Patents by Inventor Talsuke Koroku

Talsuke Koroku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING WARPING IN A WAFER STATE AND MANUFACTURING METHOD THEREOF
    Publication number: 20100019371
    Abstract: In this manufacturing method of a semiconductor device, after a sealing film is applied over an entire surface of a semiconductor wafer and hardened, a second groove for forming a side-section protective film is formed in the sealing film and on the top surface side of the semiconductor wafer. In other words, the sealing film is formed in a state where a groove that causes strength reduction has not been formed on the top surface side of the semiconductor wafer. Since the second groove is formed on the top surface side of the semiconductor wafer after the sealing film is formed, the semiconductor wafer is less likely to warp when the sealing film, made of liquid resin, is hardened.
    Type: Application
    Filed: July 22, 2009
    Publication date: January 28, 2010
    Applicant: Casio Computer Co., Ltd.
    Inventors: Junji SHIOTA, Talsuke Koroku, Nobumitsu Fujii, Osamu Kuwabara, Osamu Okada