Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.

Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.

Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.

Abstract: Methods and apparatuses for sensing nucleotides are disclosed. A related nucleotide sensing device may include an insulator having an electrode well and a separation layer attached to the insulator, the separation layer including a film and a shell layer. The film may have a hole, the hole having a first diameter. The shell layer may be disposed on a surface of the film, and at least a portion of the shell layer may be disposed within the hole. The separation layer may be formed of inorganic material and may comprise a nanopore. The nanopore may permit fluid communication with the electrode well across the separation layer. The nanopore may be disposed within the hole and may have a second diameter smaller than the first diameter.

Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.

Abstract: Some implementations of augmented reality glasses disclosed herein include an eyeglass substrate, two or more display elements, image optics configured for coupling light from the display elements into the eyeglass substrate and beam-splitting optics configured for directing light from the eyeglass substrate towards a viewer's eye and for allowing partial light from the real-world scene to arrive at a viewer's eye. The image optics may include one or more image optics lenses formed in the eyeglass substrate and may be positioned out of a line of sight of the viewer's eye when the viewer is wearing the augmented reality glasses. The image optics may be capable of coupling light from the display elements toward the beam-splitting optics along folded light paths caused by internal reflection within the eyeglass substrate.

Abstract: Some implementations of augmented reality glasses disclosed herein include an eyeglass substrate, two or more display elements, image optics configured for coupling light from the display elements into the eyeglass substrate and beam-splitting optics configured for directing light from the eyeglass substrate towards a viewer's eye and for allowing partial light from the real-world scene to arrive at a viewer's eye. The image optics may include one or more image optics lenses formed in the eyeglass substrate and may be positioned out of a line of sight of the viewer's eye when the viewer is wearing the augmented reality glasses. The image optics may be capable of coupling light from the display elements toward the beam-splitting optics along folded light paths caused by internal reflection within the eyeglass substrate.

Abstract: Various implementations described herein involve interferometric modulators (IMODs), which may be single-mirror IMODs (SMIs). Such IMODs may include an absorber stack and a mirror stack. The absorber stack and the mirror stack may define a gap therebetween and may be capable of being positioned in a plurality of positions relative to one another to form a plurality of gap heights. A hinge area may physically connect the mirror stack and an anchor area. Some such IMODs have hinge areas without any metal layer. However, the hinge area may be capable of forming an electrical connection with at least one metal layer of the mirror stack. For example, such IMODs may have a hinge area that includes a non-metal conductor.

Abstract: This disclosure provides methods and apparatus for wireless power transfer using an array of structures. Each of the structures can include a piezoelectric material portion and a magnetic material portion. Each of the magnetic material portions can respond to an alternating magnetic field generated by an external transmitter device, resulting in the structures oscillating and straining the corresponding piezoelectric material portions to generate electrical current.

Abstract: This disclosure provides systems, methods, and apparatus for electromechanical systems (EMS) devices with a plurality of electrically isolated electrode segments each connected to a distinct thin film transistor (TFT), where a plurality of TFTs drive the EMS device by applying a common voltage to the plurality of electrode segments. The plurality of TFTs can be configured to allow each electrode segment to have its own voltage during actuation. The EMS device can include a substrate, a stationary electrode over the substrate, and a movable electrode over the stationary electrode with a gap defined between the stationary electrode and the movable electrode. At least one of the stationary electrode and the movable electrode includes the plurality of electrode segments. The plurality of TFTs and the plurality of electrode segments can increase the stable range of the EMS device.

Abstract: This disclosure provides a display device that can achieve a neutral white color by combining a first tinted native white color produced by a first display element of the display device or a portion thereof with a second tinted native white color produced by a second display element of the display device or a portion of the first display element. The tint of the first tinted native white color and the second tinted native white color can be complementary to each other. The first tinted native white color and the second tinted native white color can be combined using spatial and/or temporal dithering.

Abstract: This disclosure provides display devices including at least one display element having a tinted native white color. The disclosure provides method of achieving the neutral white color by combining the tinted native white color produced by the at least one display element with a primary color that is complementary to the tint of the native white color using spatial and/or temporal dithering.

Abstract: This disclosure provides apparatus, systems and methods for an electromechanical systems (EMS) device having one or more flexible support posts. In one aspect, the EMS device includes a substrate, a stationary electrode over the substrate, one or more flexible support posts over the substrate, and a movable electrode over the stationary electrode and supported by the one or more flexible support posts. The movable electrode is configured to move across a gap between the movable electrode and the stationary electrode upon electrostatic actuation, where the one or more flexible support posts include a first organic material and can be configured to compress to permit the movable electrode to move across the gap.

Abstract: This disclosure provides systems, methods and apparatus for packaging an array of electromechanical systems (EMS) devices such as interferometric modulators (IMODs). In one aspect, a backplate including an aperture can be sealed to a substrate supporting an array of unreleased EMS devices to form a package. A release etch may be performed through the aperture after sealing the backplate to the substrate. By performing the release etch after sealing the backplate to the substrate, the effect on the array of EMS devices of the formation and outgassing of the sealant material can be reduced.

Abstract: Various implementations described herein involve interferometric modulators (IMODs), which may be single-mirror IMODs (SMIs). Such IMODs may include an absorber stack and a mirror stack. The absorber stack and the mirror stack may define a gap therebetween and may be capable of being positioned in a plurality of positions relative to one another to form a plurality of gap heights. A hinge area may physically connect the mirror stack and an anchor area. Some such IMODs have hinge areas without any metal layer. However, the hinge area may be capable of forming an electrical connection with at least one metal layer of the mirror stack. For example, such IMODs may have a hinge area that includes a non-metal conductor.

Abstract: This disclosure provides systems, methods and apparatus for fabricating thin film transistor (TFT) devices. In one aspect, a substrate having a source area, a drain area, and a channel area is provided. Metal cations are implanted in the oxide semiconductor layer overlying the source area and the drain area of the substrate. The metal cation implantation forms a doped n-type oxide semiconductor in the oxide semiconductor layer overlying the source area and the drain area of the substrate.

Abstract: This disclosure provides systems, methods and apparatus for forming electromechanical devices having a gap between a movable layer and a fixed layer. In one aspect, the movable layer may be supported by hinge structures, and the design of the hinge structure may be controlled to provide a desired amount of flexure, providing electromechanical devices with a desired gap height. The height of the gap may be larger than the thickness a sacrificial material used during the fabrication process. In another aspect, the design of the hinge structure may be used to control threshold voltages of electromechanical devices.

Abstract: This disclosure provides systems, methods and apparatus for forming light-guiding layers including embossed light-turning features. In one aspect, an aluminized polymer layer can be embossed onto a light-transmissive layer having a high index of refraction to form the light-guiding layer. In another aspect, the light-guiding layers may be formed using a mold that has positive relief features and features which mechanically separate a portion of an embossed reflective layer from surrounding portions of the embossed reflective layer to form light-turning features.

Abstract: This disclosure provides systems, methods, and apparatus related to electromechanical systems display devices. In one aspect, an apparatus includes a display assembly, a sensor, and a processor. The display assembly may include an array of electromechanical systems display devices. The sensor may be configured to provide a signal indicative of an illumination angle, a viewing angle, or both, with respect to a line perpendicular to the display assembly. The processor may be configured to receive the signal from the sensor, to determine the illumination angle and/or viewing angle, and to process image data to compensate for the determined illumination angle and/or viewing angle. In one implementation, the image data is processed to compensate for a shift in a wavelength of light reflected from at least one of the electromechanical systems display devices that would have occurred as a result of a non-normal illumination and/or viewing angle.

Abstract: Some implementations disclosed herein include an array of reflective pixels, each of the reflective pixels including an interferometric light modulator (IMOD), the array being configured as a honeycomb-like triaxial lattice. Each IMOD includes at least two conductive layers that define at least one cavity, at least one of the conductive layers being movable relative to the other through a range of positions and being hingedly supported by less than four support posts.