Abstract: A processing method of a base material sheet includes winding out the base material sheet wound up by a first core and a first porous sheet wound up by a second core, winding up by a third core the base material sheet and the first porous sheet to be overlapped with each other, and processing the base material sheet by a first processing liquid held in the first porous sheet; and winding out the base material sheet and the first porous sheet overlappingly wound up by the third core, winding up the first porous sheet by the second core, and winding up the base material sheet by the first core.

Abstract: A processing method of a base material sheet includes winding out the base material sheet wound up by a first core and a first porous sheet wound up by a second core, winding up by a third core the base material sheet and the first porous sheet to be overlapped with each other, and processing the base material sheet by a first processing liquid held in the first porous sheet; and winding out the base material sheet and the first porous sheet overlappingly wound up by the third core, winding up the first porous sheet by the second core, and winding up the base material sheet by the first core.

Abstract: A processing method of a base material sheet includes winding out the base material sheet wound up by a first core and a first porous sheet wound up by a second core, winding up by a third core the base material sheet and the first porous sheet to be overlapped with each other, and processing the base material sheet by a first processing liquid held in the first porous sheet; and winding out the base material sheet and the first porous sheet overlappingly wound up by the third core, winding up the first porous sheet by the second core, and winding up the base material sheet by the first core.

Abstract: A processing method of a base material sheet includes winding out the base material sheet wound up by a first core and a first porous sheet wound up by a second core, winding up by a third core the base material sheet and the first porous sheet to be overlapped with each other, and processing the base material sheet by a first processing liquid held in the first porous sheet; and winding out the base material sheet and the first porous sheet overlappingly wound up by the third core, winding up the first porous sheet by the second core, and winding up the base material sheet by the first core.

Abstract: To provide a carrier film for a fuel cell production process which is excellent in a recycling property and sufficient handling property in the fuel cell production process. A carrier film for a fuel cell production process, which is made of a fluororesin and has a tensile elastic modulus of at least 1,500 MPa in the machine direction, as measured in accordance with ASTM D882, and a tensile modulus of at least 100 MPa in the machine direction at 150° C., and which preferably has a thickness of from 10 to 300 ?m.

Abstract: A process of sealing a semiconductor substrate by contacting the semiconductor substrate with a surface of a release layer (I) of a gas barrier release film that is in the form of a mold, which includes vacuum suction; injecting a sealing resin between the semiconductor substrate and the mold; and releasing said mold from said semiconductor substrate having said sealing resin present thereon, where the gas barrier release film has a release layer (I), which has excellent releasability; a plastic support layer (II) supporting the release layer; and a metal or a metal oxide gas restraint layer (III), present between the release layer and the support layer, where the gas barrier release film exhibits a xylene gas permeability of at most 5×10?15 (kmol m/(s·m2·kPa)) at 170° C., and a surface of said release layer (I) has an arithmetic surface roughness of from 0.15 to 3.5 ?m, exhibiting a satin-finish.

Abstract: To provide a mold release film for producing a light emitting diode by a mold, which is less susceptible to formation of pin holes or rupture and which is applicable to mass production of a light emitting diode by means of a mold having a plurality of cavities, and a process for producing a light emitting diode by means of such a mold release film. A mold release film to be disposed on the cavity surface of a mold to form a substantially hemispherical lens portion by encapsulating a light emitting element of a light emitting diode with an encapsulation resin, which release film has a thickness of from 16 to 175 ?m and a tensile rupture elongation of from 600 to 3,000% at 110° C. as measured in accordance with JIS K7127, and a process for producing a light emitting diode by means of such a mold release film.

Abstract: To provide a release film which does not need to be changed often for hot press and is easy to be changed; a releasable cushion material which can reduce the frequency of changing a cushion material main body; and a process for producing a printed board with good productivity and low cost.

Abstract: A process of sealing a semiconductor substrate by contacting the semiconductor substrate with a surface of a release layer (I) of a gas barrier release film that is in the form of a mold, which includes vacuum suction; injecting a sealing resin between the semiconductor substrate and the mold; and releasing said mold from said semiconductor substrate having said sealing resin present thereon, where the gas barrier release film has a release layer (I), which has excellent releasability; a plastic support layer (II) supporting the release layer; and a metal or a metal oxide gas restraint layer (III), present between the release layer and the support layer, where the gas barrier release film exhibits a xylene gas permeability of at most 5×10?15 (kmol m/(s·m2·kPa)) at 170° C., and a surface of said release layer (I) has an arithmetic surface roughness of from 0.15 to 3.5 ?m, exhibiting a satin-finish.

Abstract: To provide a carrier film for a fuel cell production process which is excellent in a recycling property and sufficient handling property in the fuel cell production process. A carrier film for a fuel cell production process, which is made of a fluororesin and has a tensile elastic modulus of at least 1,500 MPa in the machine direction, as measured in accordance with ASTM D882 and a tensile elastic modulus of at least 100 MPa in the machine direction at 150° C., and which preferably has a thickness of from 10 to 300 ?m.

Abstract: To provide a release film which has an extremely low gas permeability, an enormously small mold contamination by a mold resin and a high releasability. A gas barrier release film for semiconductor resin molds, comprising a release layer (I) having excellent releasability, a plastic support layer (II) supporting the release layer, and a gas restraint layer (III) made of a metal or a metal oxide, formed between the release layer and the support layer, and having a xylene gas permeability of at most 10?15 (kmol m/(s·m2·kPa)) at 170° C. The release layer (I) is preferably formed from a fluororesin such as an ethylene/tetrafluoroethylene copolymer, and a metal oxide layer is preferably a layer of an oxide such as an aluminum oxide, a silicon oxide or a magnesium oxide.

Abstract: To provide a release film which does not need to be changed often for hot press and is easy to be changed; a releasable cushion material which can reduce the frequency of changing a cushion material main body; and a process for producing a printed board with good productivity and low cost.