Abstract: A wafer holding table includes a ceramic electrostatic chuck, a metal cooling plate, a resin layer having predetermined thermal resistance, and a stress relaxation layer having lower Young's modulus than the resin layer. The resin layer and the stress relaxation layer are disposed between the electrostatic chuck and the cooling plate. The resin layer is disposed closer to the electrostatic chuck, and the stress relaxation layer is disposed closer to the cooling plate. The resin layer has a multilayer structure including a plurality of resin sheets laminated one on another. The resin layer is thinner than a comparative sample with a single-layer structure made of a material identical to a material of the resin sheet and having thermal resistance identical to thermal resistance of the resin layer.

Abstract: A wafer holding table includes a ceramic electrostatic chuck, a metal cooling plate, a resin layer having predetermined thermal resistance, and a stress relaxation layer having lower Young's modulus than the resin layer. The resin layer and the stress relaxation layer are disposed between the electrostatic chuck and the cooling plate. The resin layer is disposed closer to the electrostatic chuck, and the stress relaxation layer is disposed closer to the cooling plate. The resin layer has a multilayer structure including a plurality of resin sheets laminated one on another. The resin layer is thinner than a comparative sample with a single-layer structure made of a material identical to a material of the resin sheet and having thermal resistance identical to thermal resistance of the resin layer.

Abstract: A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other.

Abstract: A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other.