchi, Yasushi Nakano, Kazuhiko Funabashi, Takuya Teranishi, Naoto Wakatabe, Shinji Watanabe, Junpei Sato, Hikaru Tamura, Nobuhiro Takano, Osamu Kawanobe, Hayato Yamaguchi, Akira Matsushita, Masaru Hirano, Takuhiro Murakami, Masayuki Ogura, Yusuke Funabiki, Junichi Toukairin, Shota Takeuchi
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Patent number: 11104793Abstract: A molding material that enables acquirement of a fiber-reinforced composite material which has excellent demoldability from a mold and excellent surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance; and a fiber-reinforced composite material which has excellent demoldability from a mold and surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance, are provided. A molding material of the present invention includes a component (A): an epoxy resin; a component (B): an epoxy resin curing agent; a component (C): a compound that has a solubility parameter of 11.2 or less and a melting point of 115° C. or lower; and a reinforcement fiber.Type: GrantFiled: November 19, 2019Date of Patent: August 31, 2021Assignee: Mitsubishi Chemical CorporationInventors: Akira Oota, Masahiro Ichino, Takuya Teranishi, Yusuke Watanabe, Natsumi Mukouzaka
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Publication number: 20210230385Abstract: Provided is a prepreg that can be cured in a short time even at a low temperature, and can obtain a fiber-reinforced composite resin molded article having excellent mechanical properties such as flexural modulus, bending strength, and breaking strain, and excellent heat resistance. The prepreg of the embodiment includes an epoxy resin composition and a reinforcing fiber, in which the epoxy resin composition includes a component (A): an oxazolidone epoxy resin, a component (B): a novolac epoxy resin, a component (C): a urea compound, and a component (D): a curing agent, and with respect to a total mass of all epoxy resins included in the epoxy resin composition, a content of the component (A) is 40% to 70% by mass and a content of the component (B) is 15% to 40% by mass.Type: ApplicationFiled: April 12, 2021Publication date: July 29, 2021Applicant: Mitsubishi Chemical CorporationInventors: Nao Kawamura, Takuya Teranishi
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Publication number: 20210214511Abstract: An object of the present invention is to provide a molding material which can suppress film lifting, gives good peelability of release paper, and can produce therefrom a fiber-reinforced composite article with good demoldability from a metal mold, and a fiber-reinforced composite article. The molding material of the present invention comprises an epoxy resin composition comprising a component (A): an epoxy resin, a component (B): an epoxy resin curing agent, and a component (C): an unsaturated fatty acid ester compound having a melting point or pour point of 25° C. or lower; and a reinforcing fiber substrate, wherein the reinforcing fiber substrate is impregnated with the epoxy resin composition.Type: ApplicationFiled: March 26, 2021Publication date: July 15, 2021Applicant: Mitsubishi Chemical CorporationInventors: Takuya Teranishi, Akira Oota, Masahiro Ichino
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Publication number: 20210198440Abstract: Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.Type: ApplicationFiled: March 16, 2021Publication date: July 1, 2021Applicant: Mitsubishi Chemical CorporationInventors: Takuya TERANISHI, Masahiro ICHINO, Akira OOTA
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Patent number: 10988589Abstract: Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.Type: GrantFiled: April 29, 2020Date of Patent: April 27, 2021Assignee: Mitsubishi Chemical CorporationInventors: Takuya Teranishi, Masahiro Ichino, Akira Oota
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Patent number: 10920027Abstract: The invention provides an epoxy resin composition that is easily B-staged despite containing an epoxy resin inherently difficult to B-stage, has a long pot life, has excellent processability and storage stability after B-staging, and make it possible to obtain a fiber-reinforced composite material having excellent flexural strength and flexural modulus. A molding material, including a thickened product of an epoxy resin composition; and a reinforcing fiber; wherein the epoxy resin composition including: a component (A): an aromatic epoxy resin; a component (B): an alicyclic diamine; a component (C): an epoxy resin curing agent that is not an alicyclic diamine; and a component (D): an aliphatic epoxy resin, wherein, when the viscosity at 25° C. immediately after preparation of the epoxy resin composition is taken as (a) and the viscosity at 25° C. after three hours from the preparation is taken as (b), the epoxy resin composition satisfies: (a)=0.1 to 25 Pa·s; (b)=0.1 to 25 Pa·s; and (b)/(a)?5.Type: GrantFiled: August 27, 2018Date of Patent: February 16, 2021Assignee: Mitsubishi Chemical CorporationInventors: Akira Oota, Masahiro Ichino, Takuya Teranishi, Mitsuru Kutsuwada, Yusuke Watanabe, Natsumi Mukouzaka
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Publication number: 20210009776Abstract: A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.Type: ApplicationFiled: July 10, 2020Publication date: January 14, 2021Applicant: Mitsubishi Chemical CorporationInventors: Takuya TERANISHI, Satoshi OKAMOTO, Akira OOTA, Masahiro ICHINO
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Publication number: 20200255614Abstract: Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.Type: ApplicationFiled: April 29, 2020Publication date: August 13, 2020Applicant: Mitsubishi Chemical CorporationInventors: Takuya Teranishi, Masahiro Ichino, Akira Oota
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Publication number: 20200212414Abstract: An electric device capable of suppressing the short circuit between adjacent terminals is provided. The electric device includes a battery pack in which a plurality of battery-side terminals are provided and a device body in which device-side terminals are provided and to which the battery pack is detachably attached. One of the battery-side terminals and the device-side terminals are plate terminals protruding from a terminal holder, and the other of the battery-side terminals and the device-side terminals are connection terminals which protrude into slots in which the plate terminals are inserted and come into contact with the plate terminals. An insulating portion extending from the terminal holder toward a tip of the plate terminal and inserted into the slot is provided to at least one of the plate terminals.Type: ApplicationFiled: July 27, 2018Publication date: July 2, 2020Inventors: Shota TAKEUCHI, Takuya TERANISHI, Masayuki OGURA, Yusuke FUNABIKI, Junichi TOUKAIRIN
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Publication number: 20200212505Abstract: A battery pack includes cell units in which upper and lower battery cells are connected in series, wherein an output of series-connection and an output of parallel-connection can be switched. The cell units are respectively provided with protection circuit ICs for monitoring the state of the battery cells, and only the protection circuit on the lower cell unit side is provided with a controller 350 including a microcomputer. To adjust the power consumption for the microcomputer only provided in the lower cell unit, the circuit on the upper cell unit side is provided with a current consumption control means including dummy loads. The current consumption control means is operated in conjunction with the start-up of the microcomputer in the controller so as to equalize power consumption on the upper cell unit side and the lower cell unit side.Type: ApplicationFiled: May 30, 2018Publication date: July 2, 2020Applicant: Koki Holdings Co., Ltd.Inventors: Yasushi Nakano, Satoshi YAMAGUCHI, Hiroyuki HANAWA, Kazuhiko FUNABASHI, Tomomasa NISHIKAWA, Shota KANNO, Toshio Mizoguchi, Takuya Teranishi