Patents by Inventor Talieh H. Sadighi

Talieh H. Sadighi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD FOR REMOVING OXIDE FROM A SENSOR CLIP ASSEMBLY
    Publication number: 20140173926
    Abstract: According to embodiments of the present disclosure, a method for removing oxide includes placing a sensor chip assembly having an oxide layer formed on a portion thereof within an enclosed and controlled environment. The portion of the sensor chip assembly is exposed to a reactive gas and a UV light to result in a substantial removal of the oxide layer formed on the portion of the sensor chip assembly.
    Type: Application
    Filed: March 3, 2014
    Publication date: June 26, 2014
    Applicant: Raytheon Company
    Inventors: Andreas Hampp, Sean F. Harris, Talieh H. Sadighi, Bengi F. Hanyaloglu
  • System and method for removing oxide from a sensor clip assembly
    Patent number: 8709949
    Abstract: According to embodiments of the present disclosure, a method for removing oxide includes placing a sensor chip assembly having an oxide layer formed on a portion thereof within an enclosed and controlled environment. The portion of the sensor chip assembly is exposed to a reactive gas and a UV light to result in a substantial removal of the oxide layer formed on the portion of the sensor chip assembly.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: April 29, 2014
    Assignee: Raytheon Company
    Inventors: Andreas Hampp, Sean F. Harris, Talieh H. Sadighi, Bengi F. Hanyaloglu
  • System and Method for Removing Oxide from a Sensor Clip Assembly
    Publication number: 20120285923
    Abstract: According to embodiments of the present disclosure, a method for removing oxide includes placing a sensor chip assembly having an oxide layer formed on a portion thereof within an enclosed and controlled environment. The portion of the sensor chip assembly is exposed to a reactive gas and a UV light to result in a substantial removal of the oxide layer formed on the portion of the sensor chip assembly.
    Type: Application
    Filed: May 13, 2011
    Publication date: November 15, 2012
    Applicant: Raytheon Company
    Inventors: Andreas Hampp, Sean F. Harris, Talieh H. Sadighi, Bengi F. Hanyaloglu