Patents by Inventor Takuya Teranishi

Takuya Teranishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11367907
    Abstract: A battery pack includes cell units in which upper and lower battery cells are connected in series, wherein an output of series-connection and an output of parallel-connection can be switched. The cell units are respectively provided with protection circuit ICs for monitoring the state of the battery cells, and only the protection circuit on the lower cell unit side is provided with a controller 350 including a microcomputer. To adjust the power consumption for the microcomputer only provided in the lower cell unit, the circuit on the upper cell unit side is provided with a current consumption control means including dummy loads. The current consumption control means is operated in conjunction with the start-up of the microcomputer in the controller so as to equalize power consumption on the upper cell unit side and the lower cell unit side.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: June 21, 2022
    Assignee: Koki Holdings Co., Ltd.
    Inventors: Yasushi Nakano, Satoshi Yamaguchi, Hiroyuki Hanawa, Kazuhiko Funabashi, Tomomasa Nishikawa, Shota Kanno, Toshio Mizoguchi, Takuya Teranishi
  • Patent number: 11339261
    Abstract: A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: May 24, 2022
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Satoshi Okamoto, Akira Oota, Masahiro Ichino
  • Publication number: 20220153923
    Abstract: A thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.
    Type: Application
    Filed: February 1, 2022
    Publication date: May 19, 2022
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya TERANISHI, Masahiro ICHINO, Kazuhisa IKEDA, Akira OOTA
  • Patent number: 11292874
    Abstract: Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: April 5, 2022
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Masahiro Ichino, Kazuhisa Ikeda, Akira Oota
  • Patent number: 11205820
    Abstract: In an upper cell unit (2146) and a lower cell unit (2147) comprising five battery cells, positive electrode terminals (2162, 2172) are set apart and aligned vertically, and negative electrode terminals (2167, 2177) are set apart and aligned vertically. When an electrical device body is rated at 36V, device-side terminals are in contact only at the upper terminals (2162, 2167), and short circuiting of the lower terminals (2172, 2177) is effected using a short bar 2059. When the electrical device body is rated at 18V, the upper and lower terminals (2162 and 2172, 2167 and 2177) are simultaneously made to contact the device-side terminals, and the upper cell unit (2146) and the lower cell unit (2147) assume a parallel connected state. Thus, it is possible to automatically switch the output voltage when a battery pack is mounted according to the difference in terminal shape on the electrical device body side.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: December 21, 2021
    Assignee: Koki Holdings Co., Ltd.
    Inventors: Hiroyuki Hanawa, Tomomasa Nishikawa, Shota Kanno, Toshio Mizoguchi, Yasushi Nakano, Kazuhiko Funabashi, Takuya Teranishi, Naoto Wakatabe, Shinji Watanabe, Junpei Sato, Hikaru Tamura, Nobuhiro Takano, Osamu Kawanobe, Hayato Yamaguchi, Akira Matsushita, Masaru Hirano, Takuhiro Murakami, Masayuki Ogura, Yusuke Funabiki, Junichi Toukairin, Shota Takeuchi
  • Patent number: 11104793
    Abstract: A molding material that enables acquirement of a fiber-reinforced composite material which has excellent demoldability from a mold and excellent surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance; and a fiber-reinforced composite material which has excellent demoldability from a mold and surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance, are provided. A molding material of the present invention includes a component (A): an epoxy resin; a component (B): an epoxy resin curing agent; a component (C): a compound that has a solubility parameter of 11.2 or less and a melting point of 115° C. or lower; and a reinforcement fiber.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: August 31, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Akira Oota, Masahiro Ichino, Takuya Teranishi, Yusuke Watanabe, Natsumi Mukouzaka
  • Publication number: 20210230385
    Abstract: Provided is a prepreg that can be cured in a short time even at a low temperature, and can obtain a fiber-reinforced composite resin molded article having excellent mechanical properties such as flexural modulus, bending strength, and breaking strain, and excellent heat resistance. The prepreg of the embodiment includes an epoxy resin composition and a reinforcing fiber, in which the epoxy resin composition includes a component (A): an oxazolidone epoxy resin, a component (B): a novolac epoxy resin, a component (C): a urea compound, and a component (D): a curing agent, and with respect to a total mass of all epoxy resins included in the epoxy resin composition, a content of the component (A) is 40% to 70% by mass and a content of the component (B) is 15% to 40% by mass.
    Type: Application
    Filed: April 12, 2021
    Publication date: July 29, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Nao Kawamura, Takuya Teranishi
  • Publication number: 20210214511
    Abstract: An object of the present invention is to provide a molding material which can suppress film lifting, gives good peelability of release paper, and can produce therefrom a fiber-reinforced composite article with good demoldability from a metal mold, and a fiber-reinforced composite article. The molding material of the present invention comprises an epoxy resin composition comprising a component (A): an epoxy resin, a component (B): an epoxy resin curing agent, and a component (C): an unsaturated fatty acid ester compound having a melting point or pour point of 25° C. or lower; and a reinforcing fiber substrate, wherein the reinforcing fiber substrate is impregnated with the epoxy resin composition.
    Type: Application
    Filed: March 26, 2021
    Publication date: July 15, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Akira Oota, Masahiro Ichino
  • Publication number: 20210198440
    Abstract: Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.
    Type: Application
    Filed: March 16, 2021
    Publication date: July 1, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya TERANISHI, Masahiro ICHINO, Akira OOTA
  • Patent number: 10988589
    Abstract: Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: April 27, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Masahiro Ichino, Akira Oota
  • Patent number: 10920027
    Abstract: The invention provides an epoxy resin composition that is easily B-staged despite containing an epoxy resin inherently difficult to B-stage, has a long pot life, has excellent processability and storage stability after B-staging, and make it possible to obtain a fiber-reinforced composite material having excellent flexural strength and flexural modulus. A molding material, including a thickened product of an epoxy resin composition; and a reinforcing fiber; wherein the epoxy resin composition including: a component (A): an aromatic epoxy resin; a component (B): an alicyclic diamine; a component (C): an epoxy resin curing agent that is not an alicyclic diamine; and a component (D): an aliphatic epoxy resin, wherein, when the viscosity at 25° C. immediately after preparation of the epoxy resin composition is taken as (a) and the viscosity at 25° C. after three hours from the preparation is taken as (b), the epoxy resin composition satisfies: (a)=0.1 to 25 Pa·s; (b)=0.1 to 25 Pa·s; and (b)/(a)?5.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: February 16, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Akira Oota, Masahiro Ichino, Takuya Teranishi, Mitsuru Kutsuwada, Yusuke Watanabe, Natsumi Mukouzaka
  • Publication number: 20210009776
    Abstract: A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 14, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya TERANISHI, Satoshi OKAMOTO, Akira OOTA, Masahiro ICHINO
  • Publication number: 20200255614
    Abstract: Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.
    Type: Application
    Filed: April 29, 2020
    Publication date: August 13, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Masahiro Ichino, Akira Oota
  • Publication number: 20200212414
    Abstract: An electric device capable of suppressing the short circuit between adjacent terminals is provided. The electric device includes a battery pack in which a plurality of battery-side terminals are provided and a device body in which device-side terminals are provided and to which the battery pack is detachably attached. One of the battery-side terminals and the device-side terminals are plate terminals protruding from a terminal holder, and the other of the battery-side terminals and the device-side terminals are connection terminals which protrude into slots in which the plate terminals are inserted and come into contact with the plate terminals. An insulating portion extending from the terminal holder toward a tip of the plate terminal and inserted into the slot is provided to at least one of the plate terminals.
    Type: Application
    Filed: July 27, 2018
    Publication date: July 2, 2020
    Inventors: Shota TAKEUCHI, Takuya TERANISHI, Masayuki OGURA, Yusuke FUNABIKI, Junichi TOUKAIRIN
  • Publication number: 20200212505
    Abstract: A battery pack includes cell units in which upper and lower battery cells are connected in series, wherein an output of series-connection and an output of parallel-connection can be switched. The cell units are respectively provided with protection circuit ICs for monitoring the state of the battery cells, and only the protection circuit on the lower cell unit side is provided with a controller 350 including a microcomputer. To adjust the power consumption for the microcomputer only provided in the lower cell unit, the circuit on the upper cell unit side is provided with a current consumption control means including dummy loads. The current consumption control means is operated in conjunction with the start-up of the microcomputer in the controller so as to equalize power consumption on the upper cell unit side and the lower cell unit side.
    Type: Application
    Filed: May 30, 2018
    Publication date: July 2, 2020
    Applicant: Koki Holdings Co., Ltd.
    Inventors: Yasushi Nakano, Satoshi YAMAGUCHI, Hiroyuki HANAWA, Kazuhiko FUNABASHI, Tomomasa NISHIKAWA, Shota KANNO, Toshio Mizoguchi, Takuya Teranishi
  • Publication number: 20200180044
    Abstract: The electrical device comprises a common device main body having selectively and detachably attached thereto either a variable-voltage power supply device or a high-voltage power supply device. The device main body has: a protruding section that abuts a power supply-side main erroneous attachment prevention section provided in the variable-voltage power supply device and the high-voltage power supply device; a device-side main erroneous attachment prevention section that abuts the power supply-side main erroneous attachment prevention section provided in a low-voltage power supply device and prevents the low-voltage power supply device from abutting an attachment positioning section; and a device-side attachment pet' lifting section that can be combined in a power supply-side auxiliary erroneous attachment prevention section provided in the high-voltage power supply device.
    Type: Application
    Filed: July 27, 2018
    Publication date: June 11, 2020
    Applicant: Koki Holdings Co., Ltd.
    Inventors: Yusuke FUNABIKI, Tomomasa NISHIKAWA, Takuya Teranishi, Masayuki Ogura
  • Publication number: 20200161609
    Abstract: The electrical apparatus, in which a series connection state and a parallel connection state of an upper cell unit including five battery cells and a lower cell unit can be automatically switched by means of a difference in a terminal shape on the electrical apparatus body side, has a terminal holder and holds apparatus side terminals. The terminal holder, which establishes an electrically connected state with the connection terminals of the battery pack, is provided with two parallel protruding parts that extend in the forward-backward direction, and second rail grooves fitted to the protruding parts on the electrical apparatus side. Due to the fitting, relative movement of the terminal holder and the battery pack in the vertical direction can be suppressed, and wear on the apparatus side terminals can be greatly suppressed.
    Type: Application
    Filed: June 29, 2018
    Publication date: May 21, 2020
    Applicant: Koki Holdings Co., Ltd.
    Inventors: Takuhiro Murakami, Tomomasa NISHIKAWA, Shinji Watanabe, Junpei SATO, Hikaru Tamura, Shota KANNO, Toshio Mizoguchi, Yasushi Nakano, Hiroyuki HANAWA, Kazuhiko FUNABASHI, Masayuki Ogura, Takuya Teranishi, Junichi Toukairin, Shota Takeuchi, Yusuke FUNABIKI
  • Patent number: 10647828
    Abstract: This prepreg comprises reinforcing fibers and a matrix resin composition. The matrix resin composition comprises at least an epoxy resin (component (A)), a radical polymerizable unsaturated compound (component (B)), and a polymer formed by radical polymerization of the component (B) (component (E)).
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: May 12, 2020
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Manabu Kaneko, Masahiro Ichino, Teppei Miura, Tadao Samejima, Akira Miyauchi, Kiharu Numata, Shouhei Mori, Masaki Kusumi
  • Publication number: 20200140633
    Abstract: The invention provides an epoxy resin composition that is easily B-staged despite containing an epoxy resin inherently difficult to B-stage, has a long pot life, has excellent processability and storage stability after B-staging, and make it possible to obtain a fiber-reinforced composite material having excellent flexural strength and flexural modulus. A molding material, including a thickened product of an epoxy resin composition; and a reinforcing fiber; wherein the epoxy resin composition including: a component (A): an aromatic epoxy resin; a component (B): an alicyclic diamine; a component (C): an epoxy resin curing agent that is not an alicyclic diamine; and a component (D): an aliphatic epoxy resin, wherein, when the viscosity at 25° C. immediately after preparation of the epoxy resin composition is taken as (a) and the viscosity at 25° C. after three hours from the preparation is taken as (b), the epoxy resin composition satisfies: (a)=0.1 to 25 Pa·s; (b)=0.1 to 25 Pa·s; and (b)/(a)?5.
    Type: Application
    Filed: August 27, 2018
    Publication date: May 7, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro ICHINO, Takuya TERANISHI, Mitsuru KUTSUWADA, Yusuke WATANABE, Natsumi MUKOUZAKA
  • Publication number: 20200087506
    Abstract: A molding material that enables acquirement of a fiber-reinforced composite material which has excellent demoldability from a mold and excellent surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance; and a fiber-reinforced composite material which has excellent demoldability from a mold and surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance, are provided. A molding material of the present invention includes a component (A): an epoxy resin; a component (B): an epoxy resin curing agent; a component (C): a compound that has a solubility parameter of 11.2 or less and a melting point of 115° C. or lower; and a reinforcement fiber.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 19, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro Ichino, Takuya Teranishi, Yusuke Watanabe, Natsumi Mukouzaka