Abstract: A temperature indicating composition is provided for use on a recoverable article so that heating to produce recovery or to activate a heat-activatable sealant can be monitored. The composition comprises a thermochromic colorant in a binder that can be cured by UV radiation. Such a composition can be applied rapidly to polyolefin substrates by printing.

Abstract: A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.

Abstract: A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.

Abstract: A heat-recoverable soldering device comprises a heat-recoverable member containing a fusible solder insert, solder flux and a thermochromic composition which undergoes a visible change from a colored to a colorless state at the soldering temperature. Solderable substrates are positioned within the device and heat is applied until the soldering temperature has been reached, as indicated by a color change of the thermochromic composition. The soldering temperature is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Typically this temperature is at least about 20.degree. C. above the melting temperature of the solder.

Abstract: There is disclosed an ultrathin chemically resistant marking system. The system comprises at least one layer of a chemically resistant adhesive film and printed matter which together cooperate to form a marker. The adhesive film is made of a material selected from the group of polymers which adhere to a substrate upon the application of heat and which are resistant to caustic solutions and solvents, such as methylene chloride. The adhesive film has a chemically resistant front and rear surface and an adhesive rear surface for adhering to a substrate. One of the front or rear surfaces contains the printed matter. There is also disclosed a method for producing an ultrathin chemically resistant marking system.

Abstract: A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.

Abstract: A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.

Abstract: This invention provides novel thermochromic compositions which exhibit distinct color changes at temperatures in the range of about 165.degree. C. to about 240.degree. C. The compositions comprise basic copper carbonate and a sulfur compound. Paint formulations containing these novel thermochromic compositions or complexes of copper and sulfur-containing organic acids are also provided. The compositions are useful with heat-recoverable memory metal couplings to prevent overheating of the couplings during installation.