Abstract: Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness (preferably, further having excellent reflow heat resistance). The photosensitive resin composition includes components (A), (C), and (D) and preferably further includes a component (B) as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a hydroxyl-containing compound having a molecular weight of 500 or more; (C) a photo-cationic polymerization initiator; and (D) a light-shielding material.

Abstract: Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness. The present invention relates to a photosensitive resin composition that includes components as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a photo-cationic polymerization initiator including a cationic moiety and an anionic moiety containing a boron atom; and (C) a light-shielding material.

Abstract: Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness. The present invention relates to a photosensitive resin composition that includes components as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a photo-cationic polymerization initiator including a cationic moiety and an anionic moiety containing a boron atom; and (C) a light-shielding material.

Abstract: Provide is an oxetane-ring containing (meth) acrylic ester compound which can give, through polymerization, a cured article being highly flexible or thermally stable. The oxetane-ring-containing (meth) acrylic ester compound is represented by formula (1) below, in which R1 represents a hydrogen atom or an alkyl group; R2 represent a hydrogen atom or a methyl group; and “A” represent either a linear alkylene group represented by following formula (a1) or a branched-chain alkylene group represented by following formula (a2).

Abstract: Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness (preferably, further having excellent reflow heat resistance). The photosensitive resin composition includes components (A), (C), and (D) and preferably further includes a component (B) as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a hydroxyl-containing compound having a molecular weight of 500 or more; (C) a photo-cationic polymerization initiator; and (D) a light-shielding material.

Abstract: Provided is a novel oxetane-ring-containing (meth)acrylic ester compound which can give, through polymerization, a cured article being highly flexible or thermally stable. The oxetane-ring-containing (meth)acrylic ester compound is represented by formula (1) below, in which R1 represents a hydrogen atom or an alkyl group; R2 represents a hydrogen atom or a methyl group; and “A” represents either a linear alkylene group represented by following formula (a1) or a branched-chain alkylene group represented by following formula (a2).