Abstract: A wire bonding method for connecting a wire to two different surfaces by bonding with a single wire bonding step. The wire bonding method includes: bonding one end of a wire fed from a distal end of a capillary to a first bonding surface; moving the capillary in the Z direction; moving the capillary the X and/or Y direction; moving the capillary in the X, Y, and/or Z direction, a plurality of times; moving the capillary to a highest position; and bonding another end of the wire to the second bonding surface. The wire bonding method includes, at any timing, rotating the first bonding surface about a rotation axis to move the second bonding surface to a position capable of bonding. An angle formed by the first bonding surface and the second bonding surface on a side where the wire is stretched is 200° or more.

Abstract: A wire bonding method for connecting a wire to two different surfaces by bonding with a single wire bonding step. The wire bonding method includes: bonding one end of a wire fed from a distal end of a capillary to a first bonding surface; moving the capillary in the Z direction; moving the capillary the X and/or Y direction; moving the capillary in the X, Y, and/or Z direction, a plurality of times; moving the capillary to a highest position; and bonding another end of the wire to the second bonding surface. The wire bonding method includes, at any timing, rotating the first bonding surface about a rotation axis to move the second bonding surface to a position capable of bonding. An angle formed by the first bonding surface and the second bonding surface on a side where the wire is stretched is 200° or more.

Abstract: A wire bonding method, a bump forming method and a bump which are capable of preventing contact of a wire with a substrate or a conductive lead after the wire is bonded to a bump, and which are capable of preventing generation of bending in the wire during bonding of the wire to the bump are disclosed. When a first conductor and a second conductor are wire bonded, a bump is previously formed on the second conductor by ball bonding. An inclined surface is formed on an upper end of the bump by moving a capillary along a predetermined path to operate the capillary. First bonding of a wire to the first conductor is carried out, then the wire is looped from the first conductor to the bump, and second bonding of the wire onto the inclined surface of the bump is carried out.

Abstract: A wire bonding method, a bump forming method and a bump which are capable of preventing contact of a wire with a substrate or a conductive lead after the wire is bonded to a bump, and which are capable of preventing generation of bending in the wire during bonding of the wire to the bump are disclosed. When a first conductor and a second conductor are wire bonded, a bump is previously formed on the second conductor by ball bonding. An inclined surface is formed on an upper end of the bump by moving a capillary along a predetermined path to operate the capillary. First bonding of a wire to the first conductor is carried out, then the wire is looped from the first conductor to the bump, and second bonding of the wire onto the inclined surface of the bump is carried out.